公开(公告)号：US20190355573A1

公开(公告)日：2019-11-21

申请号：US16481136

申请日：2018-01-04

Applicant: Tokyo Electron Limited

Inventor： Satoru SHIMURA ,  Masashi ENOMOTO

IPC: H01L21/027 ,  H01L21/66 ,  H01L21/02 ,  G03F7/16

Abstract: A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate.

公开(公告)号：US20170031245A1

公开(公告)日：2017-02-02

申请号：US15106915

申请日：2014-12-15

Applicant: Tokyo Electron Limited ,  Osaka University

Inventor： Seiji NAGAHARA ,  Gousuke SHIRAISHI ,  Satoru SHIMURA ,  Kousuke YOSHIHARA ,  Shinichiro KAWAKAMI ,  Masaru TOMONO ,  Seiichi TAGAWA ,  Akihiro OSHIMA

IPC: G03F7/20 ,  H01L21/67

CPC classification number: G03F7/2004 ,  G03F7/20 ,  H01L21/67098 ,  H01L21/67115 ,  H01L21/67196 ,  H01L21/67225

Abstract: A substrate treatment system for treating a substrate, includes: a treatment station in which a plurality of treatment apparatuses which treat the substrate are provided; an interface station which directly or indirectly delivers the substrate between an exposure apparatus which is provided outside the substrate treatment system and performs exposure of patterns on a resist film on the substrate, and the substrate treatment system; a light irradiation apparatus which performs post-exposure using UV light on the resist film on the substrate after the exposure of patterns is performed; and a post-exposure station which houses the light irradiation apparatus and is adjustable to a reduced pressure or inert gas atmosphere, wherein the post-exposure station is connected to the exposure apparatus directly or indirectly via a space which is adjustable to a reduced pressure or inert gas atmosphere.

Abstract translation: 一种用于处理基板的基板处理系统，包括：设置有多个处理基板的处理装置的处理台; 接口站，其在设置在基板处理系统之外的曝光装置之间直接或间接地传送基板，并且在基板上的抗蚀剂膜上进行图案的曝光;以及基板处理系统; 执行曝光图案之后，使用UV光对基板上的抗蚀剂膜进行后曝光的光照射装置; 以及容纳光照射装置并且可以减压或惰性气体气氛调节的后曝光站，其中后曝光站通过可调节到减压的空间直接或间接连接到曝光装置，或 惰性气体气氛。

公开(公告)号：US20140255844A1

公开(公告)日：2014-09-11

申请号：US14188774

申请日：2014-02-25

Applicant: Tokyo Electron Limited

Inventor： Fumiko IWAO ,  Satoru SHIMURA

IPC: G03F7/40 ,  G03F7/16

CPC classification number: G03F7/405

Abstract: In the present invention, photolithography processing is performed on a substrate to form a resist pattern over the substrate, and a treatment agent is caused to enter a side surface of the resist pattern and metal is caused to infiltrate the side surface of the resist pattern via the treatment agent, the formed resist pattern has a high etching selection ratio with respect to a film to be treated on the substrate so as to suppress a so-called pattern collapse, therefore.

Abstract translation: 在本发明中，对基板进行光刻处理，以在基板上形成抗蚀剂图案，并且使处理剂进入抗蚀剂图案的侧面，使金属渗透到抗蚀剂图案的侧面，从而经由 因此，所形成的抗蚀剂图案相对于基板上待处理的膜具有高蚀刻选择比，从而抑制所谓的图案塌陷。