Defect detecting device, defect detecting method, and computer-readable recording medium

    公开(公告)号:US10788320B2

    公开(公告)日:2020-09-29

    申请号:US16329029

    申请日:2017-08-23

    申请人: NEC CORPORATION

    发明人: Jun Takada

    摘要: A defect detecting device 10 includes an overall displacement measurement unit 11 that measures, based on observation data output from an observation device that observes a target object, a displacement of an overall movement of the target object relative to an observation point at set time intervals, as an overall displacement; a specific period detection unit 12 that detects a specific period in which the measured overall displacement is in a specific state within a period in which observation is performed; a partial displacement measurement unit 13 that measures, displacements at a plurality of points set on the target object in the detected specific period, as partial displacements; and a defect detection unit 14 that detects a defect in the target object, based on the acquired at least one of the temporal changes and the spatial distributions of the partial displacements.

    ROTARY TABLE AND ROUNDNESS MEASURING MACHINE
    13.
    发明申请

    公开(公告)号:US20200300596A1

    公开(公告)日:2020-09-24

    申请号:US16819799

    申请日:2020-03-16

    发明人: Junsuke Yasuno

    IPC分类号: G01B5/00 G01B21/30 G12B5/00

    摘要: A rotary table includes: a stage; a rotary base configured to be rotated around a rotation center axis; a support mechanism that is disposed on the rotary base and supports the stage; a leveling adjustment mechanism configured to perform a leveling adjustment of the stage; and a transfer mechanism configured to transfer a rotative force of the rotary base to the stage. The transfer mechanism includes: an annular transfer member configured to receive the support mechanism therethrough; a first connecting mechanism that connects the transfer member and the rotary base and is rotatable around the first axis; and a second connecting mechanism that connects the transfer member and the stage and is rotatable around a second axis defined in a direction intersecting the first axis.

    System and method for performing manufacturing quality control with the aid of a digital computer

    公开(公告)号:US10705515B2

    公开(公告)日:2020-07-07

    申请号:US16417385

    申请日:2019-05-20

    申请人: Net-Inspect, LLC

    IPC分类号: G05B19/418 G01B21/30

    摘要: A system and method for performing manufacturing quality control with the aid of a digital computer are provided. A specification for manufacturing a part feature is maintained in a storage, the specification including a target value. Measurements for the feature on a plurality of parts manufactured in accordance with the specification using a manufacturing process are maintained in the storage. A score associated with the manufacturing process is calculated based on how close at least some of the measurements associated with the manufacturing process are to the target value. The score is displayed. A recommendation of at least one corrective action to the manufacturing process to remedy one or more causes of non-conformance that are associated with the score is provided, wherein the manufacturing process is changed based on the recommendation to remedy one or more of the causes for non-conformance.

    LINE EDGE ROUGHNESS ANALYSIS USING ATOMIC FORCE MICROSCOPY

    公开(公告)号:US20200096332A1

    公开(公告)日:2020-03-26

    申请号:US16362283

    申请日:2019-03-22

    IPC分类号: G01B21/30 G01Q60/24

    摘要: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.

    MEASUREMENT OF FLATNESS OF A SUSCEPTOR OF A DISPLAY CVD CHAMBER

    公开(公告)号:US20200071823A1

    公开(公告)日:2020-03-05

    申请号:US16114558

    申请日:2018-08-28

    IPC分类号: C23C16/458 G01B21/30

    摘要: The present disclosure relates to a flexible support to aid in a measurement of flatness of a susceptor. The flexible support has a first support block having a substantially flat upper surface and a lower surface having a first aperture formed therein. The flexible support further has a second support block having a substantially flat lower surface and an upper surface having a second aperture formed therein. The flexible support further has a support pin configured to be receivable in the first aperture and the second aperture, the support pin configured to retain the first support block and the second support block in a spaced apart relation while allowing restricted motion of the first support block relative to the second support block via deformation of the support pin. The flexible support further has a guide disposed between the first support block and the second support block, the guide configured to allow the first support block and the second support block to move axially relative to the guide.

    Method for evaluating warpage of wafer and method for sorting wafer

    公开(公告)号:US10345102B2

    公开(公告)日:2019-07-09

    申请号:US15305222

    申请日:2015-03-12

    发明人: Hisayuki Saito

    摘要: A method for evaluating warpage of a wafer, includes measuring the warpage of the wafer that is in a free state without suction and determining, from measured warpage data, a wafer warpage amount A between two points Q1 and Q2 and a wafer warpage amount B between two points R1 and R2, the points Q1 and Q2 being located on a straight line passing through an arbitrary point P in a wafer plane and a distance “a” away from the point P, the points R1 and R2 being located on the same straight line and a distance “b” away from the point P, the distance “b” differing from the distance “a”, calculating, from the wafer warpage amount A and the wafer warpage amount B, a difference in wafer warpage amount at the point P, and evaluating the warpage on the basis of the difference in wafer warpage amount.

    Method for shape classification of an object

    公开(公告)号:US10215560B2

    公开(公告)日:2019-02-26

    申请号:US14984670

    申请日:2015-12-30

    摘要: A method for shape classification of an object is provided. Shape categories are provided which specify a plane and points therein relative to the object, and also specify at least one limit coordinate for each such point, the limit coordinate defining a boundary in a direction normal to the plane for the shape of the object considered in order for the object to be classified into a respective shape category. The shape categories can be provided by a user, making the method very flexible. The shape categories can in particular be derived from a set of samples of objects representing a shape category to be defined. For classification, the position of a surface of the object is measured at each of the points defined in the shape category, and the result is compared with the corresponding limit coordinate.