公开(公告)号：US11223117B2

公开(公告)日：2022-01-11

申请号：US16044154

申请日：2018-07-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Chia-Chu Lai ,  Ying-Wei Lu

IPC: H01Q1/52 ,  H01Q1/38 ,  H01Q1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/66

Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.

公开(公告)号：US20210123962A1

公开(公告)日：2021-04-29

申请号：US16723233

申请日：2019-12-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuang-Sheng Wang ,  Hsinjou Lin ,  Shao-Meng Sim ,  Mao-Hua Yeh

IPC: G01R29/10 ,  H04B17/29

Abstract: Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder. The cylinder is disposed in the perforation to act as a cavity for the antenna testing process. Therefore, only the cylinder needs to be replaced when the antenna testing process is performed on different devices under test, with the whole testing head intact.

公开(公告)号：US10823776B2

公开(公告)日：2020-11-03

申请号：US16408389

申请日：2019-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Cheng-Tsai Hsieh ,  Kuan-Ta Chen ,  Ying-Wei Lu

IPC: G01R29/10 ,  H04B17/29 ,  H01Q3/26 ,  H04B17/10

Abstract: A testing fixture used in an antenna testing process is provided. A cover unit having a second antenna portion is arranged on a base unit configured for an electronic structure having a first antenna portion to be placed thereon. The cover unit includes a non-metal interposing portion configured for pressing the electronic structure to separate the second antenna portion from the first antenna portion. Therefore, when the antenna testing process is performed on the electronic structure, a metal shielding effect is avoided, and an over the air testing environment is provided.

公开(公告)号：US10659097B1

公开(公告)日：2020-05-19

申请号：US16534634

申请日：2019-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Ying-Wei Lu ,  Chia-Chu Lai ,  Cheng-Tsai Hsieh

IPC: H04B17/00 ,  H04B1/48 ,  H04B1/04 ,  G01S13/32 ,  G01S13/40 ,  H04B1/7085

Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.

公开(公告)号：US20190139913A1

公开(公告)日：2019-05-09

申请号：US15969199

申请日：2018-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Ying-Wei Lu

IPC: H01L23/66 ,  H01Q9/04 ,  H01Q1/38 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, an antenna length can be designed according to the requirement of antenna operation, without increasing the area of the package structure.