公开(公告)号：US20050227081A1

公开(公告)日：2005-10-13

申请号：US10823311

申请日：2004-04-13

Applicant: Che-Hsiung Hsu ,  Christopher Junk ,  Sunghan Kim ,  Daniel Lecloux ,  Ralph Lloyd ,  Shiva Prakash

Inventor： Che-Hsiung Hsu ,  Christopher Junk ,  Sunghan Kim ,  Daniel Lecloux ,  Ralph Lloyd ,  Shiva Prakash

IPC: C08K5/098 ,  C08K5/42 ,  C08K5/5317 ,  C08L27/18 ,  C08L65/00 ,  C08L79/02 ,  H01B1/12 ,  H01L51/00 ,  H01L51/30 ,  H01L51/50 ,  B23B27/00 ,  B32B27/06

CPC classification number: C08L79/02 ,  C08L65/00 ,  H01B1/127 ,  H01B1/128 ,  H01G11/48 ,  H01G11/56 ,  H01L51/0035 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/5088 ,  Y02E10/549 ,  Y02E60/13 ,  Y10S428/917 ,  Y10T428/31504 ,  Y10T428/31855 ,  C08L27/12

Abstract: The invention relates to conductive polymer composites comprising a first layer comprising at least one electrically doped conductive polymer and a second layer comprising at least one material selected from a colloid-forming polymeric acid, a salt of a colloid-forming polymeric acid, a non-polymeric fluorinated organic acid, and a salt of a non-polymeric fluorinated organic acid.

Abstract translation: 本发明涉及导电聚合物复合材料，其包括包含至少一种掺杂导电聚合物的第一层和包含至少一种选自胶体形成聚合酸，形成胶体的聚合酸的盐， 聚合氟化有机酸和非聚合氟化有机酸的盐。