Optical defect inspection apparatus
    12.
    发明申请
    Optical defect inspection apparatus 审中-公开
    光学缺陷检查装置

    公开(公告)号:US20070211241A1

    公开(公告)日:2007-09-13

    申请号:US11709873

    申请日:2007-02-23

    IPC分类号: G01N21/88

    摘要: A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. The useful life of each plane mirror can be prolonged without displacing the optical axis itself by overcoming the problem that when the laser beam is employed as the light source and a thin beam with a high illumination density is illuminated to the same position on each of the first and second plane mirrors for a long time, the surface of the plane mirror is deteriorated, the reflectance is reduced, and the light quantity cannot be held at a required level.

    摘要翻译: 从激光源振荡的激光束在其路径中被第一和第二平面镜折叠并进入光束扩展器。 每个平面镜的表面由激光照射而劣化,反射率降低。 为了避免进入光束扩展器的激光束的光量减小到低于参考值,当在一定时间内照射激光束时,激光束被照亮的第一和第二平面镜中的每一个上的位置 通过用于在包括平面镜的平面上旋转和/或平移每个平面镜的反射表面的结构改变,同时光轴保持相同。 可以延长每个平面镜的使用寿命而不会使光轴本身移位,克服了当激光束被用作光源并且具有高照明密度的薄光束被照射到每个平面镜上的相同位置 第一和第二平面镜长时间,平面镜的表面劣化,反射率降低,并且光量不能保持在要求的水平。

    Wafer surface inspection apparatus and wafer surface inspection method
    13.
    发明授权
    Wafer surface inspection apparatus and wafer surface inspection method 有权
    晶圆表面检查仪和晶圆表面检测方法

    公开(公告)号:US08310667B2

    公开(公告)日:2012-11-13

    申请号:US12187041

    申请日:2008-08-06

    IPC分类号: G01N21/00

    摘要: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.

    摘要翻译: 高灵敏度的晶片表面检查方法和装置,并且在清洁度方面没有性能下降,外来颗粒的坐标重复性等。 将用于冷却的气体喷射到晶片表面上的激光照射位置,以防止异物的温度升高并且抑制异物的分解。

    Wafer surface inspection apparatus and wafer surface inspection method
    15.
    发明申请
    Wafer surface inspection apparatus and wafer surface inspection method 有权
    晶圆表面检查仪和晶圆表面检测方法

    公开(公告)号:US20070182957A1

    公开(公告)日:2007-08-09

    申请号:US11501922

    申请日:2006-08-10

    IPC分类号: G01N21/88

    摘要: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.

    摘要翻译: 高灵敏度的晶片表面检查方法和装置,并且在清洁度方面没有性能下降,外来颗粒的坐标重复性等。 将用于冷却的气体喷射到晶片表面上的激光照射位置,以防止异物的温度升高并且抑制异物的分解。