摘要:
Methods for forming {110} type facets on a (001) oriented substrate of Group III-V compounds and Group IV semiconductors using selective epitaxial growth is provided. The methods include forming a dielectric film on a (100) substrate. The dielectric film can then be patterned to expose a portion of the substrate and to form a substrate-dielectric film boundary substantially parallel to a direction. A {110} type sidewall facet can then be formed by epitaxially growing a semiconductor layer on the exposed portion of the substrate and the dielectric film.
摘要:
The present invention relates to a lightweight bidirectional hollow core slab, and a doughnut-shaped hollow core body which may be advantageously used in the construction of a bidirectional hollow core slab. The doughnut-shaped hollow core body according to the present invention includes an outer case formed in a generally doughnut shape, wherein a hollow portion with a circular section is formed in the center thereof and corners are rounded with curved surfaces. The bidirectional hollow core slab according to the present invention is made by stably locating the doughnut-shaped hollow core bodies in concrete in such a manner that the doughnut-shaped hollow core body is restrained and mounted in steel bar cages or on the upper and lower steel bars.
摘要:
Methods for forming {110} type facets on a (001) oriented substrate of Group III-V compounds and Group IV semiconductors using selective epitaxial growth is provided. The methods include forming a dielectric film on a (100) substrate. The dielectric film can then be patterned to expose a portion of the substrate and to form a substrate-dielectric film boundary substantially parallel to a direction. A {110} type sidewall facet can then be formed by epitaxially growing a semiconductor layer on the exposed portion of the substrate and the dielectric film.