摘要:
In accordance with aspects of the present disclosure, a printhead assembly arranged to dispense ultraviolet curable ink or gel ink and method thereof is disclosed. The printhead assembly includes a plurality of functional plates stacked together; a first adhesive layer arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent function plates to provide chemical resistance to the ultraviolet curable ink or the gel ink.
摘要:
A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.
摘要:
An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.
摘要:
A structure and method including a filter assembly, wherein the structure can be an ink jet printhead including the filter assembly. The filter assembly can include a first filter layer having a plurality of pores therein, wherein the pores have a first pitch, and a second filter layer having a plurality of pores therein, wherein the pores in the second filter layer have a second pitch which is different than the first pitch. The structure can include a fluid path through the filter assembly. An area of overlap of the pores in the first filter layer with the pores in the second filter layer, in a vertical direction perpendicular to a plane of the filter assembly, can include a periodicity.
摘要:
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
摘要:
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.
摘要:
A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
摘要:
In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.
摘要:
A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要:
A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.