Abstract:
A method of remotely measuring the temperature of a body, such as a semiconductor wafer, whose transparency varies with both wavelength and temperature and is characterized by an optical absorption edge. The body is illuminated at wavelengths on either side of the optical absorption edge. Based on the measured reflectivity at wavelengths shorter than the optical absorption edge, the direct reflectivity at wavelengths longer than the optical absorption edge is predicted and used to estimate the component of total reflectivity, at wavelengths longer than the optical absorption edge, which corresponds to propagation through the body and reflection back through the body. Light reflected from the body, measured in an "active" channel, is distinguished from light emitted passively by the body and measured in a "passive" channel. In the case of an opaque body, this allows the estimation of the emissivity of the body, and a temperature estimate based on Planck's law.
Abstract:
A system and method of measurement of emissivity and radiance of a wafer in a rapid thermal processing chamber enables determination of wafer temperature and control of temperature of the wafer. Mirrors enclose the chamber and reflect radiation from lamps within the chamber to heat the workpiece of interest. One or more viewing ports are provided in one of the mirrors to allow for the egress of radiant energy emitted by the wafer. The wavelength of the exiting radiation is selected by an optical filter having a passband which passes radiation at wavelengths emitted by the wafer while excluding radiation emitted by heating lamps. A chopper having surface regions differing in their reflectivity and transmissivity is positioned along an optical path of radiation propagating through the one or more ports, this resulting in a pulsation of detected radiation. The ratio of the detected intensities of the radiation pulses is used to determine wafer reflectance based on reflectivity and transmissivity of the reflective portion of the chopper. The maximum intensity of radiation is also taken as a measure of radiance. The reflectance is employed to calculate the emissivity, and the emissivity in combination with the radiance are employed to calculate the wafer temperature.
Abstract:
Thermal imaging chopper (20) may comprise a disk (40) formed of a thermally transmitting material. The disk (40) may include a structure (44) operable to randomly scatter thermal radiation of the scene (14).
Abstract:
A pyroelectric IR sensor equipped with a chopper for opening and closing a shielding plate so that infrared rays emitted from an object are allowed to be incident onto a pyroelectric sensor unit and intercepted therefrom, and having a structure capable of providing a large shielding width for the shielding plate without enlarging the chopper. Piezoelectric members are formed on a thin elastic sheet composed of a planar sheet having a tip to which a shielding plate is attached, except for a partial region which functions to magnify oscillations for enlarging displacement of the shielding plate.
Abstract:
A thermal condition sensor system monitors equipment such as aircraft engines. The thermal condition sensor system includes a collector which collects radiation from the equipment and a detector assembly which detects collected radiation over a discriminating spectral band region in at least three spectral bands and generates signals representative of detected radiation in each spectral band. A processor receives the signals and generates a report of the thermal conditions of the equipment using interband comparison of the at least three spectral bands.
Abstract:
A method for measuring the surface temperature of a wafer substrate and a heat-treating apparatus are both used in a semiconductor device-manufacturing process wherein a reference light including infrared rays is intermittently emitted toward a wafer substrate. Infrared rays of a plurality of different types whose wavelengths are shorter than 1 .mu.m and differ from each other are selectively detected from the reference light emitted toward the wafer substrate, the reference light reflected by the wafer substrate, and the light radiated from the wafer substrate itself. On the basis of the detection performed with respect to the emitted reference light, the reflected reference light and the radiated infrared rays, the surface temperature of the wafer substrate is calculated. A substrate-heating element is controlled on the basis of the calculated temperature.
Abstract:
By rotating a diaphragm in front of a pickup device, for example a pyroelectric vidicon, eddy currents are generated in the diaphragm if the diaphragm is made of a metal. These eddy currents are generated as a result of the interaction between the moving diaphragm and the magnetic field of the deflection coils of the vidicon. If the diaphragm is instead made of an insulating material, separation of charges occurs on it as a result electrostatic generation, due to the interaction between the diaphragm and the electrostatic field of the vidicon. Compensation of the charge separation causes interference in the video signal. According to the invention a diaphragm of an insulating material is used which is covered with a pattern of electrically conductive tracks or a very high resistance layer. As a result of this no eddy currents and no noteworthy electrostatic charges can occur, so that an interference-free video signal is obtained.
Abstract:
Apparatus for measuring the temperature at the surface of an object by measurement of the infrared radiation emitted from the surface comprises a variably heated compensating radiator located in spaced relation to the surface of the object and a rotatable chopper wheel interposed between the object surface and the compensating radiator. The side of the chopper wheel facing towards the compensating radiator is made radiation reflective and a radiation detector is positioned to receive in alternation the infrared radiation emitted from the surface of the object and which passes intermittently through the rotating chopper wheel and infrared radiation emitted by the compensating radiator and which is reflected intermittently into the detector from the reflective side of the chopper wheel. The detector produces at its output an alternating current signal determined by any temperature differential existing between the object and compensating radiator, and the heat supply to the compensating radiator is varied in accordance with the signal in such sense as to reduce the signal to zero whereby the temperature of the compensating radiator then equals the temperature of the object.
Abstract:
A radiometer apparatus suitable for use on a supersonic aircraft for clear-air turbulence detection includes means for operating at four selected wavelengths within an atmospheric absorption band, for example the 15 Mu band of carbon dioxide. At any particular height of the aircraft each of a set of filters used to select the four selected wavelengths has a weighting function which depends on the effective absorption coefficient of the atmosphere at that wavelength and each indicates which part of the atmosphere ahead provides a significant contribution to the radiation measured by the apparatus. At longer wavelengths the atmosphere is opaque and the radiometer apparatus receives radiation from immediately in front of the aircraft. By generating suitable functions from the outputs of radiation passed by two or more of the filters it is possible to detect turbulence of the type looked for.