Method for producing multichannel plates
    11.
    发明授权
    Method for producing multichannel plates 失效
    生产多通道板的方法

    公开(公告)号:US4563250A

    公开(公告)日:1986-01-07

    申请号:US708841

    申请日:1985-03-06

    CPC classification number: H01J43/246 H01J9/125 H01J2201/32

    Abstract: A method for producing a multichannel plate containing a plurality of generally parallel channels for use in structures for amplifying or converting optical images or other two-dimensional signal patterns by secondary electron multiplication, which method includes:producing a positive mold of the plate, by the steps of: (i) providing a body having the external shape of the plate to be produced and made of a material whose ability to be removed from the body is altered by exposure to a selected radiation; (ii) irradiating the body with the selected radiation in a pattern corresponding to the plate to be produced and in a manner to render the portions of the body corresponding to the channels more easily removable than the remaining portions of the body; and (iii) removing the more easily removable portions of the body;forming a metal negative mold, by the steps of: (i) attaching the positive mold to a metal electrode; (ii) electrolytically depositing metal on the electrode and in the openings created in the positive mold by said step of removing more easily removable portions; and (iii) removing the positive mold from the deposited metal; andforming the multichannel plate from the negative mold.

    Abstract translation: 一种用于制造多通道板的方法,所述多通道板包含多个大致平行的通道,用于通过二次电子倍增放大或转换光学图像或其它二维信号图案的结构,该方法包括:通过 步骤:(i)提供具有待生产的板的外部形状的主体,并且由通过暴露于所选择的辐射而改变其从身体移除的能力的材料制成; (ii)以对应于要产生的板的图案照射具有所选择的辐射的身体,并以使身体对应于通道的部分比身体的其余部分更容易拆除的方式; 和(iii)去除身体更容易拆卸的部分; 通过以下步骤形成金属阴模:(i)将正模附接到金属电极; (ii)通过去除更容易拆卸的部分的步骤在电极上和在正模中产生的开口中电解沉积金属; 和(iii)从沉积的金属中去除正模; 并从阴模模制多孔板。

    Direct view device
    12.
    发明授权
    Direct view device 失效
    直接查看设备

    公开(公告)号:US4126813A

    公开(公告)日:1978-11-21

    申请号:US815526

    申请日:1969-04-09

    CPC classification number: H01J43/24 H01J9/125 H01J2201/32

    Abstract: The invention includes an electron tube such as an image intensifier which utilizes a channel-type electron multiplier. The multipler is made of a perforated glass plate made in a manner such that secondary emission may be produced at the interior surfaces of the holes through the plate. Primary electrons are introduced to the holes at one end and a much larger emission emanates from the other end. Conductive layers on each side of the plate have holes in registration with the plate holes. The conductive layers are maintained at potentials to accelerate electron flow through the holes. In accordance with the present invention, a third conductive layer is provided at the output side. When the third conductive layer is maintained negative, resolution is improved.

    Abstract translation: 本发明包括使用通道型电子倍增器的诸如图像增强器的电子管。 乘法器由穿孔玻璃板制成,其方式使得可以在穿过板的孔的内表面处产生二次发射。 一次电子在一端被引入到孔中,并且从另一端发出更大的发射。 板的每一侧的导电层具有与板孔对准的孔。 导电层保持电位以加速通过孔的电子流。 根据本发明,在输出侧设置第三导电层。 当第三导电层保持为负时,分辨率提高。

    Method of forming a metal pattern on an insulating substrate
    13.
    发明授权
    Method of forming a metal pattern on an insulating substrate 失效
    在绝缘基板上形成金属图案的方法

    公开(公告)号:US4083710A

    公开(公告)日:1978-04-11

    申请号:US761427

    申请日:1977-01-21

    CPC classification number: B23K20/04 B23K28/00 C03C27/02 H01J9/125 H01J2201/32

    Abstract: A first die having a relief pattern is employed to provide predetermined shape and relative positioning for a first plurality of metal strips. A second die is similarly employed for a second plurality of metal strips Without removing the metal strips from the dies, the strips, still in predetermined shape and position, are bonded to opposing surfaces of an insulating substrate. The bonding process includes bringing the dies, and hence, the metal strips, into contact with the opposing surfaces of the insulating substrate. The bonding process may include the application of heat, pressure, and an electrical field across the bonding interfaces, e.g., anodic bonding.

    Abstract translation: 使用具有浮雕图案的第一模具来为第一多个金属条提供预定的形状和相对定位。 类似地,第二个裸片用于第二多个金属条,而不将金属条从模具中移除,但是仍然处于预定形状和位置的条被接合到绝缘基板的相对表面上。 接合工艺包括将金属片和金属带导入与绝缘基板的相对表面接触。 接合过程可以包括在结合界面上施加热,压力和电场,例如阳极结合。

    Tube uniting with fusion barrier
    14.
    发明授权
    Tube uniting with fusion barrier 失效
    TUBE UNITING WITH FUSION BARRIER

    公开(公告)号:US3622292A

    公开(公告)日:1971-11-23

    申请号:US3622292D

    申请日:1969-06-03

    Inventor: FLECK HORST G

    Abstract: The invention herein described was made in the course of or under a contract or subcontract thereunder with the Department of the Army. An illustrative embodiment of the invention is directed to method and apparatus for manufacturing microchannel devices. Typically, individual glass tubes are suspended vertically in a furnace. A vacuum is drawn within the furnace so that the inner surfaces of the tubes, exposed to atmospheric pressure, will not collapse during heating and drawing. At temperature, the bundle is drawn in order to elongate and reduce the bundle cross section by a ratio of about 50 to 1. The elongated bundle is cut into lengths that are stacked together within a tube of glass that has a higher melting point than the glass in the drawn lengths. The channels are once more sealed and the adjacent hexagonal lengths are subjected to a secondary fusion process prior to slicing into thin discs. To prevent the inner lengths from cracking during cooling, the inner surface of the tube is treated with a fusion inhibiting compound (e.g., boron nitride).

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