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    Coil component
    12.
    发明授权
    Coil component 有权
    线圈组件

    公开(公告)号：US09142343B2

    公开(公告)日：2015-09-22

    申请号：US13935442

    申请日：2013-07-03

    Applicant: TDK Corporation

    Inventor： Hitoshi Ohkubo ,  Tomokazu Ito ,  Hideto Itoh ,  Yoshihiro Maeda ,  Manabu Ohta ,  Yuuya Kaname ,  Takahiro Kawahara

    IPC: H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/02 ,  H01F27/255

    CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/255 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0073 ,  H01F2027/2809

    Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.

    Abstract translation: 线圈部件1包括基板2，形成在基板2的顶面2t上的平面状螺旋导体10a，与平面螺旋导体10a的外周端连接的引出导体11a， 基板2的上表面和平面螺旋导体10a的最外侧的一侧和基板2的端部2X2之间，并且与同一平面内的另一个导体没有电连接，与顶部平行布置的外部电极26a和26b 基板2的表面以及形成在引线导体11a的表面上的突起电极25a，并将引线导体11a与外部电极26a连接起来。 外部端子26a和26b具有比用于确保接合强度的凸块电极15a和15b更大的面积。

    Coil component
    13.
    发明授权
    Coil component 有权

    公开(公告)号：US11894174B2

    公开(公告)日：2024-02-06

    申请号：US17093808

    申请日：2020-11-10

    Applicant: TDK CORPORATION

    Inventor： Hitoshi Ohkubo ,  Manabu Ohta ,  Ryo Fukuoka ,  Hironori Kimata

    IPC: H01F27/28 ,  H01F17/04

    CPC classification number: H01F17/04 ,  H01F27/2804 ,  H01F2017/048

    Abstract: In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3≤h1/h2≤10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.

    Coil component
    15.
    发明授权
    Coil component 有权
    线圈组件

    公开(公告)号：US09349522B2

    公开(公告)日：2016-05-24

    申请号：US14831761

    申请日：2015-08-20

    Applicant: TDK Corporation

    Inventor： Hitoshi Ohkubo ,  Tomokazu Ito ,  Hideto Itoh ,  Yoshihiro Maeda ,  Manabu Ohta ,  Yuuya Kaname ,  Takahiro Kawahara ,  Takashi Nakagawa

    IPC: H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/02 ,  H01F27/255

    CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/255 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0073 ,  H01F2027/2809

    Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

    Abstract translation: 线圈部件包括基板，形成在基板的上表面的平面螺旋导体，与平面螺旋导体的外周端连接的引线导体，形成在基板的上表面之间的最外侧 平面螺旋导体和基板的端部的转动，并且与同一平面内的另一个导体和外部电极的电连接没有电连接，并且与基板的顶表面平行布置，并且凸起电极形成在基板的表面上 引线导体，并将引线导体与外部电极连接。 外部端子具有比用于确保接合强度的凸块电极更大的面积。

    COIL COMPONENT AND MAGNETIC METAL POWDER CONTAINING RESIN USED THEREFOR
    16.
    发明申请
    COIL COMPONENT AND MAGNETIC METAL POWDER CONTAINING RESIN USED THEREFOR 有权
    包含树脂的线圈组件和磁性金属粉末

    公开(公告)号：US20140077914A1

    公开(公告)日：2014-03-20

    申请号：US14018293

    申请日：2013-09-04

    Applicant: TDK Corporation

    Inventor： Hitoshi Ohkubo ,  Kyohei Tonoyama ,  Makoto Morita ,  Tomokazu Ito ,  Hideto Itoh ,  Yoshihiro Maeda ,  Manabu Ohta ,  Yuuya Kaname ,  Takahiro Kawahara

    IPC: H01F5/00 ,  H01F1/06

    CPC classification number: H01F5/00 ,  H01F1/06 ,  H01F1/26 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0066 ,  H01F2027/2809

    Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 μm or more and 100 μm or less. The third average grain diameter is 2 μm or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

    Abstract translation: 线圈部件1设置有线圈导体10a，10b和覆盖线圈导体10a，10b的含有树脂22（22a，22b）的磁性金属粉末。 含有磁性金属粉末的树脂22包括具有第一平均粒径的第一金属粉末，具有小于第一平均粒径的第二平均粒径的第二金属粉末和具有比第一平均粒径小的第三平均粒径的第三金属粉末 比第二平均粒径。 第一平均粒径为15μm以上且100μm以下。 第三平均粒径为2μm以下。 第一种金属粉末主要含有坡莫合金，第二和第三种金属粉末主要含有羰基铁。

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