公开(公告)号：US10964992B2

公开(公告)日：2021-03-30

申请号：US16186103

申请日：2018-11-09

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Henning Braunisch ,  Gilbert W. Dewey ,  Telesphor Kamgaing ,  Hyung-Jin Lee ,  Johanna M. Swan

IPC: H01P1/213 ,  H01P3/127 ,  H01P5/103 ,  H01P3/10 ,  H01P3/16 ,  H01P5/107 ,  H01P3/12 ,  H01P5/08

Abstract: There is disclosed in one example an electromagnetic wave launcher apparatus, including: an interface to an electromagnetic waveguide; a first launcher configured to launch a high-frequency electromagnetic signal onto a first cross-sectional portion of the waveguide; and a second launcher configured to launch a lower-frequency electromagnetic signal onto a second cross-sectional portion of the waveguide.

公开(公告)号：US20210043541A1

公开(公告)日：2021-02-11

申请号：US16532956

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/38 ,  H01L23/498 ,  H01L27/20 ,  H01L25/18 ,  H01L23/00 ,  H01L41/053 ,  H03H9/205 ,  H01L23/14 ,  H01L23/538 ,  H01L23/66 ,  H01L23/31 ,  H01L35/32 ,  H01L23/427 ,  H03H9/05 ,  H03H9/02

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US20210036685A1

公开(公告)日：2021-02-04

申请号：US16526672

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H03H9/205 ,  H03F3/24 ,  H03H9/25 ,  H01L41/053 ,  H03H9/64 ,  H03H9/54 ,  H01L25/10 ,  H01L23/10 ,  H01L23/552

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes a first acoustic wave resonator (AWR) die coupled with a package substrate. The RF FEM may also include a second AWR die coupled with the first AWR die. The first AWR die may be between the package substrate and the second AWR die. Other embodiments may be described or claimed.

公开(公告)号：US20210036682A1

公开(公告)日：2021-02-04

申请号：US16526633

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Johanna M. Swan

IPC: H03H9/05 ,  H01L23/538 ,  H01L25/18 ,  H01L27/20 ,  H01L25/00 ,  H01L41/053 ,  H01L23/00 ,  H03H9/58 ,  H01L41/047

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US10804227B2

公开(公告)日：2020-10-13

申请号：US16312904

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US20200315052A1

公开(公告)日：2020-10-01

申请号：US16402055

申请日：2019-05-02

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC: H05K7/14 ,  H01P3/16 ,  H05K1/02 ,  H01P5/12

Abstract: Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US10777538B2

公开(公告)日：2020-09-15

申请号：US16399726

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Fay Hua ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/64 ,  H01L21/768 ,  H01L23/66 ,  H01L23/522

Abstract: Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.

公开(公告)号：US10593636B2

公开(公告)日：2020-03-17

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/36 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US10573608B2

公开(公告)日：2020-02-25

申请号：US15776021

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Eric J. Li ,  Javier A. Falcon ,  Yoshihiro Tomita ,  Vijay K. Nair ,  Shawna M. Liff

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10546835B2

公开(公告)日：2020-01-28

申请号：US15777040

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.