公开(公告)号：US20190096888A1

公开(公告)日：2019-03-28

申请号：US15874618

申请日：2018-01-18

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chung-Ting KO ,  Jr-Hung LI ,  Chi On CHUI

IPC分类号： H01L27/092 ,  H01L21/768 ,  H01L21/02 ,  H01L21/762 ,  H01L29/423 ,  H01L29/66

摘要： Methods of forming a differential layer, such as a Contact Etch Stop Layer (CESL), in a semiconductor device are described herein, along with structures formed by the methods. In an embodiment, a structure includes an active area on a substrate, a gate structure over the active area, a gate spacer along a sidewall of the gate structure, and a differential etch stop layer. The differential etch stop layer has a first portion along a sidewall of the gate spacer and has a second portion over an upper surface of the source/drain region. A first thickness of the first portion is in a direction perpendicular to the sidewall of the gate spacer, and a second thickness of the second portion is in a direction perpendicular to the upper surface of the source/drain region. The second thickness is greater than the first thickness.

公开(公告)号：US20170342561A1

公开(公告)日：2017-11-30

申请号：US15169037

申请日：2016-05-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Kun-Mo LIN ,  Yi-Hung LIN ,  Jr-Hung LI ,  Tze-Liang LEE ,  Ting-Gang CHEN ,  Chung-Ting KO

IPC分类号： C23C16/455 ,  H01L21/687 ,  C23C16/509 ,  H01J37/32 ,  H01L21/285 ,  H01L21/02

摘要： A system and method for plasma enhanced deposition processes. An exemplary semiconductor manufacturing system includes a susceptor configured to hold a semiconductor wafer and a sector disposed above the susceptor. The sector includes a first plate and an overlying second plate, operable to form a plasma there between. The first plate includes a plurality of holes extending through the first plate, which vary in at least one of diameter and density from a first region of the first plate to a second region of the first plate.