公开(公告)号：US11090929B2

公开(公告)日：2021-08-17

申请号：US16092978

申请日：2016-07-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/07 ,  B41J2/125 ,  G06F3/12

Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.

公开(公告)号：US11065883B2

公开(公告)日：2021-07-20

申请号：US16493045

申请日：2017-11-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Jeffrey R. Pollard ,  Michael W. Cumbie ,  Si-Lam Choy

IPC: B41J2/18

Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.

公开(公告)号：US20210129536A1

公开(公告)日：2021-05-06

申请号：US16640751

申请日：2017-10-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Si-lam Choy ,  Michael W. Cumbie

IPC: B41J2/165

Abstract: A fluid ejection device includes a fluid ejection assembly including a fluid ejection die, and a service assembly to be slid relative to the fluid ejection assembly between a service position for service of the fluid ejection die and a retracted position nested with the fluid ejection assembly.

公开(公告)号：US10940693B1

公开(公告)日：2021-03-09

申请号：US16728207

申请日：2019-12-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Stephen D. Panshin ,  Jefferson P. Ward ,  David Owen Roethig ,  David N. Olsen ,  Anthony D. Studer ,  Michael W. Cumbie ,  Sirena Chi Lu

IPC: B41J2/175 ,  G01L23/08 ,  B41J29/393

Abstract: Disclosed herein are sensor circuits for a replaceable print material container, the sensor circuit to communicate with a printer logic circuit. An example sensor circuit includes a first sensor to detect at least one of a pneumatic stimulus or a pressurization applied by a printer, a second sensor, and an interface to communicate with at least one of a voltage source or a data source of the printer logic circuit. The example sensor circuit also includes logic circuitry, responsive to a class parameter, to: (a) output a first signal based on at least one of the pneumatic stimulus or the pressurization sensed by the first sensor when the class parameter is a first class parameter; and (b) output a second signal based on at least one of an output of the second sensor, different data, or a different algorithm when the class parameter is a second class parameter.

公开(公告)号：US20200343153A1

公开(公告)日：2020-10-29

申请号：US16768553

申请日：2018-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen

IPC: H01L23/31 ,  H01L23/495

Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).

公开(公告)号：US10780696B2

公开(公告)日：2020-09-22

申请号：US16541410

申请日：2019-08-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.

公开(公告)号：US20200290365A1

公开(公告)日：2020-09-17

申请号：US16761273

申请日：2017-12-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Si-lam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/18

Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

公开(公告)号：US20200282394A1

公开(公告)日：2020-09-10

申请号：US16645042

申请日：2017-10-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00 ,  B81B7/00

Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.

公开(公告)号：US10688785B2

公开(公告)日：2020-06-23

申请号：US16284108

申请日：2019-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Vincent C. Korthuis ,  Eric T. Martin ,  Michael W. Cumbie ,  Scott A. Linn

IPC: B41J2/14 ,  B41J2/175

Abstract: According to an example, a printing system may include a drop ejecting element and a fluid circulating element corresponding to the drop ejecting element. The printing system may also include a logic device that is to receive a data stream addressed to the drop ejecting element, determine whether the data stream indicates that the drop ejecting element is to be energized, and in response to a determination that the data stream does not indicate that the drop ejecting element is to be energized, energize the fluid circulating element.

公开(公告)号：US10661567B2

公开(公告)日：2020-05-26

申请号：US15748848

申请日：2015-10-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Mark H. MacKenzie ,  Garrett E. Clark

IPC: B41J2/16 ,  B41J2/155 ,  B41J2/175

Abstract: Printheads and methods of fabricating printheads are disclosed. An example printhead includes a substrate and a printhead die disposed on a surface of the substrate, where a top surface of the printhead die projects a first distance from the surface of the substrate. The example printhead also includes a barrier at least partially surrounding the printhead die. A top surface of the barrier projects a second distance from the surface of the substrate, where the first distance is less than the second distance.