公开(公告)号：US12070820B2

公开(公告)日：2024-08-27

申请号：US17627707

申请日：2020-07-09

Applicant: Tokyo Electron Limited

Inventor： Hayato Tanoue ,  Yohei Yamashita ,  Hirotoshi Mori

IPC: B23K26/53 ,  B23K26/062 ,  H01L21/304 ,  H01L21/67

CPC classification number: B23K26/53 ,  B23K26/062 ,  H01L21/304 ,  H01L21/67092

Abstract: A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.

公开(公告)号：US11752576B2

公开(公告)日：2023-09-12

申请号：US16978211

申请日：2019-03-01

Applicant: Tokyo Electron Limited

Inventor： Hayato Tanoue

IPC: B23K26/36 ,  H01L21/02 ,  H01L21/268 ,  H01L21/304

CPC classification number: B23K26/36 ,  H01L21/02013 ,  H01L21/268 ,  H01L21/304

Abstract: A substrate processing system configured to process a substrate includes a modification layer forming apparatus configured to form a modification layer within the substrate along a boundary between a peripheral portion of the substrate to be removed and a central portion of the substrate; and a periphery removing apparatus configured to remove the peripheral portion starting from the modification layer.

公开(公告)号：US11450523B2

公开(公告)日：2022-09-20

申请号：US17049076

申请日：2019-04-17

Applicant: Tokyo Electron Limited

Inventor： Hayato Tanoue

IPC: H01L21/02 ,  B23K26/53 ,  H01L21/268 ,  H01L21/304 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing system configured to process a substrate includes an eccentricity detection device configured to detect, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate; a modification layer forming device configured to form a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; and a periphery removing device configured to remove the peripheral portion starting from the modification layer.