公开(公告)号：US09977464B2

公开(公告)日：2018-05-22

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  H01Q1/24 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/364 ,  B05D1/02 ,  B23K26/402 ,  B24C1/08 ,  G04B37/00 ,  B23K103/00

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US09947901B2

公开(公告)日：2018-04-17

申请号：US15483895

申请日：2017-04-10

Applicant: Apple Inc.

Inventor： Anna-Katrina Shedletsky ,  Paul S. Drzaic ,  Erik G. de Jong ,  Fletcher R. Rothkopf

IPC: H01L51/52 ,  H01L51/50 ,  H01L27/32 ,  G02F1/133

CPC classification number: H01L51/5284 ,  G02F1/13318 ,  G02F2001/13312 ,  G06F1/1637 ,  H01L27/3227 ,  H01L27/3269 ,  H01L51/5012 ,  H01L51/5218 ,  H01L51/5234 ,  H01L51/5253 ,  H01L51/5271 ,  H01L51/5281 ,  H01L2251/5315

Abstract: An electronic device is provided with a display and a light sensor that receives light that passes through the display. The display includes features that increase the amount of light that passes through the display. The features may be translucency enhancement features that allow light to pass directly through the display onto a light sensor mounted behind the display or may include a light-guiding layer that guides light through the display onto a light sensor mounted along an edge of the display. The translucency enhancement features may be formed in a reflector layer or an electrode layer for the display. The translucency enhancement features may include microperforations in a reflector layer of the display, a light-filtering reflector layer of the display, or a reflector layer of the display that passes a portion of the light and reflects an additional portion of the light.

公开(公告)号：US20170322357A1

公开(公告)日：2017-11-09

申请号：US15657011

申请日：2017-07-21

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Jean-Pierre S. Guillou

IPC: G02B5/22 ,  G02B5/30

CPC classification number: G02B5/223 ,  G02B5/3025

Abstract: An organic light-emitting diode display may have an active area that contains pixels and an inactive area. The inactive area of the display may be provided with opaque masking layer structures having an appearance that matches the active area of the display when the pixels are off and are not displaying images. The opaque masking layer structures may include a polymer layer coated with a layer of metal. The display may have pixels with anodes and a cathode layer. The anodes may be formed from metal pads. Dummy structures such as a dummy cathode and dummy anodes may be formed in the inactive area. A circular polarizer in the display may overlap the active area and the inactive area or may overlap the active area without overlapping some or all of the inactive area.

公开(公告)号：US09793599B2

公开(公告)日：2017-10-17

申请号：US14640902

申请日：2015-03-06

Applicant: Apple Inc.

Inventor： Carlo Di Nallo ,  Erik G. de Jong ,  Jayesh Nath ,  Mattia Pascolini ,  Tang Y. Tan ,  Yiren Wang ,  Zheyu Wang

IPC: H01Q1/24 ,  H01Q9/42 ,  H01Q5/321 ,  H01Q5/328 ,  H01Q5/335

CPC classification number: H01Q1/243 ,  H01Q5/321 ,  H01Q5/328 ,  H01Q5/335 ,  H01Q9/42

Abstract: An electronic device may have components mounted in a housing. The device may include wireless transceiver circuitry and antenna structures. A display may be mounted in the housing. The display may have a cover layer having an inner surface with a recess. The recess may run along a peripheral edge of the cover layer. An antenna structure such as an inverted-F antenna resonating element may be formed from a metal trace on a dielectric antenna carrier. The resonating element may be mounted in the recess without adhesive. Conductive vias may pass through the dielectric carrier. Metal members with dimples may be soldered to a flexible printed circuit and may be used to ground metal traces on the carrier and the flexible printed circuit to the housing when the carrier is attached to the housing with fasteners.

公开(公告)号：US20170090521A1

公开(公告)日：2017-03-30

申请号：US15264544

申请日：2016-09-13

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Ryan C. Perkins ,  Trevor J. Ness

IPC: G06F1/16 ,  G01L1/14

CPC classification number: G06F1/1656 ,  F16J15/064 ,  G01L1/142 ,  G06F1/163

Abstract: An elastomeric gasket is disclosed for use in a portable electronic device. The gasket encapsulates flexible circuits which are used to measure force exerted on a cover glass of the device. The gasket reduces the number of layers of material and thus reduces the risk that outside contaminants and liquids may penetrate the gasket layers and enter the portable electronic device and thereby damage the components of the device.

公开(公告)号：US09223424B2

公开(公告)日：2015-12-29

申请号：US13858746

申请日：2013-04-08

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf

IPC: G06F3/041 ,  G02F1/1345 ,  G02F1/1335 ,  G02F1/1333

CPC classification number: G06F3/041 ,  G02F1/133308 ,  G02F1/13338 ,  G02F1/133608 ,  G02F1/13452 ,  G06F2203/04103

Abstract: An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures.

Abstract translation: 电子设备可以具有使用诸如各向异性导电膜和其它粘合剂的导电粘合剂耦合在一起的结构。 耦合在一起的结构可以包括由显示覆盖层的内表面上的电极形成的触摸传感器结构，具有诸如薄膜晶体管层的显示层的显示模块以及安装在诸如印刷电路的基板上的电路。 导电信号路径结构可用于电子设备内的路由信号。 导电信号路径结构可以由嵌入在注射成型塑料中的销钉形成，从金属轨迹（例如形成在塑料构件或其它电介质的表面上的激光沉积金属迹线）与在金属结构内运行的金属结构形成 塑料，印刷电路迹线和其他信号路径结构。

公开(公告)号：US20150280313A1

公开(公告)日：2015-10-01

申请号：US14736992

申请日：2015-06-11

Applicant: Apple Inc.

Inventor： Emery A. Sanford ,  Qingxiang Li ,  Lijun Zhang ,  Anthony S. Montevirgen ,  Teodor Dabov ,  Erik G. de Jong ,  Wey-Jiun Lin

IPC: H01Q1/24 ,  H01Q1/52

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/526 ,  Y10T29/49016

Abstract: An electronic device may be provided with a conductive housing. An antenna window structure may be formed in an opening in the housing. The antenna window structure may have an antenna support structure that is attached to the conductive housing and that supports antenna structures. An antenna window cap may be mounted in the opening and attached to the antenna support structure with liquid adhesive. Alignment structures may be provided in the antenna support structure. An antenna support plate with mating alignment structures may be used in attaching the antenna structures to the antenna support structures. Metal shielding structures may be used to provide electromagnetic shielding. A shielding wall may be formed from a sheet metal structure supported by a plastic support structure. A flexible metal shielding foil layer may be welded to the shielding wall using a sacrificial plate.

Abstract translation: 电子设备可以设置有导电外壳。 天线窗口结构可以形成在壳体中的开口中。 天线窗口结构可以具有附接到导电壳体并且支撑天线结构的天线支撑结构。 天线窗口帽可以安装在开口中并且用液体粘合剂附接到天线支撑结构。 对准结构可以设置在天线支撑结构中。 具有匹配对准结构的天线支撑板可以用于将天线结构附接到天线支撑结构。 金属屏蔽结构可用于提供电磁屏蔽。 屏蔽壁可以由由塑料支撑结构支撑的金属板结构形成。 可以使用牺牲板将柔性金属屏蔽箔层焊接到屏蔽壁。