公开(公告)号：US20230022189A1

公开(公告)日：2023-01-26

申请号：US17866837

申请日：2022-07-18

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

Abstract: In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.

公开(公告)号：US20220189682A1

公开(公告)日：2022-06-16

申请号：US17545629

申请日：2021-12-08

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Masazumi ARATA

IPC: H01F27/29 ,  H01F27/32 ,  H01F17/04

Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

公开(公告)号：US20210166858A1

公开(公告)日：2021-06-03

申请号：US17108023

申请日：2020-12-01

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Masazumi ARATA ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

公开(公告)号：US20200303116A1

公开(公告)日：2020-09-24

申请号：US16811610

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/18

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20230066655A1

公开(公告)日：2023-03-02

申请号：US17892939

申请日：2022-08-22

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Manabu OHTA ,  Kenei ONUMA

IPC: H01F27/29 ,  H01F27/32

Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.

公开(公告)号：US20230063602A1

公开(公告)日：2023-03-02

申请号：US17898729

申请日：2022-08-30

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F1/14 ,  H01F5/06 ,  H01F5/04

Abstract: In the coil component, the coupling coefficient can be adjusted by the magnetic sheet and the insulator interposed between the pair of coils. For example, by increasing the magnetic permeability of the magnetic sheet so that the magnetic flux generated in the coil easily passes through the magnetic sheet, the coupling coefficient decreases. In the coil component, the coupling coefficient can be adjusted while the thickness of the element body is suppressed.

公开(公告)号：US20230023284A1

公开(公告)日：2023-01-26

申请号：US17867361

申请日：2022-07-18

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/02

Abstract: In a coil component, fixing strength of an external terminal is improved. In the coil component, on the end face of the element body, the center position of the external terminal electrode in the first direction is biased toward the center position of the end face with respect to the center position of the outer end portion. Therefore, the fixing area between the external terminal electrode and the element body is increased on the center position side of the end face, and thus fixing strength between the external terminal electrode and the element body is improved.

公开(公告)号：US20230022095A1

公开(公告)日：2023-01-26

申请号：US17866860

申请日：2022-07-18

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29 ,  H01F27/02

Abstract: In a coil component, coupling coefficient is improved. In the coil component, the coupling position between the outer end portion of the first planar coil and the first lead-out portion is biased toward the second lead-out portion with respect to the center line of the first lead-out portion, whereby the length of the second planar coil not alongside with the outermost turn of the first planar coil is shortened. By shortening the length of the second planar coil, the coupling coefficient between the first coil portion and the second coil portion is increased.

公开(公告)号：US20220415566A1

公开(公告)日：2022-12-29

申请号：US17845003

申请日：2022-06-21

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Manabu OHTA ,  Kenei ONUMA

IPC: H01F27/29 ,  H01F27/255

Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

公开(公告)号：US20210151248A1

公开(公告)日：2021-05-20

申请号：US17094433

申请日：2020-11-10

Applicant: TDK CORPORATION

Inventor： Hitoshi OHKUBO ,  Kenei ONUMA ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/29

Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.