摘要:
A fluid-jet printhead has a substrate having at least one layer defining a fluid chamber for ejecting fluid. The printhead also includes a resistive layer disposed between the fluid chamber and the substrate wherein the fluid chamber has a smooth planer surface between the fluid chamber and the substrate. The printhead has a conductive layer disposed between the resistive layer and the substrate wherein the conductive layer and the resistive layer are in direct parallel contact. The conductive layer forms at least one void creating a planar resistor in the resistive layer. The planar resistor is aligned with the fluid chamber.
摘要:
A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.
摘要:
A fluid-jet printhead has a substrate having at least one layer defining a fluid chamber for ejecting fluid. The printhead also includes a resistive layer disposed between the fluid chamber and the substrate wherein the fluid chamber has a smooth planer surface between the fluid chamber and the substrate. The printhead has a conductive layer disposed between the resistive layer and the substrate wherein the conductive layer and the resistive layer are in direct parallel contact. The conductive layer forms at least one void creating a planar resistor in the resistive layer. The planar resistor is aligned with the fluid chamber.
摘要:
A highly-efficient thermal inkjet printhead. The printhead includes a primary layer of polycrystalline silicon (preferably doped) having at least one portion thereof which functions as an ink expulsion resistor. Positioned over and above the primary layer is a secondary layer of material having at least one section produced from a selected metal silicide compound and at least another section fabricated from undoped polycrystalline silicon. The metal silicide-containing section functions as an interconnect structure and is operatively connected to the resistor in the primary layer (which is positioned beneath the secondary layer). The undoped polycrystalline silicon section is at least partially aligned over and above the resistor. As a result, the resistor is “buried” beneath the secondary layer and the various portions thereof. This system provides improved reliability, greater dimensional simplicity, optimized electrical/thermal properties, and superior versatility.