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公开(公告)号:US20080067891A1
公开(公告)日:2008-03-20
申请号:US11902184
申请日:2007-09-19
申请人: Takashi Matsuda , Shogo Inoue , Michio Miura , Satoru Matsuda , Masanori Ueda , Seiichi Mitobe
发明人: Takashi Matsuda , Shogo Inoue , Michio Miura , Satoru Matsuda , Masanori Ueda , Seiichi Mitobe
IPC分类号: H01L41/08
CPC分类号: H03H9/02559 , H03H9/0057 , H03H9/02574 , H03H9/02929 , H03H9/14538 , H03H9/6469
摘要: An acoustic wave device includes a piezoelectric substrate, a first dielectric film formed on the piezoelectric substrate, and electrodes that are provided on the first dielectric film and excite an acoustic wave, the electrodes including electrode fingers. At least a part of the first dielectric film is cut out between adjacent electrode fingers among the electrode fingers.
摘要翻译: 声波装置包括压电基板,形成在压电基板上的第一电介质膜,以及设置在第一电介质膜上并激发声波的电极,电极包括电极指。 在电极指中相邻的电极指之间切出第一电介质膜的至少一部分。
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公开(公告)号:US07573178B2
公开(公告)日:2009-08-11
申请号:US11898474
申请日:2007-09-12
申请人: Shogo Inoue , Hiroyoshi Yasuda , Michio Miura , Satoru Matsuda , Takashi Matsuda , Masanori Ueda , Seiichi Mitobe
发明人: Shogo Inoue , Hiroyoshi Yasuda , Michio Miura , Satoru Matsuda , Takashi Matsuda , Masanori Ueda , Seiichi Mitobe
IPC分类号: H01L41/08
CPC分类号: H03H9/02559 , H03H9/0222 , H03H9/02574
摘要: An acoustic wave device includes a piezoelectric substrate, comb electrodes formed above the piezoelectric substrate, and a first dielectric film provided so as to cover the comb electrodes, the first dielectric film having empty spaces associated with fingers of the comb electrodes.
摘要翻译: 声波装置包括压电基板,形成在压电基板上方的梳形电极和设置成覆盖梳状电极的第一电介质膜,第一电介质膜具有与梳状电极的指状物相关联的空白空间。
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公开(公告)号:US20060238272A1
公开(公告)日:2006-10-26
申请号:US11407284
申请日:2006-04-20
申请人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
CPC分类号: H03H9/725 , H03H9/0576 , H03H9/72
摘要: A filter includes a filter chip, a laminated portion on which the filter chip is mounted, an input/output terminal provided in the laminated portion, a first U-shaped line pattern provided on a first layer and coupled to the filter chip, the first layer being included in the laminated portion between the filter chip and the input/output terminal, and a second U-shaped line pattern provided on a second layer to substantially overlap the first U-shaped line pattern and coupled to the first U-shaped line pattern and the input/output terminal, the second layer being included in the laminated portion between the first layer and the input/output terminal.
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公开(公告)号:US20060091977A1
公开(公告)日:2006-05-04
申请号:US11262765
申请日:2005-11-01
申请人: Shogo Inoue , Yasuhide Iwamoto , Takashi Matsuda , Masanori Ueda
发明人: Shogo Inoue , Yasuhide Iwamoto , Takashi Matsuda , Masanori Ueda
IPC分类号: H03H9/72
CPC分类号: H03H9/72 , H03H9/0576 , H03H9/725 , H03H2009/0019
摘要: A duplexer that includes: a transmission filter and a reception filter that are connected to a common terminal; and a reactance circuit that is connected to at least one of the transmission filter and the reception filter. The reactance circuit includes an insulating substrate, lumped-constant inductors, and at least one capacitor. The lumped-constant inductors and the capacitor are formed directly on the surface of the insulating substrate.
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公开(公告)号:US07479846B2
公开(公告)日:2009-01-20
申请号:US11262765
申请日:2005-11-01
申请人: Shogo Inoue , Yasuhide Iwamoto , Takashi Matsuda , Masanori Ueda
发明人: Shogo Inoue , Yasuhide Iwamoto , Takashi Matsuda , Masanori Ueda
CPC分类号: H03H9/72 , H03H9/0576 , H03H9/725 , H03H2009/0019
摘要: A duplexer that includes: a transmission filter and a reception filter that are connected to a common terminal; and a reactance circuit that is connected to at least one of the transmission filter and the reception filter. The reactance circuit includes an insulating substrate, lumped-constant inductors, and at least one capacitor. The lumped-constant inductors and the capacitor are formed directly on the surface of the insulating substrate.
摘要翻译: 一种双工器,包括:连接到公共端子的发送滤波器和接收滤波器; 以及与发送滤波器和接收滤波器中的至少一个连接的电抗电路。 电抗电路包括绝缘衬底,集总常数电感器和至少一个电容器。 集中常数电感器和电容器直接形成在绝缘基板的表面上。
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公开(公告)号:US20050237130A1
公开(公告)日:2005-10-27
申请号:US11114090
申请日:2005-04-26
申请人: Yasuhide Iwamoto , Shogo Inoue , Jun Tsutsumi , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Jun Tsutsumi , Masanori Ueda
CPC分类号: H03H9/725 , H03H9/0576 , H03H9/72
摘要: An antenna duplexer includes two surface acoustic wave filters having different center frequencies and a phase matching circuit that matches phases of the two surface acoustic wave filters. A matching line pattern is provided on at least two layers between the two surface acoustic wave filters and transmission and reception terminals, and within an area specified by a sheet-like ground in a multilayered package, the multilayered package comprising multiple layers including a bonding layer on which wire bonding pads are provided for connecting to the two surface acoustic wave filters, and the matching line pattern having no portion provided on bonding layer.
摘要翻译: 天线双工器包括具有不同中心频率的两个表面声波滤波器和匹配两个声表面波滤波器的相位的相位匹配电路。 在两个表面声波滤波器和发送和接收终端之间的至少两层上提供匹配线图案,并且在由多层包装中的片状接地指定的区域内,所述多层封装包括多层,包括结合层 在其上设置用于连接到两个声表面波滤波器的引线接合焊盘,以及没有设置在接合层上的部分的匹配线图案。
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公开(公告)号:US07548135B2
公开(公告)日:2009-06-16
申请号:US11407284
申请日:2006-04-20
申请人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
CPC分类号: H03H9/725 , H03H9/0576 , H03H9/72
摘要: A filter includes a filter chip, a laminated portion on which the filter chip is mounted, an input/output terminal provided in the laminated portion, a first U-shaped line pattern provided on a first layer and coupled to the filter chip, the first layer being included in the laminated portion between the filter chip and the input/output terminal, and a second U-shaped line pattern provided on a second layer to substantially overlap the first U-shaped line pattern and coupled to the first U-shaped line pattern and the input/output terminal, the second layer being included in the laminated portion between the first layer and the input/output terminal.
摘要翻译: 滤波器包括滤波器芯片,安装有滤波器芯片的层叠部分,设置在层叠部分中的输入/输出端子,设置在第一层上并耦合到滤波器芯片的第一U形线图案,第一 包括在过滤芯片和输入/输出端子之间的层叠部分中的第二U形线图案,以及设置在第二层上以与第一U形线图案基本重叠并且耦合到第一U形线 图案和输入/输出端子,第二层被包括在第一层和输入/输出端子之间的层叠部分中。
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公开(公告)号:US07276992B2
公开(公告)日:2007-10-02
申请号:US11114090
申请日:2005-04-26
申请人: Yasuhide Iwamoto , Shogo Inoue , Jun Tsutsumi , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Jun Tsutsumi , Masanori Ueda
IPC分类号: H03H9/72
CPC分类号: H03H9/725 , H03H9/0576 , H03H9/72
摘要: An antenna duplexer includes two surface acoustic wave filters having different center frequencies and a phase matching circuit that matches phases of the two surface acoustic wave filters. A matching line pattern is provided on at least two layers between the two surface acoustic wave filters and transmission and reception terminals, and within an area specified by a sheet-like ground in a multilayered package, the multilayered package comprising multiple layers including a bonding layer on which wire bonding pads are provided for connecting to the two surface acoustic wave filters, and the matching line pattern having no portion provided on bonding layer.
摘要翻译: 天线双工器包括具有不同中心频率的两个表面声波滤波器和匹配两个声表面波滤波器的相位的相位匹配电路。 在两个表面声波滤波器和发送和接收终端之间的至少两层上提供匹配线图案,并且在由多层包装中的片状接地指定的区域内,所述多层封装包括多层,包括结合层 在其上设置用于连接到两个声表面波滤波器的引线接合焊盘,以及没有设置在接合层上的部分的匹配线图案。
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公开(公告)号:US20060132260A1
公开(公告)日:2006-06-22
申请号:US11291775
申请日:2005-12-02
申请人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
IPC分类号: H03H9/70
CPC分类号: H03H9/564 , H03H9/0571 , H03H9/0576 , H03H9/14597 , H03H9/6456 , H03H9/706 , H03H9/72 , H03H9/725
摘要: A duplexer includes: a transmission filter and a reception filter that have different band center frequencies from each other; a phase matching circuit that performs phase matching on the transmission filter and the reception filter; and a laminated package that includes a first layer on which the transmission filter, the reception filter, and the phase matching circuit are mounted. In this duplexer, the first layer includes a first ground line pattern that is connected to a ground of the transmission filter, a second ground line pattern that is connected to a ground of the reception filter, a third ground line pattern that is connected to a ground of the phase matching circuit, and signal line patterns. The laminated package also includes a second layer that is located below the first layer. The second layer includes a partition ground line pattern that is located between the signal line patterns, a signal foot pad for external connection, and a ground foot pad. The first ground line pattern and the second ground line pattern are connected to the partition ground line pattern via the ground foot pad.
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公开(公告)号:US07579927B2
公开(公告)日:2009-08-25
申请号:US11291775
申请日:2005-12-02
申请人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
发明人: Yasuhide Iwamoto , Shogo Inoue , Masanori Ueda
IPC分类号: H03H9/72
CPC分类号: H03H9/564 , H03H9/0571 , H03H9/0576 , H03H9/14597 , H03H9/6456 , H03H9/706 , H03H9/72 , H03H9/725
摘要: A duplexer includes: a transmission filter and a reception filter that have different band center frequencies from each other; a phase matching circuit that performs phase matching on the transmission filter and the reception filter; and a laminated package that includes a first layer on which the transmission filter, the reception filter, and the phase matching circuit are mounted. In this duplexer, the first layer includes a first ground line pattern that is connected to a ground of the transmission filter, a second ground line pattern that is connected to a ground of the reception filter, a third ground line pattern that is connected to a ground of the phase matching circuit, and signal line patterns. The laminated package also includes a second layer that is located below the first layer. The second layer includes a partition ground line pattern that is located between the signal line patterns, a signal foot pad for external connection, and a ground foot pad. The first ground line pattern and the second ground line pattern are connected to the partition ground line pattern via the ground foot pad.
摘要翻译: 双工器包括:具有彼此不同的频带中心频率的发送滤波器和接收滤波器; 在发送滤波器和接收滤波器上执行相位匹配的相位匹配电路; 以及包括其上安装有发送滤波器,接收滤波器和相位匹配电路的第一层的层叠封装。 在该双工器中,第一层包括连接到发送滤波器的接地的第一接地线图案,连接到接收滤波器的接地的第二接地线图案,连接到接收滤波器的接地的第三接地线图案 相位匹配电路的地,以及信号线图案。 层压包装还包括位于第一层下方的第二层。 第二层包括位于信号线图案之间的分隔地线图形,用于外部连接的信号脚垫和接地脚垫。 第一接地线图案和第二接地线图案经由接地脚垫连接到分隔地线图案。
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