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公开(公告)号:US12098069B2
公开(公告)日:2024-09-24
申请号:US17540750
申请日:2021-12-02
Applicant: Sangwoo Lee
Inventor: Sangwoo Lee
CPC classification number: B81C1/00111 , A61B5/293 , B81B1/008 , A61B2562/125 , A61N1/0529 , B81B2201/055 , B81B2203/0361 , B81B2203/04 , B81C2201/0133
Abstract: A method of manufacturing a plurality of neural probes from a silicon wafer in which after neural probes are formed on one side of a silicon wafer, the other side of the silicon wafter is subject to a dicing process that separates and adjusts the thickness of the neural probes.
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公开(公告)号:US12000735B2
公开(公告)日:2024-06-04
申请号:US17406863
申请日:2021-08-19
Inventor: Daejong Yang , Hyunjun Cho , Youngzoon Yoon , Hyuck Choo
CPC classification number: G01J3/4412 , B81C1/00206 , B82Y15/00 , B82Y30/00 , C23C18/06 , C23C18/08 , G01N21/658 , B81B2203/0361 , B81B2207/056 , B81C2201/0104
Abstract: A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.
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公开(公告)号:US20240108817A1
公开(公告)日:2024-04-04
申请号:US18529219
申请日:2023-12-05
Applicant: SNVIA CO., LTD.
Inventor: Seung Yun YANG , Sang-Gu YIM , Young Jun HWANG
CPC classification number: A61M5/3286 , B81B1/008 , B81C1/00111 , A61M2207/00 , B81B2201/055 , B81B2203/0361 , B81C2201/0197
Abstract: An implantable microneedle and a manufacturing method therefor is disclosed. The implantable microneedle includes a coating layer for covering at least one part of the surface of a tip part of the microneedle. When exposed to moisture, the coating layer can be separated from the tip part of the microneedle and thus be implanted.
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公开(公告)号:US11938308B2
公开(公告)日:2024-03-26
申请号:US16959620
申请日:2019-01-17
Applicant: SNVIA CO., LTD.
Inventor: Seung Yun Yang , Sang-Gu Yim , Young Jun Hwang
CPC classification number: A61M5/3286 , B81B1/008 , B81C1/00111 , A61M2207/00 , B81B2201/055 , B81B2203/0361 , B81C2201/0197
Abstract: The present invention provides an implantable microneedle and a manufacturing method therefor. An implantable microneedle according to the present invention comprises a coating layer for covering at least one part of the surface of a tip part of the microneedle. When exposed to moisture, the coating layer can be separated from the tip part of the microneedle and thus be implanted.
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公开(公告)号:US11785943B2
公开(公告)日:2023-10-17
申请号:US16138948
申请日:2018-09-21
Applicant: UCHICAGO ARGONNE, LLC
Inventor: Philip D. Laible , Martyna Michalska , Philippe Noirot , Ralu Divan , Igor Aronson , Andrey Sokolov
CPC classification number: A01N25/34 , A01N59/00 , B82Y5/00 , B82Y30/00 , B82Y40/00 , B01L2300/161 , B81B2203/0361 , B81B2203/0392 , B82B3/0014 , B82B3/0019 , C12Q1/6806 , C12Q1/689 , Y10T428/24182 , Y10T428/24355 , Y10T428/24479 , A01N25/34 , A01N59/00 , A01N59/10
Abstract: A material with nanopillar structures extending from a substrate. The nanopillars are engageable by organisms to cause an interaction, such as cellular destruction.
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公开(公告)号:US20190187097A1
公开(公告)日:2019-06-20
申请号:US15841907
申请日:2017-12-14
Applicant: International Business Machines Corporation
Inventor: Juntao Li , Kangguo Cheng , Peng Xu , Heng Wu
CPC classification number: G01N27/68 , B81B2203/0361 , B81C1/00031 , B82B1/001 , B82B3/0019
Abstract: A method of forming a semiconductor structure includes forming a substrate, forming an anchor layer, and forming one or more self-aligned nanotip pillar pairs disposed vertically between the substrate and the anchor layer. A given one of the nanotip pillar pairs comprises a bottom nanotip pillar and a top nanotip pillar, the bottom nanotip pillar comprising a base portion disposed on a top surface of the substrate and the top nanotip pillar comprising a base portion disposed in the anchor layer. The bottom nanotip pillar and the top nanotip pillar comprise sidewalls that taper to points as distance from the respective base portions increases.
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公开(公告)号:US20180272047A1
公开(公告)日:2018-09-27
申请号:US15927428
申请日:2018-03-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Stacey M. Gifford , Huan Hu , Emily R. Kinser , Roy R. Yu , Sufi Zafar
CPC classification number: A61L31/16 , A61L27/06 , A61L27/306 , A61L27/34 , A61L27/50 , A61L31/06 , A61L31/088 , A61L31/10 , A61L2300/406 , A61L2300/606 , A61L2400/12 , A61L2400/18 , A61L2420/02 , A61L2420/08 , B81B2203/0361 , B81B2207/056 , B81C1/00206 , B82B3/0019 , B82B3/0033
Abstract: Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.
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公开(公告)号:US20180170745A1
公开(公告)日:2018-06-21
申请号:US15813990
申请日:2017-11-15
Applicant: Infineon Technologies AG
Inventor: Stefan Barzen , Wolfgang Friza , Marc Fueldner
CPC classification number: B81B3/007 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/0361 , B81B2203/04 , B81C1/00619 , B81C2201/0109 , B81C2201/0132 , B81C2201/0133 , H04R9/08 , H04R17/02 , H04R19/005 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A semiconductor device is proposed. The semiconductor device comprises a membrane structure having an opening. Furthermore, the semiconductor device comprises a first backplate structure, which is arranged on a first side of the membrane structure, and a second backplate structure, which is arranged on a second side of the membrane structure. The semiconductor device furthermore comprises a vertical connection structure, which connects the first backplate structure to the second backplate structure. In this case, the vertical connection structure extends through the opening.
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公开(公告)号:US09884759B2
公开(公告)日:2018-02-06
申请号:US13499083
申请日:2010-09-20
Applicant: Harry Hedler , Jörg Zapf
Inventor: Harry Hedler , Jörg Zapf
IPC: B32B3/00 , G01K7/02 , G01K7/08 , B81B1/00 , B81B7/00 , B81B7/02 , B81B7/04 , H01L35/32 , B29C39/00 , B29C39/02 , B81C99/00
CPC classification number: B81C99/0085 , B81B2203/0361 , B81B2207/056 , Y10T29/49826 , Y10T428/24355
Abstract: A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 μm-200 μm. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 μm-100 μm. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.
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公开(公告)号:US09868119B2
公开(公告)日:2018-01-16
申请号:US14749123
申请日:2015-06-24
Applicant: International Business Machines Corporation
Inventor: Yann A. Astier , Robert L. Bruce , Joshua T. Smith , Chao Wang , Benjamin H. Wunsch
CPC classification number: G01N15/10 , B01L3/502707 , B01L3/502715 , B01L3/502753 , B01L2200/0652 , B01L2200/12 , B01L2300/0809 , B01L2300/0816 , B01L2300/0864 , B01L2300/12 , B01L2400/086 , B03B5/48 , B81B1/006 , B81B2201/058 , B81B2203/0361 , B81C1/00111 , B81C2201/0132 , B82B3/0014 , G01N2015/0065 , G01N2015/1006 , G01N2015/1081 , G03F7/0002 , G03F7/2037
Abstract: A technique related to sorting entities is provided. An inlet is configured to receive a fluid, and an outlet is configured to exit the fluid. A nanopillar array, connected to the inlet and the outlet, is configured to allow the fluid to flow from the inlet to the outlet. The nanopillar array includes nanopillars arranged to separate entities by size. The nanopillars are arranged to have a gap separating one nanopillar from another nanopillar. The gap is constructed to be in a nanoscale range.
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