NON-PLANAR SILICIDED SEMICONDUCTOR ELECTRICAL FUSE

    公开(公告)号:US20220165663A1

    公开(公告)日:2022-05-26

    申请号:US17104078

    申请日:2020-11-25

    Abstract: An electrical fuse (e-fuse) includes a fuse link including a silicided semiconductor layer over a dielectric layer covering a gate conductor. The silicided semiconductor layer is non-planar and extends orthogonally over the gate conductor. A first terminal is electrically coupled to a first end of the fuse link, and a second terminal is electrically coupled to a second end of the fuse link. The fuse link may be formed in the same layer as an intrinsic and/or extrinsic base of a bipolar transistor. The gate conductor may control a current source for programming the e-fuse. The e-fuse reduces the footprint and the required programming energy compared to conventional e-fuses.

    Photonic component with distributed Bragg reflectors

    公开(公告)号:US11340403B2

    公开(公告)日:2022-05-24

    申请号:US16807942

    申请日:2020-03-03

    Abstract: One illustrative device disclosed herein includes a layer of semiconductor material and a first Bragg reflector structure positioned in the layer of semiconductor material, wherein the first Bragg reflector structure comprises a plurality of dielectric elements and a first internal area defined by an innermost of the first plurality of dielectric elements. In this example, the device also includes an optical component positioned above the layer of semiconductor material, wherein at least a portion of the optical component is positioned within a vertical projection of the first internal area.

    PHOTODETECTOR ARRAY WITH DIFFRACTION GRATINGS HAVING DIFFERENT PITCHES

    公开(公告)号:US20220155535A1

    公开(公告)日:2022-05-19

    申请号:US17099834

    申请日:2020-11-17

    Abstract: A photodetector array includes a substrate, and an array of pixels over the substrate. Each pixel includes a set of diffraction gratings directly on a semiconductor photodetector. A pitch of the set of diffraction gratings associated with each pixel in the array of pixels are different to enable each pixel to detect a specific wavelength of light different than other pixels of the array of pixels. An air cavity may be provided in the substrate under the germanium photodetector to improve light absorption. A method of forming the photodetector array is also disclosed.

    SYSTEMS AND METHODS FOR TRANSMITTING CLOCK SIGNALS ASYNCHRONOUSLY TO DUAL-PORT MEMORY CELLS

    公开(公告)号:US20220148633A1

    公开(公告)日:2022-05-12

    申请号:US17092384

    申请日:2020-11-09

    Abstract: Embodiments of the disclosure provide systems and methods for transmitting clock signals asynchronously to dual-port memory cells. A system according to embodiments of the disclosure may include a source clock configured to generate a clock signal, a dual-port memory cell having a first input port, and a second input port coupled to the source clock. A clock tuner coupled between the source clock and the first input port of the dual-port memory cell delays the clock signal by one of a plurality of delay times and transmits the clock signal to the first input port.

    Methods of forming an IC product comprising transistor devices with different threshold voltage levels

    公开(公告)号:US11315835B2

    公开(公告)日:2022-04-26

    申请号:US16296469

    申请日:2019-03-08

    Abstract: One illustrative method disclosed herein includes forming a conformal SMCM layer above a conformal high-k gate insulation layer within each of first and second replacement gate cavities (RGC), removing the SMCM layer from the first RGC while leaving the SMCM layer in position within the second RGC, forming a first conformal metal-containing material (MCM) layer above the gate insulation layer within the first RGC and above the SMCM layer in position within the second RGC, removing the first conformal MCM layer and the conformal SMCM layer positioned within the second RGC while leaving the first conformal MCM layer within the first RGC, and forming a second conformal MCM layer above the first conformal MCM layer positioned within the first RGC and above the gate insulation layer positioned within the second RGC.

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