AMPLIFYING CIRCUIT
    231.
    发明公开
    AMPLIFYING CIRCUIT 审中-公开

    公开(公告)号:US20240186952A1

    公开(公告)日:2024-06-06

    申请号:US18081625

    申请日:2022-12-14

    CPC classification number: H03F1/0205 H03F3/193 H03F2200/451

    Abstract: An amplifying circuit includes a first transistor, a second transistor, and a switching circuit. A control terminal of the first transistor is coupled to an input terminal of the amplifying circuit, and a first terminal of the first transistor is coupled to a first reference end. The input terminal of the amplifying circuit receives a first radio frequency (RF) signal. A first terminal of the second transistor is coupled to a second terminal of the first transistor, and a second terminal of the second transistor is coupled to an output terminal of the amplifying circuit. The output terminal of the amplifying circuit outputs an amplified signal. The first transistor amplifies the first RF signal to generate a second RF signal. The switching circuit performs a switching operation to transmit the second RF signal to one of the first terminal and the control terminal of the second transistor.

    SWITCH DEVICE
    232.
    发明公开
    SWITCH DEVICE 审中-公开

    公开(公告)号:US20230361765A1

    公开(公告)日:2023-11-09

    申请号:US18219068

    申请日:2023-07-06

    CPC classification number: H03K17/04123

    Abstract: A switch device includes a first radio-frequency (RF) terminal, a second RF terminal, a first transistor, a second transistor, and a variable resistance element. The first transistor includes a first terminal coupled to the first RF terminal, a second terminal, and a control terminal coupled to a control signal terminal providing a control signal. The second transistor includes a first terminal coupled to the second terminal of the first transistor, a second terminal coupled to the second RF terminal, and a control terminal. The variable resistance element is coupled between the second terminal of the first transistor and a bias voltage terminal. When the first transistor and the second transistor are in a transient state, the variable resistance element provides a lower resistance. When the first transistor and the second transistor are in an ON state, the variable resistance element provides a higher resistance.

    ACOUSTIC WAVE DEVICE WITH ENHANCED QUALITY FACTOR AND FABRICATION METHOD THEREOF

    公开(公告)号:US20230344402A1

    公开(公告)日:2023-10-26

    申请号:US17842801

    申请日:2022-06-17

    CPC classification number: H03H9/02574 H03H9/02992

    Abstract: An acoustic wave device includes a piezoelectric substrate, a transducer, and a depression. The transducer is disposed on a surface of the piezoelectric substrate, and includes a first bus bar, a first electrode, a second bus bar, and a second electrode. The first bus bar and the second bus bar extend along a second direction. The first electrode has a first end and extends from the first bus bar along a first direction. The first electrode and the second electrode are spaced apart from each other, and a gap is formed between the first end of the first electrode and an edge of the second bus bar. The depression is formed in the piezoelectric substrate and is depressed from the surface of the piezoelectric substrate. The first end of the first electrode is continuously joined to a sidewall of the depression along a depth direction.

    Bias compensation circuit of amplifier

    公开(公告)号:US11764736B2

    公开(公告)日:2023-09-19

    申请号:US17392205

    申请日:2021-08-02

    CPC classification number: H03F1/30 H03F1/0261 H03F3/04 H03G3/10 H03G3/30

    Abstract: The present invention discloses a bias compensation circuit. The bias compensation circuit includes a detecting circuit, including a diode-connected transistor circuit, with a first end for receiving a first current, and a second end coupled to a first reference voltage end; and a first diode circuit, with a first end for receiving a second current, and a second end coupled to the first reference voltage end; wherein the detecting circuit provides a first voltage level according to the diode-connected transistor circuit, and provides a second voltage level according to the first diode circuit; a voltage-current converting circuit, coupled to the detecting circuit, for generating a first reference current according to the first voltage level and the second voltage level; and a bias circuit, coupled to the voltage-current converting circuit, for receiving the first reference current, to provide a bias voltage level according to the first reference current.

    Switch device
    235.
    发明授权

    公开(公告)号:US11742845B2

    公开(公告)日:2023-08-29

    申请号:US17565475

    申请日:2021-12-30

    CPC classification number: H03K17/04123

    Abstract: A switch device includes a first radio-frequency (RF) terminal, a second RF terminal, a first transistor, a second transistor, and a variable resistance element. The first transistor includes a first terminal coupled to the first RF terminal, a second terminal, and a control terminal coupled to a control signal terminal providing a control signal. The second transistor includes a first terminal coupled to the second terminal of the first transistor, a second terminal coupled to the second RF terminal, and a control terminal. The variable resistance element is coupled between the second terminal of the first transistor and a bias voltage terminal. When the first transistor and the second transistor are in a transient state, the variable resistance element provides a lower resistance. When the first transistor and the second transistor are in an ON state, the variable resistance element provides a higher resistance.

    SWITCH DEVICE
    236.
    发明公开
    SWITCH DEVICE 审中-公开

    公开(公告)号:US20230179194A1

    公开(公告)日:2023-06-08

    申请号:US17565475

    申请日:2021-12-30

    CPC classification number: H03K17/04123

    Abstract: A switch device includes a first radio-frequency (RF) terminal, a second RF terminal, a first transistor, a second transistor, and a variable resistance element. The first transistor includes a first terminal coupled to the first RF terminal, a second terminal, and a control terminal coupled to a control signal terminal providing a control signal. The second transistor includes a first terminal coupled to the second terminal of the first transistor, a second terminal coupled to the second RF terminal, and a control terminal. The variable resistance element is coupled between the second terminal of the first transistor and a bias voltage terminal. When the first transistor and the second transistor are in a transient state, the variable resistance element provides a lower resistance. When the first transistor and the second transistor are in an ON state, the variable resistance element provides a higher resistance.

    Radio frequency switch with multiple shunt paths sharing a common ground pad

    公开(公告)号:US20230123320A1

    公开(公告)日:2023-04-20

    申请号:US17542463

    申请日:2021-12-05

    Abstract: A radio frequency switch has an antenna end, a first signal end for transmitting a first radio frequency signal, a second signal end for transmitting a second radio frequency signal, a third signal end for transmitting a third radio frequency signal, a first series path having a first switch, a second series path having a second switch, a third series path having a third switch, a first shunt path coupled between the first signal end and a node, a second shunt path coupled between the second signal end and the node, a common path coupled between the node and a first reference voltage end, and a third shunt path coupled between the third signal end and a second reference voltage end. The first series path and the second series path are connected to a common ground pad via the common path.

    Electronic package structure and fabrication method thereof

    公开(公告)号:US11615997B2

    公开(公告)日:2023-03-28

    申请号:US17199371

    申请日:2021-03-11

    Inventor: Yu-Lung Wen

    Abstract: An electronic package structure includes: a substrate having an upper surface; a solder mask layer disposed on the upper surface of the substrate, at least one outer side of the solder mask layer being aligned with at least one outer side of the substrate; an electronic component with a first surface provided on the upper surface of the substrate; and a cavity located between the electronic component and the solder mask layer. A first surface of the cavity is formed by the first surface of the electronic component.

    Switch Circuit Structure Having Reduced Crossovers and Layout System thereof

    公开(公告)号:US20230061516A1

    公开(公告)日:2023-03-02

    申请号:US17510399

    申请日:2021-10-26

    Abstract: A switch device structure includes RF1-st and RF2-nd input terminals, RFA-th, RFB-th and RFC-th output terminals, P2A-th, P1B-th and P1C-th paths, and first and second common paths. The P2A-th path includes a first terminal, and a second terminal coupled to the RFA-th output terminal. The P1B-th path includes a first terminal, and a second terminal coupled to the RFB-th output terminal. The P1C-th path includes a first terminal, and a second terminal coupled to the RFC-th output terminal. The first common path is coupled to the RF2-nd input terminal and the first terminal of the P2A-th path. The second common path is coupled to the RF1-st input terminal, the first terminal of the P1B-th path, and the first terminal of the P1C-th path. The first and second common paths cross each other on different planes to form a crossover.

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