摘要:
A method of eliminating electrostatic charges generated from friction between a carrier and a substrate is provided. A substrate having a front surface and a back surface is provided. A transparent conductive layer is formed on the back surface by sputtering or evaporation process, wherein the electrostatic charges accumulated on the carrier are eliminated through the transparent conductive layer when the anti-static substrate is in contact with the carrier.
摘要:
A method for fabricating a thin film transistor (TFT) is described. A MoNb gate is formed on a substrate, and an insulating layer is formed on the substrate covering the gate. A channel layer is formed on the insulating layer above the gate, and a source/drain is formed on the channel layer to constitute a TFT. Since the gate is constituted of a MoNb layer, the contact resistance thereof can be reduced.
摘要:
An anti-electrostatic discharge substrate adapted to eliminate electrostatic charges generated from friction between a carrier and the anti-electrostatic discharge substrate is provided. The anti-electrostatic discharge substrate includes a substrate having a front surface and a back surface; and a conductive layer on the back surface, wherein the electrostatic charges accumulated on the carrier are eliminated through the conductive layer when the substrate is in contact with the carrier.
摘要:
A method for fabricating a thin film transistor (TFT) is described. A MoNb gate is formed on a substrate, and an insulating layer is formed on the substrate covering the gate. A channel layer is formed on the insulating layer above the gate, and a source/drain is formed on the channel layer to constitute a TFT. Since the gate is constituted of a MoNb layer, the contact resistance thereof can be reduced.