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    Method for producing honeycomb structure
    231.
    发明授权
    Method for producing honeycomb structure 有权

    公开(公告)号：US11292751B2

    公开(公告)日：2022-04-05

    申请号：US16774350

    申请日：2020-01-28

    Applicant: NGK INSULATORS, LTD.

    Inventor： Ken Itadu ,  Nobuhiro Fujie ,  Yuji Watanabe

    IPC: C04B40/00 ,  B28B11/24 ,  B28B11/14 ,  F26B3/06 ,  C04B38/00

    Abstract: A method for producing a honeycomb structure, the method including: a step of drying a pillar-shaped honeycomb formed body including partition walls that define a plurality of cells each forming a flow path penetrating from a first end face to a second end face; and after the step of drying, a step of cooling the honeycomb formed body by applying a suction force to the first end face of the honeycomb formed body to allow a coolant to flow in the honeycomb formed body from the second end face, pass through the cells, and flow out from the first end face.

    Honeycomb structure
    232.
    发明授权
    Honeycomb structure 有权

    公开(公告)号：US11285468B2

    公开(公告)日：2022-03-29

    申请号：US16180360

    申请日：2018-11-05

    Applicant: NGK INSULATORS, LTD.

    Inventor： Yasushi Kato ,  Takahiro Kondo ,  Junki Matsuya

    IPC: B01J35/04 ,  B01D53/94 ,  F01N3/28 ,  C04B38/00 ,  C04B111/00

    Abstract: A honeycomb structure includes a honeycomb structure body having porous partition walls, wherein a value of a porosity of the partition wall in a partitioning wall portion between the two cells is defined as a porosity A, a value of a porosity of the partition wall in an intersecting portion that is a region connecting two or more wall portions is defined as a porosity B, a value of A/B obtained by dividing the porosity A by the porosity B is from 0.5 to 0.95, and the porosity A is from 10 to 40%.

    Honeycomb filter
    233.
    发明授权
    Honeycomb filter 有权

    公开(公告)号：US11280236B2

    公开(公告)日：2022-03-22

    申请号：US16356204

    申请日：2019-03-18

    Applicant: NGK Insulators, Ltd. ,  Honda Motor Co., Ltd.

    Inventor： Fumihiko Yoshioka ,  Yoshiaki Hatakeyama ,  Noritaka Masumitsu

    IPC: F01N3/022 ,  B01J23/42 ,  B01J35/04 ,  B29C48/11

    Abstract: A honeycomb filter, including: a honeycomb structure, wherein the honeycomb structure includes a platinum group element-containing catalyst layer, the platinum group element-containing catalyst layer is disposed only on a side of an inner surface of the partition walls surrounding the inflow cells, and the platinum group element-containing catalyst layer is disposed in a range of at least up to 40% with respect to an overall length of the cells starting from the outflow end face and is not disposed in a range of at least up to 30% with respect to the overall length of the cells starting from the inflow end face, in an extending direction of the cells of the honeycomb structure.

    Gas sensor
    235.
    发明授权
    Gas sensor 有权

    公开(公告)号：US11275049B2

    公开(公告)日：2022-03-15

    申请号：US16661188

    申请日：2019-10-23

    Applicant: NGK INSULATORS, LTD.

    Inventor： Yusuke Watanabe ,  Mika Kai ,  Shiho Iwai

    IPC: G01N27/407

    Abstract: A gas sensor includes a structural body made from an oxygen ion conductive solid electrolyte, a gas introduction passage which is formed in the structural body and into which a gas to be measured is introduced, a main adjustment chamber that communicates with the gas introduction passage, and a measurement chamber that communicates with the main adjustment chamber. A buffer space that communicates with the gas introduction passage, and at least two diffusion rate control members that communicate with the buffer space, are provided between the gas introduction passage and the main adjustment chamber. The respective widths Wb1 and Wb2 of the diffusion rate control members are less than the respective widths Wa, Wc, and Wd of the gas introduction passage, the buffer space, and the main adjustment chamber.

    Manifold and cell stack device
    238.
    发明授权
    Manifold and cell stack device 有权

    公开(公告)号：US11264633B2

    公开(公告)日：2022-03-01

    申请号：US16558767

    申请日：2019-09-03

    Applicant: NGK INSULATORS, LTD.

    Inventor： Noriyuki Ogasawara ,  Yuki Tanaka ,  Masayuki Shinkai ,  Hirofumi Kan ,  Makoto Ohmori

    IPC: H01M8/2484

    Abstract: A manifold includes first and second manifold main bodies. The first manifold main body includes a gas supply chamber that is connected to a first gas channel and the second manifold main body includes a gas collection chamber that is connected to a second gas channel. The first manifold main body includes a top plate, a first bottom plate, and a first side plate. The top plate includes a first through hole for connecting the first gas channel and the gas supply chamber. The second manifold main body includes the top plate, a second bottom plate, and a second side plate. The top plate also includes a second through hole for connecting the second gas channel and the gas collection chamber. The first bottom plate and the second bottom plate are constituted by members that are separate from each other.

    Semiconductor manufacturing apparatus
    239.
    发明授权
    Semiconductor manufacturing apparatus 有权

    公开(公告)号：US11257703B2

    公开(公告)日：2022-02-22

    申请号：US17022396

    申请日：2020-09-16

    Applicant: NGK INSULATORS, LTD.

    Inventor： Shinpei Kunita

    IPC: H01L21/683 ,  H02N13/00 ,  H01L21/687 ,  H01L21/67

    Abstract: A semiconductor manufacturing apparatus includes: a metal base member fixed to a surface, on the opposite side of a wafer mounting surface, of an electrostatic chuck; an electrode terminal connected to an electrode embedded in the electrostatic chuck; a through hole provided at a position of the base member, the position being opposed to the electrode terminal; an insulating sleeve fixed to the inner circumferential surface of the through hole; a chuck-side terminal which is connected to the electrode terminal via a flexible cable, and fixed to the insulating sleeve with arranged in the insulating sleeve; a flexible insulating tube that covers the cable, the flexible insulating tube having one end fixed to the electrode terminal and the other end fixed to the chuck-side terminal; and an insulating resin member that covers at least part of the electrode terminal, the part being not covered by the insulating tube.

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