公开(公告)号：US06341971B1

公开(公告)日：2002-01-29

申请号：US09652960

申请日：2000-08-31

Applicant: Edmond Choy ,  Chih-Nan Lin

Inventor： Edmond Choy ,  Chih-Nan Lin

IPC: H01R1362

CPC classification number: H01R12/721 ,  H01R12/7005 ,  H01R12/83

Abstract: A double-deck connector assembly (1) includes a unitary housing (10) defining upper and lower connection ports (12, 14) with upper and lower central slots (16, 17) for respectively receiving the corresponding upper and lower modules (100, 200) therein. The upper connection port (12) is slightly forwardly offset from the lower connection port (14). A pair of latching arms (20, 22) extend from two opposite ends of each connection port (12, 14) for retaining the corresponding module (100, 200) in position. A latching lug (28, 34) is formed on each latching arm (20, 22) for locking the module (100, 200) in position. A guidance surface (85) is formed around a lower portion of the upper latch arm (20) so that the upwardly rotated lower module (200) can guidably move along the guidance surface (85) to outwardly push away the corresponding upper latch arm (20) thereabove to reach the initial insertion angular position which is essentially above the upper latch arm (20).

Abstract translation: 双层连接器组件（1）包括形成上连接端口（12）和下连接端口（14）的整体式外壳（10），其具有用于分别接收相应的上模块和下模块（100）的下中间槽（16,17） 200）。 上连接端口（12）从下连接端口（14）稍微向前偏移。 一对锁定臂（20,22）从每个连接端口（12,14）的两个相对端延伸，用于将相应的模块（100,200）保持在适当位置。 在每个闭锁臂（20,22）上形成有用于将模块（100,200）锁定就位的闩锁凸耳（28,34）。 引导表面（85）围绕上锁定臂（20）的下部形成，使得向上旋转的下模块（200）能够沿着引导表面（85）引导地移动，以向外推动相应的上锁定臂（ 20）到达初始插入角位置，其基本上在上锁定臂（20）的上方。

公开(公告)号：US20130049051A1

公开(公告)日：2013-02-28

申请号：US13596528

申请日：2012-08-28

Applicant: Jia-Kuen Wang ,  Chien-Fu Shen ,  Chao-Hsing Chen ,  Yu-Chen Yang ,  Hui-Chun Yeh ,  Yl-Wen Ku ,  Hung-Che Chen ,  Chih-Nan Lin

Inventor： Jia-Kuen Wang ,  Chien-Fu Shen ,  Chao-Hsing Chen ,  Yu-Chen Yang ,  Hui-Chun Yeh ,  Yl-Wen Ku ,  Hung-Che Chen ,  Chih-Nan Lin

IPC: H01L33/60

CPC classification number: H01L33/405 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44

Abstract: Disclosed is a light-emitting device comprising: a semiconductor stack layer; a reflective layer on the semiconductor stack layer; a first buffer layer comprising a compound comprising a metallic element and a non-metallic element on the reflective layer; a first electrode; and an electrical insulating layer disposed between the first buffer layer and the first electrode.

Abstract translation: 公开了一种发光器件，包括：半导体叠层层; 半导体堆叠层上的反射层; 第一缓冲层，包括在反射层上包含金属元素和非金属元素的化合物; 第一电极; 以及设置在第一缓冲层和第一电极之间的电绝缘层。

公开(公告)号：US20080230878A1

公开(公告)日：2008-09-25

申请号：US12077489

申请日：2008-03-19

Applicant: Wei-Lung Lu ,  Chih-Nan Lin ,  Shih-Kuang Chiu ,  Chin-Te Chen

Inventor： Wei-Lung Lu ,  Chih-Nan Lin ,  Shih-Kuang Chiu ,  Chin-Te Chen

IPC: H01L23/495

CPC classification number: H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A flip chip semiconductor package is disclosed according to the present invention, the flip chip semiconductor package comprises a chip that is mounted on and electrically connects to a leadframe via a plurality of solder bumps by means of flip chip, and an encapsulate that encapsulates the chip, the plurality of solder bumps, and the leadframe, wherein, the leadframe further comprises a plurality of leads and a ground plane that is located between the plurality of leads, and also a slit is formed on the ground plane, and then a molding compound that makes up the encapsulant should be capable of filling within the slit, thus to enhance the adhesion between the ground plane and the encapsulant, and then avoid delamination between the ground plane and the encapsulant in subsequent thermal cycle processes, thereby increasing the reliability of fabricated products.

Abstract translation: 根据本发明公开了一种倒装芯片半导体封装，所述倒装芯片半导体封装包括通过倒装芯片经由多个焊料凸块安装在引线框架上并与其电连接的芯片，以及封装芯片 多个焊料凸块和引线框架，其中引线框还包括多个引线和位于多个引线之间的接地平面，并且在接地平面上形成狭缝，然后形成模塑料 这样构成的密封剂应该能够在狭缝内填充，从而增强接地层与密封剂之间的密合性，然后避免在随后的热循环过程中接地层与密封剂之间的分层，从而提高制造的可靠性 产品。

公开(公告)号：US07126499B2

公开(公告)日：2006-10-24

申请号：US10856295

申请日：2004-05-28

Applicant: Chih-Nan Lin ,  Chih-Hsiang Chiang ,  Ling-Hsi Chao

Inventor： Chih-Nan Lin ,  Chih-Hsiang Chiang ,  Ling-Hsi Chao

IPC: H03M13/00

CPC classification number: G06F3/0202

Abstract: A keyboard. The keyboard comprises at least one key, a base, a membrane assembly and a circuit board. The membrane assembly is disposed between the base and the key. At least part of the circuit board is disposed in the key. The keyboard is connected to a notebook computer or a personal computer via a connection member.

Abstract translation: 键盘。 键盘包括至少一个键，基座，膜组件和电路板。 膜组件设置在基座和键之间。 电路板的至少一部分设置在钥匙中。 键盘通过连接构件连接到笔记本电脑或个人计算机。

公开(公告)号：US08109795B2

公开(公告)日：2012-02-07

申请号：US12763225

申请日：2010-04-20

Applicant: Chih-Nan Lin ,  Kuo-Chun Hsu ,  Hung-Chi Yu

Inventor： Chih-Nan Lin ,  Kuo-Chun Hsu ,  Hung-Chi Yu

IPC: H01R24/00

CPC classification number: H01R13/6461

Abstract: An electrical connector includes an insulative housing defining a mating cavity, two parallel and stacked mating portions respectively forwards extending into the mating cavity, sets of contact retained in the housing and a grounding member retained in the housing. The first mating portion defines thereon a first surface; the second mating portion spaces from the first mating portion and defines thereon a second surface opposite to the first surface. The sets of contact include a first set of contacts each defining a contacting section exposed upon the first surface and a second set of contacts each defining a deflectable cantilevered beam accessible from the second face. The grounding member is disposed between the first and second mating portions to reduce the cross-talk between the first and second sets of contacts.

Abstract translation: 电连接器包括限定配合腔的绝缘壳体，分别向前延伸到配合空腔中的两个平行和堆叠的配合部分，保持在壳体中的一组触点和保持在壳体中的接地构件。 第一配合部分在其上限定第一表面; 所述第二配合部分与所述第一配合部分间隔开并在其上限定与所述第一表面相对的第二表面。 该组触点包括：第一组触点，每个触点限定暴露在第一表面上的接触部分;以及第二组触头，每个触点限定可从第二面接近的可偏转的悬臂梁。 接地构件设置在第一和第二配合部分之间，以减少第一组和第二组触点之间的串扰。

公开(公告)号：US20080318454A1

公开(公告)日：2008-12-25

申请号：US11766204

申请日：2007-06-21

Applicant: Chen-Fa Wu ,  Chih-Nan Lin ,  Kuo-Ching Huang ,  Chin-An Huang

Inventor： Chen-Fa Wu ,  Chih-Nan Lin ,  Kuo-Ching Huang ,  Chin-An Huang

IPC: H01R12/16

CPC classification number: H05K1/0271 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/10409 ,  H05K2201/10734

Abstract: An information handling system circuit board has an opening formed through it proximate a coupling point of an integrated circuit to the circuit board. The opening manages stress at the coupling point of the integrated circuit to the circuit board to reduce the risk of damage to the coupling point during deformation of the circuit board, such as when the circuit board is coupled to a chassis or when a component is pressed into the circuit board. In one embodiment, rectangular openings are formed at diagonally opposed corners of a BSA integrated circuit. In alternative embodiments, openings of varying shape, such as slots or curved slots, are formed at selected corners of the integrated circuit.

Abstract translation: 信息处理系统电路板具有通过其形成的开口，其靠近集成电路到电路板的耦合点。 开口处理集成电路到电路板的耦合点处的应力，以减少在电路板变形期间对耦合点的损坏的风险，例如当电路板耦合到底盘或当部件被按压时 进入电路板。 在一个实施例中，在BSA集成电路的对角相对的角上形成矩形开口。 在替代实施例中，在集成电路的选定角处形成变化形状的开口，例如槽或弯曲槽。

公开(公告)号：US20080185191A1

公开(公告)日：2008-08-07

申请号：US12023862

申请日：2008-01-31

Applicant: Chih-Nan Lin

Inventor： Chih-Nan Lin

IPC: G06F3/041

CPC classification number: G06F3/044

Abstract: A touchpad comprises a first insulating layer and a second insulating layer. The first insulating layer has a sensor surface and a plurality of metal sensors disposed on the sensor surface. The second insulating layer has a touch surface and a connecting surface. The connecting surface is opposite to the touch surface and covers the metal sensors. An electronic product comprises a main body and a touchpad. The main body has an exterior. The touchpad is disposed in the main body and exposed to the exterior of the main body. A method for forming a touchpad comprises locating a plurality of metal sensors on a sensor surface of a first insulating layer, and then connecting the first insulating layer and a second insulating layer, with the metal sensors sandwiched between the first insulating layer and the second insulating layer.

Abstract translation: 触摸板包括第一绝缘层和第二绝缘层。 第一绝缘层具有传感器表面和设置在传感器表面上的多个金属传感器。 第二绝缘层具有触摸表面和连接表面。 连接表面与触摸表面相对并覆盖金属传感器。 电子产品包括主体和触摸板。 主体有外观。 触摸板设置在主体中并暴露于主体的外部。 一种用于形成触摸板的方法包括将多个金属传感器定位在第一绝缘层的传感器表面上，然后连接第一绝缘层和第二绝缘层，金属传感器夹在第一绝缘层和第二绝缘层之间 层。

公开(公告)号：US09159881B2

公开(公告)日：2015-10-13

申请号：US13596528

申请日：2012-08-28

Applicant: Jia-Kuen Wang ,  Chien-Fu Shen ,  Chao-Hsing Chen ,  Yu-Chen Yang ,  Hui-Chun Yeh ,  Yi-Wen Ku ,  Hung-Che Chen ,  Chih-Nan Lin

Inventor： Jia-Kuen Wang ,  Chien-Fu Shen ,  Chao-Hsing Chen ,  Yu-Chen Yang ,  Hui-Chun Yeh ,  Yi-Wen Ku ,  Hung-Che Chen ,  Chih-Nan Lin

IPC: H01L33/38 ,  H01L33/42 ,  H01L33/10 ,  H01L33/40 ,  H01L33/44

CPC classification number: H01L33/405 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44

Abstract: Disclosed is a light-emitting device comprising: a semiconductor stack layer; a reflective layer on the semiconductor stack layer; a first buffer layer comprising a compound comprising a metallic element and a non-metallic element on the reflective layer; a first electrode; and an electrical insulating layer disposed between the first buffer layer and the first electrode.

Abstract translation: 公开了一种发光器件，包括：半导体叠层层; 半导体堆叠层上的反射层; 第一缓冲层，包括在反射层上包含金属元素和非金属元素的化合物; 第一电极; 以及设置在第一缓冲层和第一电极之间的电绝缘层。

公开(公告)号：US20070018856A1

公开(公告)日：2007-01-25

申请号：US11513555

申请日：2006-08-30

Applicant: Chih-Nan Lin ,  Chih-Hsiang Chiang ,  Ling-Hsi Chao

Inventor： Chih-Nan Lin ,  Chih-Hsiang Chiang ,  Ling-Hsi Chao

IPC: H03M11/00

CPC classification number: G06F3/0202

Abstract: A keyboard. The keyboard comprises at least one key, a base, a membrane assembly and a circuit board. The membrane assembly is disposed between the base and the key. At least part of the circuit board is disposed in the key. The keyboard is connected to a notebook computer or a personal computer via a connection member.

Abstract translation: 键盘。 键盘包括至少一个键，基座，膜组件和电路板。 膜组件设置在基座和键之间。 电路板的至少一部分设置在钥匙中。 键盘通过连接构件连接到笔记本电脑或个人计算机。

公开(公告)号：US06964531B2

公开(公告)日：2005-11-15

申请号：US10863737

申请日：2004-06-08

Applicant: Chih-Nan Lin ,  Huang-Chang Hsu ,  Chien-Shih Hsu

Inventor： Chih-Nan Lin ,  Huang-Chang Hsu ,  Chien-Shih Hsu

IPC: B41J5/08 ,  G06F3/02 ,  H01R33/00

CPC classification number: G06F3/0202

Abstract: A light module having a first power line, a second power line, and light devices. The first power line is connected to a first power point. The second power line is connected to a second power point. Each light device having a first terminal coupled to the first power line and a second terminal coupled to the second power line. A first sum of a first line length between the first power point and the first terminal of any of the light devices and a second line length between the second power point and the second terminal thereof is substantially a first constant.

Abstract translation: 具有第一电力线，第二电力线和灯装置的灯模块。 第一电源线连接到第一电源点。 第二电源线连接到第二电源点。 每个灯装置具有耦合到第一电力线的第一端子和耦合到第二电力线的第二端子。 任何一个装置的第一功率点和第一端之间的第一线长度和第二功率点与其第二端之间的第二线长度的第一和基本上是第一常数。