公开(公告)号：US20220113628A1

公开(公告)日：2022-04-14

申请号：US17496965

申请日：2021-10-08

Applicant: Tokyo Electron Limited

Inventor： Keiichi TANAKA ,  Kosuke YOSHIHARA ,  Yoshihiro KONDO ,  Makoto MURAMATSU ,  Teruhiko KODAMA

IPC: G03F7/16 ,  G03F7/20

Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

公开(公告)号：US20170139399A1

公开(公告)日：2017-05-18

申请号：US15421565

申请日：2017-02-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Teruhiko KODAMA ,  Masashi Enomoto

IPC: G05B19/406 ,  H01L21/67 ,  G05B23/02 ,  H01L21/677

CPC classification number: G05B19/406 ,  G05B19/418 ,  G05B23/0221 ,  G05B2219/25242 ,  G05B2219/45031 ,  H01L21/302 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67288 ,  H01L21/67706 ,  H01L22/12 ,  H01L22/20

Abstract: A substrate processing system includes a film-forming device to form photosensitive film on substrate, an exposure device to expose the film on the substrate, a relay device to transfer the substrate between the film-forming and exposure devices, a warping data acquisition device to acquire measured warping data of the substrate, a communication device to perform data communication with the exposure device, and a control device including film-forming, relay, measuring, and communication control sub-devices. The film-forming sub-device controls the film-forming device to form the film on the substrate, the relay sub-device controls the relay device to transfer the substrate to the exposure device, the measuring sub-device controls the warping data acquisition device to acquire the data after the controlling by the film-forming sub-device prior to the controlling by the relay sub-device, and the communication sub-device controls the communication device to transmit the data to the exposure device.

公开(公告)号：US20150255355A1

公开(公告)日：2015-09-10

申请号：US14632544

申请日：2015-02-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Teruhiko KODAMA ,  Masashi Enomoto

IPC: H01L21/66 ,  H01L21/302 ,  H01L21/67 ,  G05B19/418

CPC classification number: G05B19/406 ,  G05B19/418 ,  G05B23/0221 ,  G05B2219/25242 ,  G05B2219/45031 ,  H01L21/302 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67288 ,  H01L21/67706 ,  H01L22/12 ,  H01L22/20

Abstract: A substrate processing system includes a film-forming device to form photosensitive film on substrate, an exposure device to expose the film on the substrate, a relay device to transfer the substrate between the film-forming and exposure devices, a warping data acquisition device to acquire measured warping data of the substrate, a communication device to perform data communication with the exposure device, and a control device including film-forming, relay, measuring, and communication control sub-devices. The film-forming sub-device controls the film-forming device to form the film on the substrate, the relay sub-device controls the relay device to transfer the substrate to the exposure device, the measuring sub-device controls the warping data acquisition device to acquire the data after the controlling by the film-forming sub-device prior to the controlling by the relay sub-device, and the communication sub-device controls the communication device to transmit the data to the exposure device.

Abstract translation: 基板处理系统包括：在基板上形成感光膜的成膜装置，曝光基板上的膜的曝光装置，在成膜和曝光装置之间传送基板的中继装置，翘曲数据采集装置 获取基板的测量翘曲数据，与曝光装置进行数据通信的通信装置，以及包括成膜，继电器，测量和通信控制子装置的控制装置。 成膜子装置控制成膜装置在基板上形成膜，继电器副装置控制中继装置将基板转印到曝光装置，测量分装置控制翘曲数据采集装置 在由中继子设备进行控制之前由成膜子设备进行控制之后获取数据，并且通信子设备控制通信设备将数据发送到曝光设备。