INSTRUMENTED ORTHOPAEDIC IMPLANT FOR IDENTIFYING A LANDMARK
    11.
    发明申请
    INSTRUMENTED ORTHOPAEDIC IMPLANT FOR IDENTIFYING A LANDMARK 有权
    用于识别地标的仪器化正确植入物

    公开(公告)号:US20100145337A1

    公开(公告)日:2010-06-10

    申请号:US12528253

    申请日:2007-02-28

    IPC分类号: A61B17/56

    摘要: A system (110, 150) for targeting a landmark (114, 160) is disclosed. The system includes an instrumented medical implant (112, 152), a control circuit (118, 153), a power supply (120, 157), and a landmark identifier (122, 154). The instrumented medical implant (112, 152) has one or more landmarks (114, 160) and each landmark (114, 160) has a corresponding coil (116, 162). The control circuit (118, 153) is electrically connected to the corresponding coil (116, 162), and the power supply (120, 157) is electrically connected to the control circuit (118,153). The landmark identifier (122, 154) has a magnetic sensor (124, 155) for sensing the corresponding coil (116, 162).

    摘要翻译: 公开了一种用于瞄准地标(114,160)的系统(110,150)。 该系统包括仪表化医疗植入物(112,152),控制电路(118,153),电源(120,157)和地标标识符(122,154)。 仪器化医疗植入物(112,152)具有一个或多个标志(114,160),并且每个标记(114,160)具有相应的线圈(116,162)。 控制电路(118,153)电连接到相应的线圈(116,162),并且电源(120,177)电连接到控制电路(118,153)。 地标标识符(122,154)具有用于感测对应线圈(116,162)的磁传感器(124,155)。

    Processing sensed accelerometer data for determination of bone healing
    13.
    发明授权
    Processing sensed accelerometer data for determination of bone healing 有权
    检测加速度计数据以确定骨愈合

    公开(公告)号:US09445720B2

    公开(公告)日:2016-09-20

    申请号:US12528243

    申请日:2007-02-23

    摘要: A system (800) for processing accelerometer data is disclosed. The system (800) includes an accelerometer (806), a first processor (810), a power supply (816), and a second processor (804). The accelerometer (806) measures a physiological acceleration parameter. The first processor (810) is operatively connected to the accelerometer (806). The first processor (810) is configured to receive the acceleration parameter from the accelerometer (806) and configured to output machine readable acceleration data. The machine readable acceleration data includes time domain accelerometer data. The power supply (816) is electrically connected to the first processor (810). The second processor (804) is configured to receive the machine readable acceleration data and transform the time domain accelerometer data into frequency domain accelerometer data. The frequency domain accelerometer data may be used to estimate patient healing status.

    摘要翻译: 公开了一种用于处理加速度计数据的系统(800)。 系统(800)包括加速度计(806),第一处理器(810),电源(816)和第二处理器(804)。 加速度计(806)测量生理加速度参数。 第一处理器(810)可操作地连接到加速度计(806)。 第一处理器(810)被配置为从加速度计(806)接收加速度参数并被配置为输出机器可读加速度数据。 机读加速度数据包括时域加速度计数据。 电源(816)电连接到第一处理器(810)。 第二处理器(804)被配置为接收机读加速度数据,并将时域加速度计数据变换成频域加速度计数据。 频域加速度计数据可用于估计患者愈合状态。

    Low temperature encapsulate welding
    14.
    发明授权
    Low temperature encapsulate welding 有权
    低温封装焊接

    公开(公告)号:US08704124B2

    公开(公告)日:2014-04-22

    申请号:US13146988

    申请日:2010-01-29

    IPC分类号: B23K26/00

    摘要: A load-bearing medical implant is disclosed that includes a load-bearing structure with a cavity extending into the outer surface of the structure. The cavity accommodates a sensor that is held in a fixed position within the cavity by an encapsulant. The cavity is covered by a plate that is welded over the cavity in close proximity to the sensor and encapsulant to provide a seal over the cavity and the electronic component without causing thermal damage to the encapsulant or sensor despite the close proximity of the encapsulant and sensor to the welded areas of the plate and structure. Methods for encapsulating the sensor in the cavity, methods for encapsulating a wire bus leading from the sensor through a channel in the implant and methods for pulsed laser welding of weld plate over the sensor and encapsulant with thermal damage to either are disclosed.

    摘要翻译: 公开了一种承载医疗植入物,其包括具有延伸到结构的外表面中的空腔的承载结构。 空腔容纳通过密封剂保持在腔内的固定位置的传感器。 空腔被一个板覆盖,该板被紧密地接触传感器和密封剂焊接在空腔上,以在空腔和电子部件上提供密封,而不会对密封剂或传感器造成热损伤,尽管密封剂和传感器 到板和结构的焊接区域。 用于将传感器封装在空腔中的方法,用于将从传感器引出的有线总线封装在植入物中的通道的方法和用于焊接板在传感器上的脉冲激光焊接和具有热损伤的密封剂的方法被公开。

    LOW TEMPERATURE ENCAPSULATE WELDING
    15.
    发明申请
    LOW TEMPERATURE ENCAPSULATE WELDING 有权
    低温封装焊接

    公开(公告)号:US20120010709A1

    公开(公告)日:2012-01-12

    申请号:US13146988

    申请日:2010-01-29

    IPC分类号: A61F2/28 H05K13/00

    摘要: A load-bearing medical implant is disclosed that includes a load-bearing structure with a cavity extending into the outer surface of the structure. The cavity accommodates a sensor that is held in a fixed position within the cavity by an encapsulant. The cavity is covered by a plate that is welded over the cavity in close proximity to the sensor and encapsulant to provide a seal over the cavity and the electronic component without causing thermal damage to the encapsulant or sensor despite the close proximity of the encapsulant and sensor to the welded areas of the plate and structure. Methods for encapsulating the sensor in the cavity, methods for encapsulating a wire bus leading from the sensor through a channel in the implant and methods for pulsed laser welding of weld plate over the sensor and encapsulant with thermal damage to either are disclosed.

    摘要翻译: 公开了一种承载医疗植入物,其包括具有延伸到结构的外表面中的空腔的承载结构。 空腔容纳通过密封剂保持在腔内的固定位置的传感器。 空腔被一个板覆盖,该板被紧密地接触传感器和密封剂焊接在空腔上,以在空腔和电子部件上提供密封,而不会对密封剂或传感器造成热损伤,尽管密封剂和传感器 到板和结构的焊接区域。 用于将传感器封装在空腔中的方法,用于将从传感器引出的有线总线封装在植入物中的通道的方法和用于焊接板在传感器上的脉冲激光焊接和具有热损伤的密封剂的方法被公开。