Systems and methods for acoustic emission monitoring of semiconductor devices

    公开(公告)号:US11977053B2

    公开(公告)日:2024-05-07

    申请号:US18312440

    申请日:2023-05-04

    Abstract: A system for monitoring and identifying states of a semiconductor device, the system including at least one acoustic sensor for sensing acoustic emission emitted by at least one semiconductor device operating at a voltage of less than or equal to 220 V, the at least one acoustic sensor outputting at least one acoustic emission signal and a signal processing unit for receiving the at least one acoustic emission signal from the at least one acoustic sensor and for analyzing the at least one acoustic emission signal, the signal processing unit providing an output based on the analyzing, the output being indicative at least of whether the at least one semiconductor device is in an abnormal operating state with respect to a normal operating state of the semiconductor device.

    SYSTEMS AND METHODS FOR MONITORING OF MECHANICAL AND ELECTRICAL MACHINES

    公开(公告)号:US20240068864A1

    公开(公告)日:2024-02-29

    申请号:US18504727

    申请日:2023-11-08

    CPC classification number: G01H1/003 G01H1/04 G01R33/02 G05B23/0283

    Abstract: A system for continuously monitoring at least one machine including a plurality of magnetic sensors synchronously sensing magnetic fields emitted by at least one machine, the plurality of magnetic sensors sensing the magnetic fields along a corresponding plurality of channels and outputting magnetic field emission signals corresponding to the magnetic fields, a signal analyzer receiving at least a portion of the magnetic field emission signals and performing analysis of the magnetic field emission signals, the signal analyzer providing an output based on the analysis, the output including at least an indication of a condition of the at least one machine and a control module receiving the indication of the condition and initiating at least one of a repair event on the at least one machine, an adjustment to a maintenance schedule of the at least one machine and an adjustment to an operating parameter of the at least one machine based on the indication, whereby efficacy of the at least one machine is improved.

    Systems and methods for monitoring of mechanical and electrical machines

    公开(公告)号:US11885667B2

    公开(公告)日:2024-01-30

    申请号:US17934395

    申请日:2022-09-22

    CPC classification number: G01H1/003 G01H1/04 G01R33/02 G05B23/0283

    Abstract: A system for continuously monitoring at least one machine including at least one magnetic sensor sensing magnetic fields emitted by at least one machine, at least one vibration sensor synchronously sensing vibrations emitted by the at least one machine, a signal analyzer receiving at least a portion of the magnetic field emission signals and vibration signals and performing analysis thereof, the signal analyzer providing an output based on the analysis, the output including at least an indication of a condition of the at least one machine, and a control module initiating at least one of a repair event on the at least one machine, an adjustment to a maintenance schedule of the at least one machine and an adjustment to an operating parameter of the at least one machine based on the indication, whereby efficacy of the at least one machine is improved.

    SYSTEMS AND METHODS FOR ACOUSTIC EMISSION MONITORING OF SEMICONDUCTOR DEVICES

    公开(公告)号:US20230273159A1

    公开(公告)日:2023-08-31

    申请号:US18312440

    申请日:2023-05-04

    Abstract: A system for monitoring and identifying states of a semiconductor device, the system including at least one acoustic sensor for sensing acoustic emission emitted by at least one semiconductor device operating at a voltage of less than or equal to 220 V, the at least one acoustic sensor outputting at least one acoustic emission signal and a signal processing unit for receiving the at least one acoustic emission signal from the at least one acoustic sensor and for analyzing the at least one acoustic emission signal, the signal processing unit providing an output based on the analyzing, the output being indicative at least of whether the at least one semiconductor device is in an abnormal operating state with respect to a normal operating state of the semiconductor device.

    AUTOMATIC MECHANICAL SYSTEMS DIAGNOSIS
    25.
    发明公开

    公开(公告)号:US20230213486A1

    公开(公告)日:2023-07-06

    申请号:US18146625

    申请日:2022-12-27

    CPC classification number: G01M99/005 G05B23/0283

    Abstract: A method for automatic diagnosis of a mechanical system of a group of mechanical systems sharing mechanical characteristics includes obtaining data relating to a vibration. The vibration-related data is acquired by a portable communications device configured to communicate with a remote processor. The processor automatically diagnoses the mechanical system by applying a relationship to the obtained vibration-related data. The relationship is based on sets of vibration-related data previously obtained from the mechanical systems. Each set of vibration-related data relates to vibrations of a mechanical system. The relationship is further based on sets of operation data previously obtained for mechanical systems of the group. Each set of operation data indicates a previous state of operation of a mechanical system. Each of the previous states of operation is associated with at least one of the previously obtained sets of vibration-related data.

    SYSTEMS AND METHODS FOR ACOUSTIC EMISSION MONITORING OF SEMICONDUCTOR DEVICES

    公开(公告)号:US20230076885A1

    公开(公告)日:2023-03-09

    申请号:US18049166

    申请日:2022-10-24

    Abstract: A system for monitoring and identifying states of a semiconductor device, the system including at least one acoustic sensor for sensing acoustic emission emitted by at least one semiconductor device operating at a voltage of less than or equal to 220 V. the at least one acoustic sensor outputting at least one acoustic emission signal and a signal processing unit for receiving the at least one acoustic emission signal from the at least one acoustic sensor and for analyzing the at least one acoustic emission signal, the signal processing unit providing an output based on the analyzing, the output being indicative at least of whether the at least one semiconductor device is in an abnormal operating state with respect to a normal operating state of the semiconductor device.

    AUTOMATIC MECHANICAL SYSTEMS DIAGNOSIS

    公开(公告)号:US20210270778A1

    公开(公告)日:2021-09-02

    申请号:US17205118

    申请日:2021-03-18

    Abstract: A method for automatic diagnosis of a mechanical system of a group of mechanical systems sharing mechanical characteristics includes obtaining data relating to a vibration. The vibration-related data is acquired by a portable communications device configured to communicate with a remote processor. The processor automatically diagnoses the mechanical system by applying a relationship to the obtained vibration-related data. The relationship is based on sets of vibration-related data previously obtained from the mechanical systems. Each set of vibration-related data relates to vibrations of a mechanical system. The relationship is further based on sets of operation data previously obtained for mechanical systems of the group. Each set of operation data indicates a previous state of operation of a mechanical system. Each of the previous states of operation is associated with at least one of the previously obtained sets of vibration-related data.

    Automatic mechanical systems diagnosis

    公开(公告)号:US10330647B2

    公开(公告)日:2019-06-25

    申请号:US15798981

    申请日:2017-10-31

    Abstract: A method for automatic diagnosis of a mechanical system of a group of mechanical systems sharing mechanical characteristics includes obtaining data relating to a vibration. The vibration-related data is acquired by a portable communications device configured to communicate with a remote processor. The processor automatically diagnoses the mechanical system by applying a relationship to the obtained vibration-related data. The relationship is based on sets of vibration-related data previously obtained from the mechanical systems. Each set of vibration-related data relates to vibrations of a mechanical system. The relationship is further based on sets of operation data previously obtained for mechanical systems of the group. Each set of operation data indicates a previous state of operation of a mechanical system. Each of the previous states of operation is associated with at least one of the previously obtained sets of vibration-related data.

    AUTOMATIC MECHANICAL SYSTEMS DIAGNOSIS
    29.
    发明申请

    公开(公告)号:US20180120265A1

    公开(公告)日:2018-05-03

    申请号:US15798981

    申请日:2017-10-31

    Abstract: A method for automatic diagnosis of a mechanical system of a group of mechanical systems sharing mechanical characteristics includes obtaining data relating to a vibration. The vibration-related data is acquired by a portable communications device configured to communicate with a remote processor. The processor automatically diagnoses the mechanical system by applying a relationship to the obtained vibration-related data. The relationship is based on sets of vibration-related data previously obtained from the mechanical systems. Each set of vibration-related data relates to vibrations of a mechanical system. The relationship is further based on sets of operation data previously obtained for mechanical systems of the group. Each set of operation data indicates a previous state of operation of a mechanical system. Each of the previous states of operation is associated with at least one of the previously obtained sets of vibration-related data.

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