公开(公告)号：US07880953B2

公开(公告)日：2011-02-01

申请号：US12613227

申请日：2009-11-05

Applicant: Deming Tang

Inventor： Deming Tang

IPC: G02B26/00

CPC classification number: G02B26/0841

Abstract: A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.

Abstract translation: 空间光调制阵列器件包括在半导体衬底上的规划器配置中的规则包装的微光电机械像素，每个像素独立电驱动，从而以二进制模式光学操作，对入射照明进行反射和衍射。 受到由像素电路驱动的静电收缩或强制的影响，顶部金属反射器被精确地放置在距离静态底部金属反射器的最小或最大间距处，在视觉光谱内的四分之一波长的奇数或偶数整数倍，使得 分别实现了破坏性或建设性干扰的衍射或反射，从而在每个微光电机械像素处以独立的二进制模式独立地进行入射照明。

公开(公告)号：US08043891B2

公开(公告)日：2011-10-25

申请号：US12793295

申请日：2010-06-03

Applicant: Herb He Huang

Inventor： Herb He Huang

IPC: H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: B81C1/00333 ,  B81C2203/0118

Abstract: The present invention discloses a method of encapsulating a wafer level microdevice, which includes: fabricating a microdevice on top side of a first silicon wafer; depositing a first capping carbon film on the top side of the first silicon wafer; implementing a backside fabricating process of wafer from bottom side of the first silicon wafer by carrying the top side of the first silicon wafer through the first capping carbon film; removing the first capping carbon film by selective gaseous reaction with carbon; and encapsulating an encapsulation wafer onto the top side of the first silicon wafer. The present invention deposits and removes the first capping carbon film by means of chemical technology, thereby protecting the microdevice on the top side of the first wafer during implementing the backside fabricating process of wafer. The top side does not need to be protected through the encapsulation wafer before implementing the backside fabricating process of wafer, which makes the wafer thinner and convenient to be handled.

Abstract translation: 本发明公开了一种封装晶片级微器件的方法，其包括：在第一硅晶片的顶侧上制造微型器件; 在第一硅晶片的顶侧上沉积第一封盖碳膜; 通过将第一硅晶片的顶侧通过第一封盖碳膜，从第一硅晶片的底侧实现晶片的背面制造工艺; 通过与碳的选择性气相反应去除第一封盖碳膜; 并将封装晶片封装在第一硅晶片的顶侧上。 本发明通过化学技术沉积和去除第一封盖碳膜，从而在实现晶片的背面制造工艺期间保护微型器件在第一晶片的顶侧上。 在实施晶片的背面制造工艺之前，顶侧不需要通过封装晶片进行保护，这使得晶片更薄且便于处理。

公开(公告)号：US20110069264A1

公开(公告)日：2011-03-24

申请号：US12885836

申请日：2010-09-20

Applicant: HERB HE HUANG

Inventor： HERB HE HUANG

IPC: G02F1/1333 ,  G03F7/20

CPC classification number: G03F7/0007

Abstract: The disclosed LCOS device comprises a transparent composite plate, a planar liquid crystal cell, a base plate which contains an active matrix driving circuitry. In the basic embodiment, the planar liquid crystal cell comprises a conductive seal ring which encloses liquid crystal filling and connects the transparent conductive layer underneath the transparent composite plate with the base plate and the active matrix driving circuitry. In the extended embodiment, the base plate further incorporates a set of thru-substrate via and backside bond pads. The set of thru-substrate via electrically connect a set of input-output pads of the active matrix driving circuitry to the bottom bond pads underneath the base plate. In addition, the conductive seal ring electrically connects the transparent conductive film placed underneath the transparent front plane plate, preferably made of glass, to the active matrix driving circuitry on the base plate. Electrostatically charged between the transparent conductive coating and an electrode array layer including a planar array of reflective pixel electrodes on top of the base plate, planar liquid crystal cell is operated to produce spatial light modulation to incident illumination. The method of wafer level process and packaging of the disclosed LCOS imagers is further disclosed.

Abstract translation: 所公开的LCOS器件包括透明复合板，平面液晶单元，含有有源矩阵驱动电路的基板。 在基本实施例中，平面液晶单元包括封装液晶填充并将透明复合板下方的透明导电层与基板和有源矩阵驱动电路连接的导电密封环。 在扩展实施例中，基板进一步包括一组通过衬底通孔和背面接合焊盘。 通过将有源矩阵驱动电路的一组输入输出焊盘电连接到底板下方的底部接合焊盘，该组通孔基板经过。 此外，导电密封环将布置在透明前平面板下方的透明导电膜电连接到基板上的有源矩阵驱动电路，优选由玻璃制成。 在透明导电涂层和包括在底板顶部上的反射像素电极的平面阵列的电极阵列层之间静电充电，操作平面液晶单元以对入射照明产生空间光调制。 进一步公开了所公开的LCOS成像器的晶片级处理和封装的方法。

公开(公告)号：US20110053321A1

公开(公告)日：2011-03-03

申请号：US12873172

申请日：2010-08-31

Applicant: HERB HE HUANG

Inventor： HERB HE HUANG

IPC: H01L21/02

CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145

Abstract: A method of fabricating and encapsulating MEMS devices is disclosed, using least two carbon films as the dual sacrificial layers sandwiching a MEMS structural film which is anchored onto a substrate and covered by an encapsulating film containing a plurality of thru-film sacrificial release holes. The dual sacrificial carbon films are selectively removed via plasma-enhanced oxygen or nitrogen ashing through the thru-film sacrificial release holes for releasing the MEMS structural film inside a cavity formed between the encapsulating film and the substrate. The thru-film sacrificial release holes, preferably with a relative high asperity ratio, are then sealed off by depositing a hole-sealing film in a physical vapor deposition process or a chemical vapor deposition process or combination.

Abstract translation: 公开了一种制造和封装MEMS器件的方法，使用最少两个碳膜作为夹持MEMS结构膜的双牺牲层，该MEMS结构膜锚定在衬底上并由包含多个穿透膜牺牲释放孔的封装膜覆盖。 双重牺牲碳膜通过等离子体增强的氧气或氮气灰化通过穿过膜牺牲释放孔而被选择性地去除，用于将MEMS结构膜释放在形成在封装膜和衬底之间的空腔内。 然后通过在物理气相沉积工艺或化学气相沉积工艺或组合中沉积空穴密封膜来密封优选具有相对高的凹凸比的透膜牺牲释放孔。