公开(公告)号：US20150372645A1

公开(公告)日：2015-12-24

申请号：US14312239

申请日：2014-06-23

Applicant: Texas Instruments Incorporated

Inventor： Aritra Banerjee ,  Joonhoi Hur ,  Baher Haroun ,  Nathan Richard Schemm ,  Rahmi Hezar ,  Lei Ding

IPC: H03F1/02 ,  H03F3/217 ,  H03F3/21 ,  H03F3/193

CPC classification number: H03F1/0205 ,  H03F1/0294 ,  H03F3/193 ,  H03F3/211 ,  H03F3/217 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/2176 ,  H03F3/45179 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2203/21139 ,  H03F2203/21142

Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.

Abstract translation: 外相放大器包括具有耦合到第一导体（31-1）的输出的第一E类功率放大器（16-1）和接收第一RF驱动信号（S1（t））的输入。 第一电抗元件（CA-1）耦合在第一导体和第二导体（30-1）之间。 第二电抗元件（LA-1）耦合在第二导体和第三导体（32-1）之间。 第二类E功率放大器（17-1）包括耦合到第四导体（31-2）的输出和耦合到第二RF驱动信号（S2（t））的输入，第三反应元件（CA-3 ）耦合在第二和第四导体之间。 第一和第二功率放大器的输出由第一，第二和第三无功元件组合以在负载（R）中产生输出电流。 效率增强电路（LEEC-1）耦合在第一和第四导体之间，以提高退避功率电平的功率效率。 功率增强电路（20-1,2）分别耦合到第一和第四导体。

公开(公告)号：US10666204B2

公开(公告)日：2020-05-26

申请号：US16173830

申请日：2018-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Aritra Banerjee ,  Nathan R. Schemm ,  Rahmi Hezar ,  Lei Ding ,  Baher Haroun

IPC: H03F3/191 ,  H03F1/42 ,  H03F1/02 ,  H03F3/19 ,  H03F3/21 ,  B81B7/02 ,  H03F1/22 ,  H03F3/195 ,  H03F3/24 ,  H03F1/56 ,  H03F3/193 ,  H01L23/66 ,  H01G5/16 ,  H01G5/38 ,  H01G5/40

Abstract: A circuit includes an amplifier to amplify an input signal and generate an output signal. The circuit also includes a tuning network to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, which includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure over a control structure, which is to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.

公开(公告)号：US20190173438A1

公开(公告)日：2019-06-06

申请号：US16259100

申请日：2019-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Aritra Banerjee ,  Rahmi Hezar ,  Lei Ding ,  Nathan Richard Schemm

IPC: H03F3/193 ,  H03F3/24 ,  H03F3/72 ,  H03F1/02 ,  H03F1/22 ,  H03F3/21

Abstract: A first branch group circuit includes a first branch circuit receiving a first RF input signal and first control information; and a second branch circuit receiving the first input signal and second control information. Each of the first and second branch circuits includes a power amplifier. The second control information enables the second branch circuit to be switched on or off while the first branch circuit remains on. A second branch group circuit includes: a third branch circuit receiving a second RF input signal and third control information; and a fourth branch circuit receiving the second input signal and fourth control information. Each of the third and fourth branch circuits includes a power amplifier. The fourth control information enables the fourth branch circuit to be switched on or off while the third branch circuit remains on. A combiner combines output signals of the power amplifiers to produce an output signal.

公开(公告)号：US20190068135A1

公开(公告)日：2019-02-28

申请号：US16173830

申请日：2018-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Aritra Banerjee ,  Nathan R. Schemm ,  Rahmi Hezar ,  Lei Ding ,  Baher Haroun

IPC: H03F1/42 ,  H03F1/56 ,  B81B7/02 ,  H03F3/21 ,  H03F3/19 ,  H03F1/02 ,  H01L23/66

CPC classification number: H03F1/42 ,  B81B7/02 ,  B81B2207/99 ,  H01G5/16 ,  H01G5/38 ,  H01G5/40 ,  H01L23/66 ,  H01L2223/6655 ,  H03F1/0205 ,  H03F1/0294 ,  H03F1/223 ,  H03F1/565 ,  H03F3/19 ,  H03F3/193 ,  H03F3/195 ,  H03F3/21 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/111 ,  H03F2200/378 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2200/546 ,  H03F2203/21157

Abstract: A circuit includes an amplifier to amplify an input signal and generate an output signal. The circuit also includes a tuning network to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, which includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure over a control structure, which is to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.

公开(公告)号：US20180006609A1

公开(公告)日：2018-01-04

申请号：US15708168

申请日：2017-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Aritra Banerjee ,  Joonhoi Hur ,  Baher Haroun ,  Nathan Richard Schemm ,  Rahmi Hezar ,  Lei Ding

IPC: H03F1/02 ,  H03F3/45 ,  H03F3/21 ,  H03F3/217 ,  H03F3/193

CPC classification number: H03F1/0205 ,  H03F1/0294 ,  H03F3/193 ,  H03F3/211 ,  H03F3/217 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/2176 ,  H03F3/45179 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2203/21139 ,  H03F2203/21142

Abstract: An outphasing amplifier includes a first class-E power amplifier having an output coupled to a first conductor and an input receiving a first RF drive signal. A first reactive element is coupled between the first conductor and a second conductor. A second reactive element is coupled between the second conductor and a third conductor. A second class-E power amplifier includes an output coupled to a fourth conductor and an input coupled to a second RF drive signal, a third reactive element coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load. An efficiency enhancement circuit is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits are coupled to the first and fourth conductors, respectively.

公开(公告)号：US20160043698A1

公开(公告)日：2016-02-11

申请号：US14452365

申请日：2014-08-05

Applicant: Texas Instruments Incorporated

Inventor： Aritra Banerjee ,  Nathan R. Schemm ,  Rahmi Hezar ,  Lei Ding ,  Baher Haroun

IPC: H03F1/42 ,  B81B7/02 ,  H03F3/21 ,  H03F1/02 ,  H03F3/19

CPC classification number: H03F1/42 ,  B81B7/02 ,  B81B2207/99 ,  H01G5/16 ,  H01G5/38 ,  H01G5/40 ,  H01L23/66 ,  H01L2223/6655 ,  H03F1/0205 ,  H03F1/0294 ,  H03F1/223 ,  H03F1/565 ,  H03F3/19 ,  H03F3/193 ,  H03F3/195 ,  H03F3/21 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/111 ,  H03F2200/378 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2200/546 ,  H03F2203/21157

Abstract: A circuit includes an amplifier configured to amplify an input signal and generate an output signal. The circuit also includes a tuning network configured to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, where the at least one tunable capacitor includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure disposed over a control structure, where the control structure is configured to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.

Abstract translation: 电路包括被配置为放大输入信号并产生输出信号的放大器。 电路还包括配置成调节放大器的频率响应的调谐网络。 调谐网络包括至少一个可调谐电容器，其中至少一个可调电容器包括至少一个微机电系统（MEMS）电容器。 放大器可以包括第一管芯，所述至少一个MEMS电容器可以包括第二管芯，并且第一管芯和第二管芯可以集成在单个封装中。 所述至少一个MEMS电容器可以包括设置在控制结构上的MEMS超结构，其中所述控制结构被配置为控制所述MEMS超结构并调谐所述至少一个MEMS电容器的电容。