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公开(公告)号:US20180098444A1
公开(公告)日:2018-04-05
申请号:US15832606
申请日:2017-12-05
Applicant: Apple Inc.
Inventor: Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K5/04 , B23P17/00 , B23P11/00 , G03F1/38 , H04M1/02 , H01Q1/24 , H05K5/02 , B23C5/10 , H04M1/11 , B23C5/00 , B23P17/02 , C25D11/34
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:US09793599B2
公开(公告)日:2017-10-17
申请号:US14640902
申请日:2015-03-06
Applicant: Apple Inc.
Inventor: Carlo Di Nallo , Erik G. de Jong , Jayesh Nath , Mattia Pascolini , Tang Y. Tan , Yiren Wang , Zheyu Wang
Abstract: An electronic device may have components mounted in a housing. The device may include wireless transceiver circuitry and antenna structures. A display may be mounted in the housing. The display may have a cover layer having an inner surface with a recess. The recess may run along a peripheral edge of the cover layer. An antenna structure such as an inverted-F antenna resonating element may be formed from a metal trace on a dielectric antenna carrier. The resonating element may be mounted in the recess without adhesive. Conductive vias may pass through the dielectric carrier. Metal members with dimples may be soldered to a flexible printed circuit and may be used to ground metal traces on the carrier and the flexible printed circuit to the housing when the carrier is attached to the housing with fasteners.
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公开(公告)号:US11313935B2
公开(公告)日:2022-04-26
申请号:US16793994
申请日:2020-02-18
Applicant: Apple Inc.
Inventor: Gunes Dervisoglu , Christopher D. Guichet , Adam S. Howell , Alexander J. Wiens , Christopher E. Balcells , Erik L. Wang , Jonathan M. Beard , Tang Y. Tan , Theodore Lao , Tyler S. Bushnell , Hung A. Pham
Abstract: A method for calibrating a magnetometer of an electronic device can include detecting a change in a magnetism of the electronic device, collecting a first magnetic field data from the magnetometer at sampling frequency of at least 1 hertz, generating an elliptical calibration model based at least partially on the collected first magnetic field data, collecting a second magnetic field data from the magnetometer, and fitting the collected second magnetic field data to a sphere using the elliptical calibration model.
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公开(公告)号:US11240928B2
公开(公告)日:2022-02-01
申请号:US17032956
申请日:2020-09-25
Applicant: Apple Inc.
Inventor: Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , C25D11/34 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , H01Q1/42 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:US20210072335A1
公开(公告)日:2021-03-11
申请号:US16793994
申请日:2020-02-18
Applicant: Apple Inc.
Inventor: Gunes Dervisoglu , Christopher D. Guichet , Adam S. Howell , Alexander J. Wiens , Christopher E. Balcells , Erik L. Wang , Jonathan M. Beard , Tang Y. Tan , Theodore Lao , Tyler S. Bushnell , Hung A. Pham
Abstract: A method for calibrating a magnetometer of an electronic device can include detecting a change in a magnetism of the electronic device, collecting a first magnetic field data from the magnetometer at sampling frequency of at least 1 hertz, generating an elliptical calibration model based at least partially on the collected first magnetic field data, collecting a second magnetic field data from the magnetometer, and fitting the collected second magnetic field data to a sphere using the elliptical calibration model.
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公开(公告)号:US11653466B2
公开(公告)日:2023-05-16
申请号:US17645709
申请日:2021-12-22
Applicant: Apple Inc.
Inventor: Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , C25D11/34 , H05K5/02 , H05K13/00 , C25D11/02 , C25D11/12 , H05K5/03 , H01Q1/42 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23P11/00 , B23P17/00 , B23P17/02 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , C25D11/246 , H04M1/0249 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/30952 , Y10T409/303752
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:US20210072857A1
公开(公告)日:2021-03-11
申请号:US16708350
申请日:2019-12-09
Applicant: Apple Inc.
Inventor: Xiao Ying Zhao , Ian A. Spraggs , David A. Pakula , Tang Y. Tan
Abstract: An electronic device can include a housing and an interface component. The interface component can at least partially define an interface surface, and the interface component and the housing can define an internal volume. A force sensor assembly can be disposed in the internal volume to detect an amount of force applied to the interface surface. The force sensor assembly can include a pressure decay sensor and a gap distance sensor disposed opposite a surface of the interface component.
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公开(公告)号:US20190272453A1
公开(公告)日:2019-09-05
申请号:US16123696
申请日:2018-09-06
Applicant: Apple Inc.
Inventor: Brian A. Argyres , Sherry Cao , Sawyer I. Cohen , Ibuki Kamei , Kenn I. Peterson , Jason S. Sloey , Daniel C. Wagman , Benjamin J. Pope , Tang Y. Tan , Richard Hung Minh Dinh
Abstract: A dual subscriber identity module (SIM) card connector is provided that includes a lower connector housing portion having a bottom surface and an upper connector housing portion having a top surface. The upper connector housing portion is coupled to the lower connector housing portion to define an opening for a receiving space between the upper and lower connector housing portions. The opening and receiving space are sized and shaped to slidably receive a SIM card tray. The connector includes a first plurality of electrical contacts disposed at the bottom surface of the lower connector housing portion and configured to make contact with a first SIM card disposed on a first side of the SIM card tray when the tray is received within the receiving space. The connector includes a second plurality of electrical contacts disposed at the top surface of the upper connector housing portion and configured to make contact with a second SIM card disposed on a second side of the SIM card tray opposite the first side when the tray is received within the receiving space.
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公开(公告)号:US10034402B2
公开(公告)日:2018-07-24
申请号:US15832606
申请日:2017-12-05
Applicant: Apple Inc.
Inventor: Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K5/04 , B23P17/00 , H05K5/02 , G03F1/38 , H04M1/02 , H01Q1/24 , B23C5/10 , H04M1/11 , B23C5/00 , B23P17/02 , C25D11/34 , C25D11/12 , C25D11/02 , H01Q1/42 , H05K5/03 , C25D7/00 , H05K13/00 , B23P11/00 , C25D11/24
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:US09207724B2
公开(公告)日:2015-12-08
申请号:US13851031
申请日:2013-03-26
Applicant: Apple Inc.
Inventor: Daniel J. Coster , Daniele G. De Iuliis , Chiew-Siang Goh , Douglas L. Heirich , Steven W. Holmes , Jonathan P. Ive , Sung H. Kim , Ricardo A. Mariano , Thomas J. Misage , Daniel J. Riccio , Tang Y. Tan , Jeremy Yaekel
CPC classification number: G06F1/183 , G06F1/181 , H05K5/0221 , Y10T292/0886 , Y10T292/089 , Y10T292/0891 , Y10T292/432
Abstract: Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.
Abstract translation: 公开了用于将组件可释放地耦合到计算机的快速释放联接器。 快速释放联接机构通常被配置为允许组件相对于计算机的无需工具的放置。 也就是说,快速释放联接机构被配置为在不使用诸如螺钉,螺栓等的常规紧固件的情况下执行它们的联接。通过消除紧固件的使用,可以将组件从计算机插入和移除,而不使用工具(例如, 减)。 此外,快速释放联轴器易于操纵,从而使组件能够快速和直接地组装和拆卸到计算机上(例如,快速释放)。 例如,可以通过简单的推动或拉动运动和/或通过闩锁或手柄的简单轻弹来插入和移除部件。
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