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公开(公告)号：US11557427B2
公开(公告)日：2023-01-17
申请号：US16733293
申请日：2020-01-03
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Yuuya Kaname , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
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公开(公告)号：US10559417B2
公开(公告)日：2020-02-11
申请号：US15166519
申请日：2016-05-27
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Yuuya Kaname , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
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公开(公告)号：US10210974B2
公开(公告)日：2019-02-19
申请号：US14952028
申请日：2015-11-25
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Shou Kawadahara , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
Abstract: In a coil component (planar coil element), at least part of a third metal magnetic powder constituting a metal magnetic powder and having a minimum average grain diameter is uncoated, which suppresses a reduction in magnetic permeability. On the other hand, the remaining metal powders are coated with glass, which improves the insulating properties of a metal magnetic powder-containing resin and reduces core loss.
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公开(公告)号：US10998130B2
公开(公告)日：2021-05-04
申请号：US16555169
申请日：2019-08-29
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Shou Kawadahara , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
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公开(公告)号：US10468184B2
公开(公告)日：2019-11-05
申请号：US14951004
申请日：2015-11-24
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Shou Kawadahara , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
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Patent Agency Ranking
公开(公告)号：US11894177B2
公开(公告)日：2024-02-06
申请号：US18119473
申请日：2023-03-09
Applicant: TDK CORPORATION
Inventor： Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US08975997B2
公开(公告)日：2015-03-10
申请号：US13847079
申请日：2013-03-19
Applicant: TDK Corporation
Inventor： Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hitoshi Ohkubo , Manabu Ohta , Yoshihiro Maeda , Yuuya Kaname , Hideharu Moro
CPC classification number: H01F27/255 , H01F17/0013 , H01F27/292 , H01F2017/048
Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.
Abstract translation: 在平面线圈元件中，设置在线圈单元的通孔中的含金属磁性粉末的树脂中包含的第一金属磁粉的倾斜粒子与总粒子的定量比高于倾斜粒子与总体的定量比 除了通孔以外的金属磁性粉末的树脂中含有的第一金属磁性粉末的颗粒，磁芯中的第一金属磁性粉末的许多颗粒是倾斜的，其长轴相对于 厚度方向和基板的平面方向。 因此，与图1所示的平面线圈元件相比，平面线圈元件具有改善的强度。 与图9A所示的平面线圈元件相比，磁导率提高。 9B。
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公开(公告)号：US20240331933A1
公开(公告)日：2024-10-03
申请号：US18618231
申请日：2024-03-27
Applicant: TDK Corporation
Inventor： Hokuto EDA , Takahiro Nemoto , Manabu Ohta , Ryo Fukuoka , Masazumi Arata , Hitoshi Ohkubo
CPC classification number: H01F27/324 , H01F5/06
Abstract: In the coil component, the edge of the aperture of the protection film covering the coil from the lower surface side of the element body does not extend in the same plane. In this case, even if a crack occurs in the joint region between the coil and the bump electrode, the crack is less likely to cross the joint region as compared with the case where the edge extends in the same plane. Therefore, in the coil component, the crack is effectively suppressed.
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公开(公告)号：US11810708B2
公开(公告)日：2023-11-07
申请号：US18119457
申请日：2023-03-09
Applicant: TDK CORPORATION
Inventor： Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US10147540B2
公开(公告)日：2018-12-04
申请号：US13848441
申请日：2013-03-21
Applicant: TDK CORPORATION
Inventor： Kyohei Tonoyama , Makoto Morita , Tomokazu Ito , Hitoshi Ohkubo , Manabu Ohta , Yoshihiro Maeda , Yuuya Kaname , Hideharu Moro
Abstract: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.
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