公开(公告)号：US20240312687A1

公开(公告)日：2024-09-19

申请号：US18599410

申请日：2024-03-08

Applicant: TDK CORPORATION

Inventor： Takahiro Yata ,  Masashi Shimoyasu ,  Masataka Yamamoto ,  Hiroyuki Abe ,  Daiki Saito ,  Akihiko Oide

IPC: H01F17/00 ,  H01F17/04

CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F2017/0073

Abstract: A multilayer inductor includes: an element body having a pair of end surfaces facing each other, and a side surface extending in a facing direction of the pair of end surfaces in such a way as to connect the pair of end surfaces; and a through conductor disposed inside the element body and extending in the facing direction. The element body includes a first portion surrounding the through conductor and a second portion positioned outward of the first portion, when viewed in the facing direction. The first portion is disposed spaced from the side surface. The first portion and the second portion have different magnetic permeabilities from each other.

公开(公告)号：US11631521B2

公开(公告)日：2023-04-18

申请号：US16396913

申请日：2019-04-29

Applicant: TDK CORPORATION

Inventor： Yoji Tozawa ,  Takuo Abe ,  Yuma Ishikawa ,  Hidekazu Sato ,  Takashi Endo ,  Masashi Shimoyasu ,  Kazuma Takahashi

IPC: H01F27/28 ,  H03H1/00 ,  H03H7/09 ,  H01F41/04 ,  H01F27/29

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.