公开(公告)号：US11637404B2

公开(公告)日：2023-04-25

申请号：US17256763

申请日：2019-07-11

Applicant: Samtec, Inc.

Inventor： John A. Mongold ,  Jonathan E. Buck ,  Jignesh H. Shah ,  Chadrick P. Faith ,  Randall E. Musser ,  Jean Karlo Williams Barnet ,  Norman S. McMorrow

IPC: H01R13/648 ,  H01R13/6587 ,  H01R12/59 ,  H01R12/79 ,  H01R13/11

Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.

公开(公告)号：USD980801S1

公开(公告)日：2023-03-14

申请号：US29735699

申请日：2020-05-22

Applicant: Samtec, Inc.

Designer： Kevin Bratcher ,  Douglas E. McCartin, Sr. ,  Brian E. Thurston ,  Alexander Wroten

公开(公告)号：US11588262B2

公开(公告)日：2023-02-21

申请号：US17266937

申请日：2019-10-08

Applicant: Samtec, Inc.

Inventor： John A. Mongold ,  Jonathan E. Buck ,  Jignesh H. Shah ,  Chadrick P. Faith ,  Randall E. Musser ,  Jean Karlo Williams Barnet ,  Norman S. McMorrow

IPC: H01R12/79 ,  H01R13/518

Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1 RU panel I/O connector attached to the cable connector.

公开(公告)号：US11569616B2

公开(公告)日：2023-01-31

申请号：US17056486

申请日：2019-07-03

Applicant: Samtec, Inc.

Inventor： Randall E. Musser ,  Jonathan E. Buck

IPC: H01R13/6461 ,  H01R12/71 ,  H01R13/41 ,  H01R13/50 ,  H01R12/57

Abstract: To help maintain and improve signal integrity, a connector housing can include one or more of the following: asymmetric keying features, asymmetric alignment features, and alternating stitched contacts. First and second contact rows and third and fourth contact rows can each have a first row pitch, and the second and the third contact rows can have a second, greater row pitch. First and second keying structures can be positioned non-symmetrically about both longitudinal and median centerlines of the connector housing. If first, second, third, and fourth contacts all lie on a common centerline of the connector housing, the first and the third contacts can be inserted in a first direction, and the second and the fourth contacts can be inserted in a second, opposite direction. First and second contact securing structures can engage the connector housing at different heights of the connector housing.

公开(公告)号：USD973599S1

公开(公告)日：2022-12-27

申请号：US29819343

申请日：2021-12-14

Applicant: Samtec, Inc.

Designer： Jonathan E. Buck ,  John A. Mongold

公开(公告)号：US11536918B2

公开(公告)日：2022-12-27

申请号：US17830265

申请日：2022-06-01

Applicant: Samtec, Inc.

Inventor： Eric J. Zbinden ,  Thomas A. Hall, III

IPC: G02B6/42 ,  G02B6/38

Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

公开(公告)号：USD967031S1

公开(公告)日：2022-10-18

申请号：US29746140

申请日：2020-08-12

Applicant: Samtec, Inc.

Designer： Randall Eugene Musser ,  Jonathan Earl Buck ,  John Mongold

公开(公告)号：US20220254707A1

公开(公告)日：2022-08-11

申请号：US17629916

申请日：2020-07-24

Applicant: SAMTEC, INC.

Inventor： Chihhao CHEN ,  Edwin LOY ,  Yan Yang ZHAO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

公开(公告)号：US20220244475A1

公开(公告)日：2022-08-04

申请号：US17721887

申请日：2022-04-15

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Thomas A. HALL, III

IPC: G02B6/42

Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

公开(公告)号：US20220236504A1

公开(公告)日：2022-07-28

申请号：US17721863

申请日：2022-04-15

Applicant: Samtec, Inc.

Inventor： Eric J. Zbinden ,  Thomas A. Hall, III

IPC: G02B6/42

Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.