公开(公告)号：US20080186682A1

公开(公告)日：2008-08-07

申请号：US11903154

申请日：2007-09-20

申请人： Yoshiaki Sugimura

发明人： Yoshiaki Sugimura

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H05K1/0206 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/043 ,  H05K2203/0455 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49144

摘要： A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on the second surface facing the mounting surface. Viaholes are provided and open in both the soldering land for heat radiation and the land for solder absorption at the opposite ends. Molten solder flows out from the openings of the viaholes and spreads on the land for solder absorption to suppress formation of solder balls. Cream solder is applied to the outer surface of the land for solder absorption to embed the solder and to form a solder layer.

摘要翻译： 双面印刷电路板的第一表面具有用于散热的焊接区域，其用作电子部件的安装表面。 在面向安装表面的第二表面上形成用于焊料吸收的焊盘。 在用于散热的焊接区域和在相对端处焊料吸收的焊盘上设置并开放通孔。 熔融焊料从通孔的开口流出，并在焊盘上铺展焊料吸收，以抑制焊球的形成。 将膏状焊料施加到焊盘的外表面以进行焊料吸收以嵌入焊料并形成焊料层。

公开(公告)号：US20070154824A1

公开(公告)日：2007-07-05

申请号：US11618137

申请日：2006-12-29

申请人： Koichi Sentoku ,  Hideki Ina ,  Koji Mikami ,  Yoshiaki Sugimura ,  Hiroto Yoshii ,  Tomoyuki Miyashita

发明人： Koichi Sentoku ,  Hideki Ina ,  Koji Mikami ,  Yoshiaki Sugimura ,  Hiroto Yoshii ,  Tomoyuki Miyashita

IPC分类号： G03F9/00 ,  G03C5/00

CPC分类号： G03F7/70641 ,  G03F7/70625

摘要： A method for calculating an offset of an exposure dose and a focus position in an exposure apparatus that exposes a substrate via an original includes the steps of obtaining information of a shape of a pattern formed on the substrate using the exposure apparatus, calculating a shift amount between a critical dimension contained in the information of the shape of the pattern and a reference value of the critical dimension, and calculating an offset of the focus position based on the information of the shape of the pattern, and calculating the offset of the exposure dose based on the shift amount and the offset of the focus position.

摘要翻译： 用于计算经由原稿曝光基板的曝光装置中的曝光剂量和聚焦位置的偏移量的方法包括以下步骤：使用曝光装置获得在基板上形成的图案的形状的信息，计算偏移量 在包含在图案形状的信息和临界尺寸的参考值之间的临界尺寸之间，基于图案形状的信息计算焦点位置的偏移量，以及计算曝光剂量的偏移量 基于偏移量和焦点位置的偏移。