公开(公告)号：US10828667B1

公开(公告)日：2020-11-10

申请号：US16434932

申请日：2019-06-07

Applicant: United Technologies Corporation

Inventor： John Harner ,  Danielle E. Jencks

IPC: B05D3/10 ,  B05D5/00 ,  B05D5/10 ,  B05D3/12 ,  B05D7/14

Abstract: A method of repairing a defectively manufactured multi-layer component having a substrate material and a primer layer includes applying, to the primer layer, a solvent that causes the primer layer to swell to form a swelled primer layer. The method also includes abrading away the swelled primer layer from the multi-layer component and rebuilding the multi-layer component by forming a new primer layer on the substrate material.

公开(公告)号：US20190061073A1

公开(公告)日：2019-02-28

申请号：US15687121

申请日：2017-08-25

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： William Bogue ,  John D. Riehl ,  John Harner ,  Gary A. Wigell ,  Jeffrey Ian Phillips ,  Anthony G. Ruglio

IPC: B23P11/02 ,  F01D25/12

Abstract: A method of separating a lap joint assembly may include positioning a fluid emitter relative to a lap joint assembly. The lap joint assembly may include an adhesive lap joint between a first component and a second component. The method may further include emitting a cryogenic fluid stream from the fluid emitter at the adhesive lap joint. Positioning the fluid emitter and emitting the cryogenic fluid stream may include orienting the fluid emitter such that an angle between the cryogenic fluid stream and the adhesive lap joint is less than 45 degrees. The first component may be a sheath and the second component may be an airfoil body.

公开(公告)号：US20190024255A1

公开(公告)日：2019-01-24

申请号：US15656571

申请日：2017-07-21

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： John Harner ,  John D. Riehl ,  William Bogue ,  Gary A. Wigell ,  Brandon A. Gates ,  Michael A. Morden ,  Thomas M. Morin

IPC: C25D11/12 ,  C25D11/26 ,  C25D11/02 ,  C25D11/08 ,  B64F5/40 ,  F02C3/04 ,  F01D5/28

CPC classification number: C25D11/12 ,  B64F5/40 ,  C25D11/022 ,  C25D11/04 ,  C25D11/08 ,  C25D11/26 ,  C25D17/005 ,  F01D5/288 ,  F02C3/04 ,  F05D2230/90

Abstract: A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.