公开(公告)号：US08464593B2

公开(公告)日：2013-06-18

申请号：US12786233

申请日：2010-05-24

申请人： Liji Huang ,  Wei Ching ,  Chih-Chang Chen

发明人： Liji Huang ,  Wei Ching ,  Chih-Chang Chen

IPC分类号： G01F1/00 ,  G01F1/68

CPC分类号： G01F1/692 ,  F41G1/40 ,  F41G1/46 ,  F41G1/473 ,  G01F1/6845

摘要： An apparatus integrated with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure air flow velocity on targeting correction for projectiles arms is disclosed in the present invention. The air flow velocity component perpendicular to the travel direction of bullets with respect to projectile arm body (e.g. bullets, shells, or arrows) has main effect to the targeting accuracy. Such effect is pretty much determined by the wind speed and the projectile travel distance. The integration with MEMS mass flow sensor has made the invented apparatus possible to be compact, low power consumption, low cost and high accuracy. The low power consumption characteristic of MEMS mass flow sensor is especially crucial for making the apparatus of present invention feasible by battery operated.

摘要翻译： 在本发明中公开了一种与微加工（即微机电MEMS机械系统）硅传感器集成的装置，用于测量射弹臂的瞄准校正时的空气流速。 相对于射弹臂体（例如子弹，外壳或箭头），子弹的行进方向垂直的气流速度分量对瞄准精度有主要影响。 这种影响几乎取决于风速和射弹行程距离。 与MEMS质量流量传感器的集成使得本发明的设备可以紧凑，低功耗，低成本和高精度。 MEMS质量流量传感器的低功耗特性对于通过电池供电使本发明的装置变得可行是特别关键的。

公开(公告)号：US20110030468A1

公开(公告)日：2011-02-10

申请号：US12538337

申请日：2009-08-10

申请人： Chih-Chang Chen ,  Gaofeng Wang ,  Liji Huang ,  Yahong Yao

发明人： Chih-Chang Chen ,  Gaofeng Wang ,  Liji Huang ,  Yahong Yao

IPC分类号： G01F1/68

CPC分类号： G01F1/6845 ,  G01F1/692

摘要： The present invention is generally related to a novel micromachining thermal mass flow sensor and, more particularly, to a device incorporated with high strength and robust characteristics, which therefore is capable of operating under harsh environments. The new disclosed sensor is made of essential material which can provide robust physical structure and superior thermal properties to support the flow measuring operation. The invented thermal mass flow sensor is featuring with the advantages of micro-fabricated devices in terms of compact size, low power consumption, high accuracy and repeatability, wide dynamic range and easiness for mass production, which could avoid the drawbacks of fragility and vulnerability.

摘要翻译： 本发明通常涉及一种新颖的微加工热质量流量传感器，更具体地说涉及具有高强度和鲁棒特性的装置，因此能够在恶劣环境下运行。 新公开的传感器由必需材料制成，其可以提供鲁棒的物理结构和优异的热性能来支持流量测量操作。 本发明的热质量流量传感器具有结构紧凑，功耗低，精度高，重复性好，动态范围广，批量生产容易的微型装置优点，可以避免脆弱性和脆弱性的缺点。

公开(公告)号：US07780343B2

公开(公告)日：2010-08-24

申请号：US11774771

申请日：2007-07-09

申请人： Chih-Chang Chen ,  Yahong Yao ,  Gaofeng Wang ,  Liji Huang

发明人： Chih-Chang Chen ,  Yahong Yao ,  Gaofeng Wang ,  Liji Huang

IPC分类号： G01N25/00 ,  G01K3/00 ,  G01K7/00

CPC分类号： G01N25/20 ,  G01F1/6845 ,  G01F1/692

摘要： A device with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure gas or liquid concentration in a binary mixture formality is disclosed in the present invention. A process for fabricating the said MEMS silicon concentration sensor, which thereby can greatly reduce the sensor fabrication cost by a batch production, is revealed as well. This MEMS process can mass-produce the sensors on silicon substrate in the ways of small size, low power, and high reliability. In addition to the gas or liquid concentration measurement, the present invention further discloses that the said sensor can also readily measure gas or liquid mass flow rate while record the concentration data, which is not viable by other related working principle.

摘要翻译： 在本发明中公开了一种具有微加工（a.k.a. MEMS，Micro Electro Mechanical Systems）硅传感器的装置，用于测量二元混合物形式中的气体或液体浓度。 也可以揭示制造所述MEMS硅浓度传感器的方法，从而能够通过批量生产大大降低传感器制造成本。 该MEMS工艺可以以小尺寸，低功率和高可靠性的方式批量生产硅衬底上的传感器。 除了气体或液体浓度测量之外，本发明还公开了所述传感器还可以容易地测量气体或液体质量流量，同时记录其他相关工作原理不可行的浓度数据。

公开(公告)号：US07536908B2

公开(公告)日：2009-05-26

申请号：US11157604

申请日：2005-06-21

申请人： Gaofeng Wang ,  Chih-Chang Chen ,  Yahong Yao ,  Liji Huang

发明人： Gaofeng Wang ,  Chih-Chang Chen ,  Yahong Yao ,  Liji Huang

IPC分类号： G01F1/68

CPC分类号： G01F1/6845

摘要： An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation . This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed. Before backside etching the bulk silicon, rectangular openings are formed on the dielectric thin-film layers by applying a plasma etching to separate the area of heater and sensing elements from the rest of the membrane. This mass flow sensor is operated with two sets of circuits, a first circuit for measuring a flow rate in a first range of flow rates and a second circuit for measuring a flow rate in a second range of flow rates, to significantly increase range of flow rate measurements, while maintains a high degree of measurement accuracy.

摘要翻译： 通过在取向<100>的N型或P型硅衬底上进行微加工工艺的方法制造集成的质量流量传感器。 该质量流量传感器包括中央薄膜加热器和一对薄膜热敏元件，以及用于支撑加热器的热隔离膜和与基板基板接触的传感器。 质量流量传感器布置成集成在相同的硅衬底上以形成一维或二维阵列，以便扩大动态测量范围。 对于每个传感器，热隔离膜通过包括首先在衬底上沉积电介质薄膜层然后用TMAH或KOH对体硅进行背面蚀刻工艺或进行干等离子体蚀刻的步骤来形成 直到底部介电薄膜层暴露。 在背面蚀刻体硅之前，通过施加等离子体蚀刻在电介质薄膜层上形成矩形开口，以将加热器的区域和感测元件与膜的其余部分分开。 该质量流量传感器用两组电路操作，第一电路用于测量第一流量范围内的流量，以及用于测量在第二流量范围内的流量的第二电路，以显着增加流量范围 速率测量，同时保持高度的测量精度。

公开(公告)号：US20200264022A1

公开(公告)日：2020-08-20

申请号：US16278962

申请日：2019-02-19

申请人： Chih-Chang Chen ,  Liji Huang ,  Yahong Yao

发明人： Chih-Chang Chen ,  Liji Huang ,  Yahong Yao

IPC分类号： G01F1/684

摘要： The micromachined liquid flow sensor devices are enclosed with silicon nitride film as passivation layer to protect device from penetration of liquid into device and avoid the damages of erosion or short circuit etc. One thin layer of silicon dioxide is deposited underneath the silicon nitride layer to enhance the adhesion and reliability of the passivation layer for various applications. The incorporation of silicon dioxide film had successfully provided reliable passivation protection especially for microfluidic devices application. In order to avoid flow turbulence caused by wire bonding wires, the wire bonding wires are omitted by deploying through-substrate conductive vias whereas connected to the carrier printed circuit board of sensor chip. The present invention disclosed a novel micromachining process and designed structure to form hermit sealing between the sensor chip and the carrier printed circuit board. The hermit sealing underneath the sensor chip can protect the bonding connections from exposing to liquid flow media and avoid short circuitry or induce undesired chemical corrosion. More particularly, the embodiments of the current invention relates to formation steps of a micromachined liquid flow sensor including passivation and protection of bonding connection to its carrier printed circuit board, which is therefore capable to offer superb accuracy and reliability for liquid flow measurement.

公开(公告)号：US08336392B2

公开(公告)日：2012-12-25

申请号：US12787268

申请日：2010-05-25

申请人： Liji Huang ,  Jian Luo ,  Changming Jiang ,  Yenan Liu ,  Wenhong Deng ,  Jialuo Jack Xuan ,  Chih-Chang Chen

发明人： Liji Huang ,  Jian Luo ,  Changming Jiang ,  Yenan Liu ,  Wenhong Deng ,  Jialuo Jack Xuan ,  Chih-Chang Chen

IPC分类号： G01F1/56

CPC分类号： G01F1/6845

摘要： Nowadays many electronic devices, such as LCD projector, computer servers, and air fresher etc. require reliable air cooling system to reduce the risk of electronics damage caused by overheating. The present invention disclosed an apparatus integrated with air flow sensor as an alarm apparatus for air flow clog detection. The major prior approach for air flow circulation failure detection is based on an indirect measurement method of temperature monitoring on surrounding environments, which method is suffering from the slow response and poor identification of real-time situation. The present invention will demonstrate the advantages by directly monitoring air flow over by indirectly monitoring the surrounding temperature as for the purpose of preventing air flow path clog.

摘要翻译： 如今，诸如液晶投影仪，电脑服务器和空气清新器等电子设备需要可靠的空气冷却系统，以减少过热引起的电子设备损坏的风险。 本发明公开了一种与空气流量传感器集成的装置，作为气流堵塞检测的报警装置。 气流循环故障检测的主要方法是基于对周围环境进行温度监测的间接测量方法，该方法受到响应缓慢和实时状况识别不良。 本发明将通过间接地监测周围温度来直接监测气流的优点，以防止气流通道堵塞。

公开(公告)号：US08242024B2

公开(公告)日：2012-08-14

申请号：US12562979

申请日：2009-09-18

申请人： Chih-Chang Chen

发明人： Chih-Chang Chen

IPC分类号： H01L21/302

CPC分类号： H01L21/76816

摘要： Many current micromachining devices are integrated with materials such as very thick layer of polyimide (10 to 100 um) to offer essential characteristics and properties for various applications; it is inherently difficult and complicated to provide reliable metal interconnections between different levels of the circuits. The present invention is generally related to a novel micromachining process and structure to form metal interconnections in integrated circuits or micromachining devices which are incorporated with thick polyimide films. More particularly, the embodiments of the current invention relates to formation of multi-step staircase structure with tapered angle on polyimide layer, which is therefore capable of offering superb and reliable step coverage for metallization among different levels of integrated circuits, and especially for very thick polyimide layer applications.

摘要翻译： 许多当前的微加工装置与诸如非常厚的聚酰亚胺（10至100μm）的材料集成，以提供用于各种应用的基本特征和性质; 在不同级别的电路之间提供可靠的金属互连本身是困难和复杂的。 本发明通常涉及一种新颖的微加工工艺和结构，以在集成电路或微加工装置中形成金属互连，其结合有聚酰亚胺厚膜。 更具体地，本发明的实施例涉及在聚酰亚胺层上形成具有锥角的多步阶梯结构，因此能够为不同级别的集成电路之间的金属化提供极好且可靠的阶梯覆盖，特别是对于非常厚的 聚酰亚胺层应用。

公开(公告)号：US20120001273A1

公开(公告)日：2012-01-05

申请号：US12830237

申请日：2010-07-02

申请人： Chih-Chang Chen ,  Liji Huang

发明人： Chih-Chang Chen ,  Liji Huang

IPC分类号： H01L29/66

CPC分类号： G01F1/6842 ,  G01F1/6845

摘要： The current invention disclosed a micro-package design for packaging of micromachining liquid flow sensor. The package in present invention is fabricated with micromachining or micro-molding approach, which can greatly reduce the manufacturing cost due to the batch production. The micro-package design provides packaging solution for general micromachining liquid flow sensors that can enable various microfluidic applications while reaching the cost threshold for a disposable unit.

摘要翻译： 本发明公开了一种用于微加工液体流量传感器的包装的微封装设计。 本发明的封装采用微加工或微型成型方法制造，这可以大大降低由于批量生产而产生的制造成本。 微封装设计提供了一般微加工液体流量传感器的封装解决方案，可以实现各种微流体应用，同时达到一次性单元的成本阈值。

公开(公告)号：US20110070742A1

公开(公告)日：2011-03-24

申请号：US12562979

申请日：2009-09-18

申请人： Chen Chih-Chang

发明人： Chen Chih-Chang

IPC分类号： H01L21/3065

CPC分类号： H01L21/76816

摘要： Many current micromachining devices are integrated with materials such as very thick layer of polyimide (10 to 100 um) to offer essential characteristics and properties for various applications; it is inherently difficult and complicated to provide reliable metal interconnections between different levels of the circuits. The present invention is generally related to a novel micromachining process and structure to form metal interconnections in integrated circuits or micromachining devices which are incorporated with thick polyimide films. More particularly, the embodiments of the current invention relates to formation of multi-step staircase structure with tapered angle on polyimide layer, which is therefore capable of offering superb and reliable step coverage for metallization among different levels of integrated circuits, and especially for very thick polyimide layer applications.

摘要翻译： 许多当前的微加工装置与诸如非常厚的聚酰亚胺（10至100μm）的材料集成，以提供用于各种应用的基本特征和性质; 在不同级别的电路之间提供可靠的金属互连本身是困难和复杂的。 本发明通常涉及一种新颖的微加工工艺和结构，以在集成电路或微加工装置中形成金属互连，其结合有聚酰亚胺厚膜。 更具体地，本发明的实施例涉及在聚酰亚胺层上形成具有锥角的多步阶梯结构，因此能够为不同级别的集成电路之间的金属化提供极好且可靠的阶梯覆盖，特别是对于非常厚的 聚酰亚胺层应用。

公开(公告)号：US20090158859A1

公开(公告)日：2009-06-25

申请号：US11960261

申请日：2007-12-19

申请人： Liji Huang ,  Chih-Chang Chen ,  Yahong Yao ,  Gaofeng Wang

发明人： Liji Huang ,  Chih-Chang Chen ,  Yahong Yao ,  Gaofeng Wang

IPC分类号： G01F1/78 ,  B05D1/00

CPC分类号： G01F1/6845 ,  G01F1/6888 ,  G01F15/006

摘要： The current invention generally relates to Micro Electro Mechanical Systems (MEMS) thermal mass flow sensors for measuring the flow rate of a flowing fluid (gas/liquid) and the methods of manufacturing on single crystal silicon wafers. The said mass flow sensors have self-cleaning capability that is achieved via the modulation of the cavity of which the sensing elements locate on the top of the cavity that is made of a silicon nitride film; alternatively the sensing elements are fabricated on top of a binary silicon nitride/conductive polycrystalline silicon film under which is a porous silicon layer selective formed in a silicon substrate. Using polycrystalline silicon or the sensing elements as electrodes, an acoustic wave can be generated across the porous silicon layer which is also used for the thermal isolation of the sensing elements. The vibration or acoustic energy is effective to remove foreign materials deposited on top surface of the sensing elements that ensure the accuracy and enhance repeatability of the thermal mass flow sensing.

摘要翻译： 本发明通常涉及用于测量流动流体（气体/液体）的流量的微机电系统（MEMS）热质量流量传感器以及在单晶硅晶片上的制造方法。 所述质量流量传感器具有自清洁能力，其通过其感测元件位于由氮化硅膜制成的空腔顶部上的空腔的调制而实现; 或者，感测元件制造在二元氮化硅/导电多晶硅膜的顶部，在二元氮化硅/导电多晶硅膜的下方是选择性地形成在硅衬底中的多孔硅层。 使用多晶硅或感测元件作为电极，可以跨多孔硅层产生声波，其也用于感测元件的热隔离。 振动或声能有效地去除沉积在感测元件的顶表面上的异物，以确保精确度并增强热质量流量感测的重复性。