Induction forming and curing of thermoset composite charges

    公开(公告)号:US11541575B2

    公开(公告)日:2023-01-03

    申请号:US17026066

    申请日:2020-09-18

    Abstract: A first tooling die and a second tooling die are movable with respect to each other. The first tooling die and the second tooling die form a die cavity. The first tooling die and the second tooling die comprise a plurality of stacked metal sheets. A plurality of air gaps is defined between adjacent stacked metal sheets. A first smart susceptor material is within the die cavity and connected to the first tooling die. The first smart susceptor material has a first Curie temperature. A second smart susceptor material is within the die cavity and associated with the second tooling die. The second smart susceptor material has a second Curie temperature lower than the first Curie temperature. A flexible membrane is between the second tooling die and the first smart susceptor material. The flexible membrane is configured to receive pressure.

    Smart susceptor induction heating apparatus and methods having improved temperature control

    公开(公告)号:US11485053B2

    公开(公告)日:2022-11-01

    申请号:US16201612

    申请日:2018-11-27

    Abstract: Heating apparatus and methods for thermally processing a part including improved control of temperature. A thermal management system is coupled to a back surface of a table thermally coupled to an inductive heating circuit. The thermal management system includes a chamber defining an interior space, at least one cooling fin disposed within the chamber, an inlet extending through the chamber and fluidly communicating with the interior space, and an outlet extending through the chamber and fluidly communicating with the interior space. In some applications, an air source fluidly communicates with the inlet and is selectively operable to generate an air flow through the chamber, so that the thermal management system may be selectively operated in an insulator mode and a cooling mode.

    Heating Circuit Layout For Smart Susceptor Induction Heating Apparatus

    公开(公告)号:US20200170080A1

    公开(公告)日:2020-05-28

    申请号:US16201490

    申请日:2018-11-27

    Abstract: A heating apparatus for thermally processing a part includes a table formed of a thermally conductive material and a table inductive heating circuit thermally coupled to the table. The table inductive heating circuit comprising a plurality of table induction coil circuits electrically coupled in parallel with each other. Each table induction coil circuit includes a table electrical conductor and a table smart susceptor having a Curie temperature. First and second table induction coil circuits have pairs of segments positioned adjacent each other that are configured to carry current in opposite directions. In some examples, the table induction coil circuits have partially nested, rectilinear hook shapes. In other examples, the table induction coil circuits overlap each other at rhombus-shaped turns.

    Methods and systems for determining a structural parameter for noise and vibration control

    公开(公告)号:US09805150B2

    公开(公告)日:2017-10-31

    申请号:US14447171

    申请日:2014-07-30

    CPC classification number: G06F17/5018 G06F17/5095 G06F2217/82

    Abstract: A computer system enables a noise level associated with a structural substrate to be reduced. The computer system includes a memory device for storing data, and a processor in communication with the memory device. The processor is programmed to define a modulus of elasticity, a thickness, and/or a distribution associated with one or more damping elements coupleable to the structural substrate, define at least one operating parameter associated with the structural substrate and the one or more damping elements, simulate a first performance of the structural substrate and/or the one or more damping elements to generate a first performance data set; and determine whether the first performance data set satisfies a predetermined threshold. The first performance data set is associated with the at least one operating parameter and the modulus of elasticity, the thickness, and/or the distribution associated with the one or more damping elements.

    METHODS AND SYSTEMS FOR DETERMINING A STRUCTURAL PARAMETER FOR NOISE AND VIBRATION CONTROL
    16.
    发明申请
    METHODS AND SYSTEMS FOR DETERMINING A STRUCTURAL PARAMETER FOR NOISE AND VIBRATION CONTROL 有权
    用于确定噪声和振动控制的结构参数的方法和系统

    公开(公告)号:US20160034611A1

    公开(公告)日:2016-02-04

    申请号:US14447171

    申请日:2014-07-30

    CPC classification number: G06F17/5018 G06F17/5095 G06F2217/82

    Abstract: A computer system enables a noise level associated with a structural substrate to be reduced. The computer system includes a memory device for storing data, and a processor in communication with the memory device. The processor is programmed to define a modulus of elasticity, a thickness, and/or a distribution associated with one or more damping elements coupleable to the structural substrate, define at least one operating parameter associated with the structural substrate and the one or more damping elements, simulate a first performance of the structural substrate and/or the one or more damping elements to generate a first performance data set; and determine whether the first performance data set satisfies a predetermined threshold. The first performance data set is associated with the at least one operating parameter and the modulus of elasticity, the thickness, and/or the distribution associated with the one or more damping elements.

    Abstract translation: 计算机系统能够降低与结构基底相关联的噪声水平。 计算机系统包括用于存储数据的存储装置,以及与存储装置通信的处理器。 处理器被编程为定义与一个或多个可耦合到结构基底的阻尼元件相关联的弹性模量,厚度和/或分布,限定与结构基底和一个或多个阻尼元件相关联的至少一个操作参数 模拟结构基板和/或一个或多个阻尼元件的第一性能以产生第一性能数据集; 并且确定第一性能数据集是否满足预定阈值。 第一性能数据集与至少一个操作参数和与一个或多个阻尼元件相关联的弹性模量,厚度和/或分布相关联。

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