Cover component of airbag system, airbag system, and vehicle interior trim
    11.
    发明授权
    Cover component of airbag system, airbag system, and vehicle interior trim 有权
    气囊系统,气囊系统和车辆内饰的盖部件

    公开(公告)号:US07398991B2

    公开(公告)日:2008-07-15

    申请号:US10769920

    申请日:2004-02-03

    CPC分类号: B60R21/2165

    摘要: A cover component mountable to an airbag system has a tear line that is torn open when an airbag of the airbag system inflates. At least part of the tear line includes a recessed line and hollows bored in the recessed line at intervals. The recessed line is molded into the cover component using a raised line provided on a core surface of a die, and where the hollows are bored into the cover component by laser processing.

    摘要翻译: 可安装到气囊系统的盖部件具有当气囊系统的气囊膨胀时撕开的撕裂线。 撕裂线的至少一部分包括凹陷线和在凹陷线中以间隔钻孔的中空部。 使用设置在模具的芯表面上的凸起线将凹陷线模制到盖部件中,并且其中通过激光加工将凹陷部钻入盖部件中。

    Airbag module and cover
    12.
    发明申请
    Airbag module and cover 审中-公开
    安全气囊模块和盖子

    公开(公告)号:US20050052002A1

    公开(公告)日:2005-03-10

    申请号:US10890256

    申请日:2004-07-14

    CPC分类号: B60R21/2165 B60R21/205

    摘要: An airbag cover is provided with a tear line, an open-out door panel which is openable when the tear line is torn, a thinned portion formed in the boundary area between the main body of the airbag cover and the open-out door panel on the back surface of the cover, and a second rib extending in the direction intersecting the extending surface of the open-out door panel between the main body of the airbag cover and the open-out door panel. The airbag cover is configured such that the extending length of the portion on which the second rib is provided is larger than the wall thickness of the respective portions on the side of the open-out door panel with respect to the second rib.

    摘要翻译: 安全气囊盖设有撕裂线,当撕开撕裂线时可打开的开口门板,形成在安全气囊盖主体和开口门板之间的边界区域中的变薄部分, 所述盖的后表面以及在所述安全气囊盖的主体和所述开口门板之间沿与所述开放门板的所述延伸面相交的方向延伸的第二肋。 安全气囊盖构造成使得设置有第二肋的部分的延伸长度大于相对于第二肋在开口门板侧的各个部分的壁厚。

    Laser annealing apparatus
    13.
    发明授权
    Laser annealing apparatus 有权
    激光退火装置

    公开(公告)号:US08575515B2

    公开(公告)日:2013-11-05

    申请号:US13002010

    申请日:2009-06-17

    摘要: A laser annealing apparatus is provided that is capable of reducing irradiation unevenness of laser light caused by a refraction phenomenon of the laser light due to fluctuation in the temperature of inert gas. The laser annealing apparatus includes a gas supply unit for supplying inert gas G to at least a laser irradiation area of a workpiece, and a gas temperature controller for regulating the temperature of the inert gas G. The gas temperature controller controls the temperature of the inert gas G supplied to the laser irradiation area so as to decrease a temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) that is disposed outside the supply area of the inert gas so the temperature controlled inert gas surrounds the optical path of the laser light.

    摘要翻译: 提供一种激光退火装置,其能够减少由于惰性气体的温度波动引起的激光的折射现象引起的激光的照射不均匀性。 激光退火装置包括用于向工件的至少激光照射区域供给惰性气体G的气体供给单元和用于调节惰性气体G的温度的气体温度控制器。气体温度控制器控制惰性气体的温度 气体G供应到激光照射区域,以便降低惰性气体G的温度与设置在惰性气体的供给区域之外的空间(室R)的气氛温度之间的温度差,从而控制温度 惰性气体围绕激光的光路。

    Laser annealing method and apparatus
    14.
    发明授权
    Laser annealing method and apparatus 有权
    激光退火方法和装置

    公开(公告)号:US08170072B2

    公开(公告)日:2012-05-01

    申请号:US12811818

    申请日:2008-05-30

    IPC分类号: H01S3/10

    摘要: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

    摘要翻译: 在透镜阵列式均化器光学系统的情况下,入射到入射角度和强度的激光束1进入长轴聚光光学系统的大尺寸透镜(长轴聚光透镜22) 通过在长轴透镜阵列20a和20b沿与线性光束(X方向)的长轴方向对应的方向往复运动的同时通过执行激光照射而改变每一次的后侧。 因此,垂直条纹显着减少。 此外,通过进行激光照射来改变进入设置在后侧的短轴聚光光学系统的大尺寸透镜(投影透镜30)的激光束1的入射角度和强度, 短轴透镜阵列26a和26b在与线性光束(Y方向)的短轴方向对应的方向上往复运动。 因此,水平条纹显着减少。

    Manufacturing apparatus for airbag cover
    15.
    发明申请
    Manufacturing apparatus for airbag cover 失效
    安全气囊盖制造装置

    公开(公告)号:US20060022436A1

    公开(公告)日:2006-02-02

    申请号:US11183913

    申请日:2005-07-19

    申请人: Masaru Morita

    发明人: Masaru Morita

    IPC分类号: B60R21/16

    摘要: A technique and apparatus for effectively constructing a cover for covering a vehicle airbag is provided. An ultrasonic machine is used that includes an ultrasonic machining blade for machining a tear line in the cover rear surface of the airbag cover. First and second transmitting displacement sensors are disposed on the opposite side of the cover rear surface of the airbag cover so as to be opposed to a cutting edge of the ultrasonic machining blade with the airbag cover interposed therebetween. The sensors directly sense the distance between the cutting edge of the machining blade and each of the first and second displacement sensors and through the airbag cover. A control section controls the relative position of the cutting edge with respect to the airbag cover, based on the sensed results by the first and second displacement sensors.

    摘要翻译: 提供一种用于有效地构造用于覆盖车辆安全气囊的盖的技术和装置。 使用超声波机械,其包括用于在气囊盖的盖后表面中加工撕裂线的超声波加工刀片。 第一和第二传递位移传感器设置在安全气囊盖的盖后表面的相反侧上,以便与超声波加工刀片的切割边缘相对置,其中安放有气囊盖。 传感器直接感测加工刀片的切削刃与第一和第二位移传感器中的每一个之间的距离,并通过安全气囊盖。 基于由第一和第二位移传感器的感测结果,控制部分控制切割边缘相对于气囊盖的相对位置。

    Method and apparatus for surface treating of substrates
    16.
    发明授权
    Method and apparatus for surface treating of substrates 失效
    表面处理基材的方法和设备

    公开(公告)号:US4871417A

    公开(公告)日:1989-10-03

    申请号:US69541

    申请日:1987-06-30

    摘要: A method for surface treating of thin substrates such as semiconductor wafers, wherein a semiconductor wafer formed with relatively deep but transversely minute trenches on its surface is horizontally placed on a spinner in a chamber with its trenched surface directed up, ultraviolet light is then emitted onto the surface of the wafer to dissolve impurities sticking in the trenches, and thereafter etchant is spouted from a nozzle to the trenched surface of the wafer being spinned about a vertical axis at a high speed. Next, the inside of the chamber is subjected to a lower pressure than atmospheric pressure, and atmospheric pressure is restored after the lapse of a predetermined time. Thus a series of these steps of etchant supplying, pressure reducing, and pressure recovering are carried out until the complete entrance of the etchant into the interior surfaces of the trenches is effected, so as to even or smooth the interior surfaces and, finally the wafer is treated with rinsing, heating and drying steps.

    摘要翻译: 一种用于表面处理诸如半导体晶片的薄衬底的方法,其中在其表面上形成有相对较深但横向微小的沟槽的半导体晶片被水平地放置在其沟槽表面朝上的腔室中的旋转器上,然后将紫外光发射到 晶片的表面以溶解粘附在沟槽中的杂质,然后将蚀刻剂从喷嘴喷射到晶片的沟槽表面,以高速旋转垂直轴。 接下来,室的内部经受比大气压更低的压力,并且在经过预定时间之后恢复大气压力。 因此,进行一系列蚀刻剂供应,减压和压力恢复的这些步骤,直到蚀刻剂完全进入沟槽的内表面,以便均匀或平滑内表面,最后是晶片 用冲洗,加热和干燥步骤处理。

    LASER ANNEALING METHOD AND APPARATUS
    18.
    发明申请
    LASER ANNEALING METHOD AND APPARATUS 有权
    激光退火方法和装置

    公开(公告)号:US20110008973A1

    公开(公告)日:2011-01-13

    申请号:US12811818

    申请日:2008-05-30

    摘要: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

    摘要翻译: 在透镜阵列式均化器光学系统的情况下,入射到入射角度和强度的激光束1进入长轴聚光光学系统的大尺寸透镜(长轴聚光透镜22) 通过在长轴透镜阵列20a和20b沿与线性光束(X方向)的长轴方向对应的方向往复运动的同时通过执行激光照射而改变每一次的后侧。 因此,垂直条纹显着减少。 此外,通过进行激光照射来改变进入设置在后侧的短轴聚光光学系统的大尺寸透镜(投影透镜30)的激光束1的入射角度和强度, 短轴透镜阵列26a和26b在与线性光束(Y方向)的短轴方向对应的方向上往复运动。 因此,水平条纹显着减少。

    HEAT SHIELD PLATE FOR SUBSTRATE ANNEALING APPARATUS
    19.
    发明申请
    HEAT SHIELD PLATE FOR SUBSTRATE ANNEALING APPARATUS 有权
    基板退火装置用热屏板

    公开(公告)号:US20090029308A1

    公开(公告)日:2009-01-29

    申请号:US12280811

    申请日:2007-03-15

    IPC分类号: F27D23/00

    CPC分类号: H01L21/324 H01L21/67103

    摘要: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

    摘要翻译: 用于基板退火装置的隔热板设置有水平支撑的平板状基板1,位于基板上方的加热器5,以用辐射热加热基板的上表面,并且隔热板10水平移动 在基板被屏蔽的屏蔽位置和屏蔽位置之间的打开位置之间。 隔热板10由由遮蔽位置的温度差异而几何变形的低热膨胀性材料(碳复合材料)构成的结构体12,覆盖上述表面的绝热构件14 结构件并将表面保持在允许的温度或更低的温度。

    Laser annealing method and apparatus
    20.
    发明授权
    Laser annealing method and apparatus 有权
    激光退火方法和装置

    公开(公告)号:US08598050B2

    公开(公告)日:2013-12-03

    申请号:US13001311

    申请日:2009-06-19

    IPC分类号: H01L21/00

    摘要: Disclosed are a laser annealing method and apparatus capable of forming a crystalline semiconductor thin film on the entire surface of a substrate without sacrificing the uniformity of crystallinity in a seam portion in a long-axis direction of laser light, the crystalline semiconductor thin film having good properties and high uniformity to an extent that the seam portion is not visually recognizable. During the irradiation of a linear beam, portions corresponding to the edges of the linear beam are shielded by a mask 10 which is disposed on the optical path of a laser light 2, and the mask 10 is operated so that the amount of shielding is periodically increased and decreased.

    摘要翻译: 公开了一种激光退火方法和装置,其能够在不牺牲激光长轴方向的接缝部分中的结晶度的均匀性的基板的整个表面上形成结晶半导体薄膜,该结晶半导体薄膜具有良好的 性能和高均匀性,使得接缝部分不能在视觉上识别。 在直线光束的照射期间,对应于直线光束的边缘的部分被设置在激光2的光路上的掩模10屏蔽,并且掩模10被操作以使屏蔽量周期性地 增加和减少。