公开(公告)号：US20200370840A1

公开(公告)日：2020-11-26

申请号：US16824777

申请日：2020-03-20

Applicant: University of South Carolina

Inventor： Chen Li ,  Jamil Khan ,  Xinyu Huang ,  Tanvir Farouk ,  Raikan Dawas ,  Wei Chang ,  Pengtao Wang ,  Mohammad Alwazzan ,  Guanghan Huang

IPC: F28D15/04 ,  F28D15/02 ,  F28B1/06

Abstract: Sweating-boosted air cooled heat-pipe condensers for reducing water usage of air cooled condensers employing a novel nanowick micro fin structure to form a sweating boosted heat dissipation system, wherein the nanowicks may be layered and provide self-cleaning features, photoinduced superhydrophilic transition, and an active interface for decomposing organic matter.

公开(公告)号：US20140034132A1

公开(公告)日：2014-02-06

申请号：US13828904

申请日：2013-03-14

Applicant: UNIVERSITY OF SOUTH CAROLINA

Inventor： Chen Li ,  Fanghao Yang ,  Xianming Dai ,  Yan Tong

IPC: B81B1/00 ,  B81C1/00

CPC classification number: B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00828 ,  B01J2219/00835 ,  B01J2219/00846 ,  B01J2219/0086 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2300/0858 ,  B01L2300/12 ,  B81B1/00 ,  B81B7/0087 ,  B81B2201/058 ,  B81B2203/033 ,  B81B2203/0361 ,  B81C1/00031 ,  B81C1/00111 ,  B81C1/00119 ,  B81C1/00206 ,  B81C2201/014 ,  Y10T137/0318 ,  Y10T428/24496

Abstract: Microfluidic devices having superhydrophilic bi-porous interfaces are provided, along with their methods of formation. The device can include a substrate defining a microchannel formed between a pair of side walls and a bottom surface and a plurality of nanowires extending from each of the side walls and the bottom surface. For example, the nanowires can be silicon nanowires (e.g., pure silicon, silicon oxide, silicon carbide, etc., or mixtures thereof).

Abstract translation: 提供了具有超亲水双孔界面的微流体装置及其形成方法。 该装置可以包括限定形成在一对侧壁和底表面之间的微通道的衬底和从每个侧壁和底表面延伸的多个纳米线。 例如，纳米线可以是硅纳米线（例如，纯硅，氧化硅，碳化硅等，或其混合物）。

公开(公告)号：US11340024B2

公开(公告)日：2022-05-24

申请号：US16580249

申请日：2019-09-24

Applicant: UNIVERSITY OF SOUTH CAROLINA

Inventor： Chen Li ,  Wei Chang ,  Benli Peng ,  Pengtao Wang

IPC: F28F21/02 ,  F28D15/04 ,  F28F21/08 ,  B23P15/26 ,  C23C16/26

Abstract: The present disclosure relates to efficient heat exchanger components, such as pipe apparatuses including the same. Methods of fabricating heat exchange components are also disclosed. A condensing apparatus can include a condenser surface having a substrate and one or more layers of graphene. The substrate can be formed of nickel and a nickel-graphene surface composite layer can be formed. The substrate-graphene composite can be highly durable, hydrophobic, and resistant to fouling. Dropwise condensation can be induced.