公开(公告)号：US20180208785A1

公开(公告)日：2018-07-26

申请号：US15414814

申请日：2017-01-25

申请人： Xerox Corporation

发明人： Naveen Chopra ,  Chad Smithson ,  Kurt Halfyard ,  Gail Song ,  Michelle Chretien

IPC分类号： C09D11/102 ,  C09D11/52 ,  C09D11/037 ,  B22F3/10 ,  B22F3/24 ,  B22F5/00 ,  B22F7/00 ,  B22F7/04 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  H05K3/46 ,  H05K1/09

CPC分类号： C09D11/102 ,  B22F3/1021 ,  B22F3/24 ,  B22F5/00 ,  B22F7/008 ,  B22F7/04 ,  B22F2003/248 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2303/40 ,  B22F2998/10 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  C09D11/037 ,  C09D11/52 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/386 ,  H05K3/4664 ,  H05K2201/09845 ,  H05K2203/0502

摘要： Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

公开(公告)号：US09926455B2

公开(公告)日：2018-03-27

申请号：US15340896

申请日：2016-11-01

申请人： XEROX CORPORATION

发明人： Yiliang Wu ,  Kurt Halfyard

IPC分类号： C09D11/36 ,  C09D11/101 ,  C09D11/322 ,  B05D1/02

CPC分类号： C09D11/36 ,  B05D1/02 ,  C09D11/101 ,  C09D11/322

摘要： A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.

公开(公告)号：US20160200927A1

公开(公告)日：2016-07-14

申请号：US14595814

申请日：2015-01-13

申请人： XEROX CORPORATION

发明人： Yiliang Wu ,  Kurt Halfyard

IPC分类号： C09D11/36 ,  C09D11/101 ,  C09D11/322

CPC分类号： C09D11/36 ,  B05D1/02 ,  C09D11/101 ,  C09D11/322

摘要： A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.

摘要翻译： 用于气溶胶喷射印刷的焊接掩模油墨包括金属氧化物和基于丙二醇的溶剂; 焊接掩模油墨在25℃下的剪切速率为10 1 / s时具有约50cps至约1,000cps的粘度，以及约1.0至约2.0的剪切稀化指数。

公开(公告)号：US10899940B2

公开(公告)日：2021-01-26

申请号：US15414814

申请日：2017-01-25

申请人： Xerox Corporation

发明人： Naveen Chopra ,  Chad Smithson ,  Kurt Halfyard ,  Gail Song ,  Michelle Chretien

IPC分类号： C09D11/102 ,  C09D11/52 ,  C09D11/037 ,  B22F3/10 ,  B22F3/24 ,  B22F5/00 ,  B22F7/00 ,  B22F7/04 ,  B33Y10/00 ,  B33Y30/00 ,  H05K3/46 ,  H05K1/09 ,  H05K3/38 ,  B29C64/112 ,  H05K3/12 ,  H05K1/02

摘要： Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

公开(公告)号：US20200040229A1

公开(公告)日：2020-02-06

申请号：US16277664

申请日：2019-02-15

申请人： Xerox Corporation

发明人： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Kurt Halfyard

IPC分类号： C09J9/02 ,  C09J163/00

摘要： Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US20200040228A1

公开(公告)日：2020-02-06

申请号：US16277589

申请日：2019-02-15

申请人： XEROX CORPORATION

发明人： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Naveen Chopra ,  Kurt Halfyard ,  Biby Esther Abraham

IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J125/18 ,  C09J129/14 ,  C09J163/00 ,  C09J161/28

摘要： Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US09840088B2

公开(公告)日：2017-12-12

申请号：US15409923

申请日：2017-01-19

申请人： XEROX CORPORATION

发明人： Yiliang Wu ,  Kurt Halfyard

IPC分类号： B41J2/215 ,  C09D11/102 ,  C09D11/033 ,  H05K3/28 ,  H05K1/03 ,  H05K3/34

CPC分类号： B41J2/215 ,  B41J2/01 ,  C09D11/033 ,  C09D11/102 ,  G03F1/68 ,  H05K1/0353 ,  H05K3/285 ,  H05K3/3452 ,  H05K2201/2081 ,  H05K2203/0545 ,  H05K2203/0783

摘要： A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

公开(公告)号：US20160062230A1

公开(公告)日：2016-03-03

申请号：US14471967

申请日：2014-08-28

申请人： Xerox Corporation

发明人： Yiliang WU ,  Kurt Halfyard

IPC分类号： G03F1/68 ,  B41J2/01

CPC分类号： B41J2/215 ,  B41J2/01 ,  C09D11/033 ,  C09D11/102 ,  G03F1/68 ,  H05K1/0353 ,  H05K3/285 ,  H05K3/3452 ,  H05K2201/2081 ,  H05K2203/0545 ,  H05K2203/0783

摘要： A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

摘要翻译： 一种数字印刷焊接掩模的方法。 该方法包括提供一种焊料掩模油墨组合物，其包括：1）树脂和2）相对于焊料掩模油墨组合物的总重量为至少20重量％的溶剂。 组合物在10s -1的剪切速率和25℃的温度下具有小于1000cps的粘度。使用雾化气体，使用气动雾化器从焊料掩模油墨组合物产生气溶胶流。 气雾剂流被引导通过喷嘴并且使用护套气体聚焦到衬底上，同时改变喷嘴相对于衬底的位置以选择性地沉积焊料掩模图案。 焊接掩模图案被固化。

公开(公告)号：US11142671B2

公开(公告)日：2021-10-12

申请号：US16277664

申请日：2019-02-15

申请人： XEROX CORPORATION

发明人： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Kurt Halfyard

IPC分类号： C09J9/02 ,  C09J163/00 ,  C08L33/12

摘要： Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US10947424B2

公开(公告)日：2021-03-16

申请号：US16277589

申请日：2019-02-15

申请人： XEROX CORPORATION

发明人： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Naveen Chopra ,  Kurt Halfyard ,  Biby Esther Abraham

IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J125/18 ,  C09J129/14 ,  C09J161/28 ,  C09J163/00 ,  C08K5/17 ,  H01B1/22 ,  C08K3/08

摘要： Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.