Abstract:
A method for dicing a semiconductor wafer includes the steps of: forming grooves in an integrated circuit layer of the semiconductor wafer; forming a photoresist layer on the integrated circuit layer; forming V-shaped first notches, each of which is further indented from the integrated circuit layer; thinning the substrate; attaching a blue tape to the integrated circuit layer; forming V-shaped second notches, each of which is indented from the thinned substrate and each of which is registered with a respective one of the first notches such that the first and second notches cooperatively define imaginary breaking lines, respectively; and pressing the blue tape at positions that are aligned with the imaginary breaking lines, respectively.
Abstract:
A method for making a semiconductor light emitting device comprises the steps of: (a) forming a plurality of buttresses on a first supporting substrate such that the buttresses are separated by a plurality of intercommunicated spaces thereamong; (b) forming a base layer on top end portions of the buttresses in such a manner that the top end portions of the buttresses are enclosed in the base layer; (c) forming a multi-layered light-emitting structure on the base layer; (d) attaching a second supporting substrate to the light-emitting structure; and (e) separating the first supporting substrate from the light-emitting structure by destroying the buttresses.
Abstract:
A vacuum laser constant temperature device is adopted for a housing that has a heat dissipation module arranged therein. The device has a metallic partition adjacent to the heat dissipation module to enclose a airtight vacancy formed with the housing, a thermoelectric cooling chip with a heating portion connecting to a side of the metallic partition and a cooling portion, a semiconductor laser lighting module arranged in the airtight vacancy and connecting to the cooling portion of the thermoelectric cooling chip, and a heat insulation layer arranged both on an opposite side of the metallic partition and in the airtight vacancy. Heat generated by the semiconductor laser lighting module can be transferred to the heat dissipation module via the thermoelectric cooling chip and the metallic partition. The thermoelectric cooling chip makes an output power of the semiconductor laser lighting module keep constant within various environments without the condensation thereon.
Abstract:
The invention describes a method to facilitate the use of low-sensitivity monitoring equipment for detecting and monitoring defects on the surface of semiconductor wafers. The method includes the use of a hydrofluoric acid solution for increasing the dimensions of a defect and the application of a thin-film layer of a metal, such as titanium, for improving the appearance of the defect such that the defect dimensions increase to above 0.1 nanometer, the detection threshold for economical low-sensitivity monitoring equipment.
Abstract:
A money checking apparatus has a U-shaped with having a cavity with a receiving space for receiving an object to be tested, an LCD monitor arranged atop the cavity for viewing a status of the object, and a first switch and a second switch being placed beside the receiving space and operated to turn on/off at least one infrared lamp and ultraviolet lamp. A CMOS sensor is arranged on an inner face beside the cavity and connected to the second switch and the LCD monitor, the CMOS sensor fetching the image reflected from the optical object and displaying the image on the LCD monitor. A processor is arranged in the base and connected to a power supply, the receiver, the first switch and the second switch. The money checking apparatus can be used to examine US dollars, euro bills, Chinese RMB bills and credit cards.
Abstract:
A high power semiconductor laser lighting device has a housing, a fan module arranged in an exhaust hole in the housing, a base connected to the bottom wall of the housing and disposed on a side of the fan module, and a semiconductor laser constant-temperature module. The base has a driving unit with at least one high power electronic component connected to fins of the fan module. The semiconductor laser constant-temperature module has a metallic partition to enclose a vacuum formed in a front portion of the housing, and a heat insulation layer arranged in the vacuum. The metallic partition has a side connecting the heat dissipation plate and an opposite side connecting a heating portion of a thermoelectric cooling chip, which includes a cooling portion connecting to a semiconductor laser lighting module. The high power semiconductor laser lighting device to keep an output power thereof constant within various environments.
Abstract:
A method for predicting a source of semiconductor part deviation is disclosed. The method includes the steps of selecting at least one chart including part parameters and associating with each of the part parameters at least one fabrication process, which are stored in recipes, scanning the selected charts for deviations in the part parameters, wherein the deviations are determined by monitoring a trend of recent values of the part parameters, indicating the charts containing the part parameters wherein the part parameter values are determined as being outside of at least one trend tolerance value associated with the parameter, identifying, in each of the indicated charts at least one process associated with each of the part parameter deviations outside the at least one tread tolerance value, and determining a source of the parameter deviation by correlating each of the identified at least one processes. In one aspect of the invention, the selected chart includes the relationship between part parameters and processes.
Abstract:
A computer implemented method for measuring a person's cognitive load comprises initially receiving 100 stroke data (FIG. 4, FIG. 5(a)) representative of hand-based strokes produced by a person 200 while performing a task. A processor 216 selects 104 a subset of the stroke data FIG. 5(c) that meets one or more predetermined stability criteria. A measure indicative of the person's cognitive load based on the subset of stroke data is determined 106. In this was the user's cognitive load in an objective, uniform and non-intrusive manner by analyzing the user's writing behaviour. An analysis of all of a user's writing strokes will bias the evaluation result. The accuracy of the cognitive load measurement is increased by applying stability criteria to select the best strokes for further analysis. By disregarding unstable strokes the computation costs for determining the user's cognitive load is also improved.
Abstract:
An apparatus, comprising: at least one processor; and at least one memory storing computer program instructions, the at least one processor being configured to execute the computer program instructions to cause the apparatus at least to perform: detecting user input; selecting, in dependence upon the detected user input, at least a portion of an output of a user output device; determining, while the at least a portion of the output of the user output device is selected, whether a user makes a gesture input by moving the apparatus; and altering, in response to determining that the gesture input has been made by the user, the selected at least a portion of the output of the user output device.
Abstract:
A device includes a top metal layer; a UTM line over the top metal layer and having a first thickness; and a passivation layer over the UTM line and having a second thickness. A ratio of the second thickness to the first thickness is less than about 0.33.