Bonded silicon structure for high density print head
    22.
    发明授权
    Bonded silicon structure for high density print head 有权
    用于高密度打印头的粘结硅结构

    公开(公告)号:US08727508B2

    公开(公告)日:2014-05-20

    申请号:US13293235

    申请日:2011-11-10

    IPC分类号: B41J2/16 B41J2/045

    摘要: A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.

    摘要翻译: 可以使用半导体器件制造技术形成包括喷射堆叠的打印头。 可以在诸如半导体晶片或晶片部分的半导体衬底上形成覆盖金属层,覆盖层压电元件层和覆盖层导电层。 压电元件层和覆盖层导电层可以被图案化以分别提供多个换能器压电元件和顶电极,而金属层形成用于多个换能器的底电极。 随后,可以对半导体衬底进行图案化以形成用于打印头喷射叠层的主体板。 使用半导体器件制造技术形成打印头喷射堆叠可以提供具有小特征尺寸的高分辨率设备。

    Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays
    23.
    发明授权
    Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays 有权
    间隙材料,以实现高密度压电阵列的鲁棒电气互连

    公开(公告)号:US08646881B1

    公开(公告)日:2014-02-11

    申请号:US13570056

    申请日:2012-08-08

    IPC分类号: B41J2/045

    摘要: An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.

    摘要翻译: 一种喷墨打印头,包括在相邻的压电元件之间的间隙区域中的多个支撑层支撑件和形成方法。 多个间隔层支撑体可以由与压电元件相同的层,或者由诸如聚合物的电介质层形成。 隔离层支撑增加了可以附接隔离层的区域,从而形成诸如柔性电路或印刷电路板的电路层的更安全的附接到喷射堆叠子组件。

    MULTIPLE LAYER FILTER
    24.
    发明申请
    MULTIPLE LAYER FILTER 有权
    多层过滤器

    公开(公告)号:US20140022320A1

    公开(公告)日:2014-01-23

    申请号:US13554676

    申请日:2012-07-20

    CPC分类号: B41J2/17563

    摘要: A structure and method including a filter assembly, wherein the structure can be an ink jet printhead including the filter assembly. The filter assembly can include a first filter layer having a plurality of pores therein, wherein the pores have a first pitch, and a second filter layer having a plurality of pores therein, wherein the pores in the second filter layer have a second pitch which is different than the first pitch. The structure can include a fluid path through the filter assembly. An area of overlap of the pores in the first filter layer with the pores in the second filter layer, in a vertical direction perpendicular to a plane of the filter assembly, can include a periodicity.

    摘要翻译: 一种包括过滤器组件的结构和方法,其中该结构可以是包括过滤器组件的喷墨打印头。 过滤器组件可以包括其中具有多个孔的第一过滤层,其中孔具有第一间距,以及在其中具有多个孔的第二过滤层,其中第二过滤层中的孔具有第二沥青, 不同于第一音调。 该结构可以包括通过过滤器组件的流体路径。 第一过滤层中的孔与第二过滤层中的孔在垂直于过滤器组件的平面的垂直方向上的重叠区域可以包括周期性。

    High density electrical interconnect for printing devices using flex circuits and dielectric underfill
    25.
    发明授权
    High density electrical interconnect for printing devices using flex circuits and dielectric underfill 有权
    使用柔性电路和电介质底层填料的印刷设备的高密度电气互连

    公开(公告)号:US08585187B2

    公开(公告)日:2013-11-19

    申请号:US13097182

    申请日:2011-04-29

    IPC分类号: B41J2/045 H01L41/22

    摘要: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.

    摘要翻译: 用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜,将柔性电路电连接到多个压电元件,然后在柔性电路和喷射之间分配电介质底部填充物 堆栈子组件。 在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要,并且消除了对图案化间隔层的要求。 在一个实施例中,柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立,而不使用单独的导体,从而消除了由于误插入引起的电气短路的可能性 指挥

    Patterned conductive array and self leveling epoxy
    26.
    发明授权
    Patterned conductive array and self leveling epoxy 有权
    图案导电阵列和自流平环氧树脂

    公开(公告)号:US08567924B2

    公开(公告)日:2013-10-29

    申请号:US13081584

    申请日:2011-04-07

    IPC分类号: B41J2/045

    摘要: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.

    摘要翻译: 形成喷墨打印头的方法可以包括将多个压电元件附接到隔膜,在隔膜上分配间隙层,将多个导电元件电耦合到多个压电元件,以及固化间隙层。 间隙层内的多个电隔离导电颗粒将多个导电元件电耦合到多个压电元件。 导电粒子可以均匀地分布在整个间隙层电介质的整体中,或者它们可以定位在每个压电元件的顶表面上,并插入在多个压电元件和多个导电元件之间。 导电元件可以是柔性电路或印刷电路板的一部分。

    Method for interstitial polymer planarization using a flexible flat plate
    27.
    发明授权
    Method for interstitial polymer planarization using a flexible flat plate 有权
    使用柔性平板的间隙聚合物平面化方法

    公开(公告)号:US08556611B2

    公开(公告)日:2013-10-15

    申请号:US13165785

    申请日:2011-06-21

    IPC分类号: B29C43/20

    摘要: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

    摘要翻译: 一种用于形成具有电介质间隙层的喷墨打印头的方法和结构。 可以使用连接到压机的柔性顶板来对未固化的介质间隙层施加压力。 在将未固化的介质间隙层与柔性顶板接触并使用压机施加压力的同时固化未固化的介质间隙层。 已经发现使用柔性顶板而不是刚性顶板在压电元件阵列上形成固化的间隙层,所述压电元件阵列具有更均匀或平坦的上表面。 这样形成的间隙层可以减少处理时间,减少在使用期间喷墨打印头中的墨水通信的问题以及降低的制造成本。

    Buried traces for sealed electrostatic membrane actuators or sensors
    28.
    发明授权
    Buried traces for sealed electrostatic membrane actuators or sensors 有权
    密封静电膜执行器或传感器的埋地痕迹

    公开(公告)号:US08358047B2

    公开(公告)日:2013-01-22

    申请号:US12240251

    申请日:2008-09-29

    IPC分类号: H02N1/00 H01G7/00 G01L9/12

    摘要: In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.

    摘要翻译: 根据本发明,存在微机电装置及其制造方法。 示例性的微机电装置可以包括第一电介质层; 设置在所述第一介电层上的掩埋导电迹线,使得所述掩埋导体迹线电连接到外部电源; 设置在所述掩埋导电迹线上的第二电介质层; 至少一个导电电极设置在所述第二电介质层上并电连接到所述掩埋的导电迹线; 以及至少一个导电膜,包括设置在所述第二介电层上的膜锚,使得所述至少一个导电膜与所述至少一个导电电极和所述掩埋导体迹线电隔离,其中所述至少一个导电电极电连接 通过埋地导电迹线到电源。

    Method of manufacturing a cast-in place ink feed structure using encapsulant
    30.
    发明授权
    Method of manufacturing a cast-in place ink feed structure using encapsulant 有权
    使用密封剂制造现浇油墨进料结构的方法

    公开(公告)号:US07735225B2

    公开(公告)日:2010-06-15

    申请号:US11694899

    申请日:2007-03-30

    IPC分类号: B21D53/76

    摘要: A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.

    摘要翻译: 在打印头中形成封闭流体路径的方法包括提供与模具构件的上表面间隔开的模具构件和截头喷嘴板。 模具和喷嘴板形成在其上形成有孔的打印头基板上。 将牺牲材料安置在打印头基板的孔口上方并连接截头喷嘴板的终端。 牺牲材料从喷嘴板的终端封装到打印头基板的表面。 去除牺牲材料限定了从打印头基板的孔到喷嘴板的流体路径。