-
公开(公告)号:US20170136779A1
公开(公告)日:2017-05-18
申请号:US15409923
申请日:2017-01-19
申请人: XEROX CORPORATION
发明人: Yiliang Wu , Kurt Halfyard
IPC分类号: B41J2/215 , H05K3/34 , H05K3/28 , H05K1/03 , C09D11/102 , C09D11/033
CPC分类号: B41J2/215 , B41J2/01 , C09D11/033 , C09D11/102 , G03F1/68 , H05K1/0353 , H05K3/285 , H05K3/3452 , H05K2201/2081 , H05K2203/0545 , H05K2203/0783
摘要: A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.
-
公开(公告)号:US09606430B2
公开(公告)日:2017-03-28
申请号:US14471967
申请日:2014-08-28
申请人: Xerox Corporation
发明人: Yiliang Wu , Kurt Halfyard
CPC分类号: B41J2/215 , B41J2/01 , C09D11/033 , C09D11/102 , G03F1/68 , H05K1/0353 , H05K3/285 , H05K3/3452 , H05K2201/2081 , H05K2203/0545 , H05K2203/0783
摘要: A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.
-
公开(公告)号:US20170044388A1
公开(公告)日:2017-02-16
申请号:US15340896
申请日:2016-11-01
申请人: XEROX CORPORATION
发明人: Yiliang Wu , Kurt Halfyard
IPC分类号: C09D11/36 , C09D11/322 , B05D1/02 , C09D11/101
CPC分类号: C09D11/36 , B05D1/02 , C09D11/101 , C09D11/322
摘要: A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.
摘要翻译: 用于气溶胶喷射印刷的焊接掩模油墨包括金属氧化物和基于丙二醇的溶剂; 焊接掩模油墨在25℃下的剪切速率为10 1 / s时具有约50cps至约1,000cps的粘度,以及约1.0至约2.0的剪切稀化指数。
-
公开(公告)号:US09540529B2
公开(公告)日:2017-01-10
申请号:US14595814
申请日:2015-01-13
申请人: XEROX CORPORATION
发明人: Yiliang Wu , Kurt Halfyard
IPC分类号: C09D11/36 , C09D11/101 , C09D11/322
CPC分类号: C09D11/36 , B05D1/02 , C09D11/101 , C09D11/322
摘要: A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.
摘要翻译: 用于气溶胶喷射印刷的焊接掩模油墨包括金属氧化物和基于丙二醇的溶剂; 焊接掩模油墨在25℃下的剪切速率为10 1 / s时具有约50cps至约1,000cps的粘度,以及约1.0至约2.0的剪切稀化指数。
-
-
-