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公开(公告)号：US20240331905A1
公开(公告)日：2024-10-03
申请号：US18617849
申请日：2024-03-27
Applicant: TDK Corporation
Inventor： Manabu OHTA , Ryo Fukuoka , Yuji Matsuura , Hokuto Eda , Takahiro Nemoto , Kenei Onuma , Masazumi Arata , Hitoshi Ohkubo
CPC classification number: H01F5/04 , H01F27/292
Abstract: In the coil component, the terminal electrode enters an aperture of the element body and is jointed with the bump electrode inside the element body. That is, the terminal electrode is in contact with both the bump electrode and the element body. Therefore, as compared with the case where the bump electrode is exposed to the lower surface of the element body, a joint surface of the terminal electrode is enlarged, and high adhesion of the terminal electrode is realized.
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公开(公告)号：US11810708B2
公开(公告)日：2023-11-07
申请号：US18119457
申请日：2023-03-09
Applicant: TDK CORPORATION
Inventor： Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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Patent Agency Ranking
公开(公告)号：US11631529B2
公开(公告)日：2023-04-18
申请号：US16811610
申请日：2020-03-06
Applicant: TDK CORPORATION
Inventor： Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US11894177B2
公开(公告)日：2024-02-06
申请号：US18119473
申请日：2023-03-09
Applicant: TDK CORPORATION
Inventor： Takahiro Kawahara , Manabu Ohta , Kenei Onuma , Yuuya Kaname , Ryo Fukuoka , Hokuto Eda , Masataro Saito , Kohei Takahashi
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/041 , H05K1/181 , H01F2017/048
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US11521791B2
公开(公告)日：2022-12-06
申请号：US16877831
申请日：2020-05-19
Applicant: TDK CORPORATION
Inventor： Kenei Onuma , Masazumi Arata , Hitoshi Ohkubo
Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.
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公开(公告)号：US12087497B2
公开(公告)日：2024-09-10
申请号：US17094433
申请日：2020-11-10
Applicant: TDK CORPORATION
Inventor： Hitoshi Ohkubo , Kenei Onuma , Masazumi Arata , Masataro Saito , Kohei Takahashi
IPC: H01F5/00 , H01F27/28 , H01F27/29 , H01F27/32 , H01F27/255
CPC classification number: H01F27/323 , H01F27/2804 , H01F27/29 , H01F27/255 , H01F2027/2809
Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.
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公开(公告)号：US11569024B2
公开(公告)日：2023-01-31
申请号：US16877831
申请日：2020-05-19
Applicant: TDK CORPORATION
Inventor： Kenei Onuma , Masazumi Arata , Hitoshi Ohkubo
Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.
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