公开(公告)号：US5213676A

公开(公告)日：1993-05-25

申请号：US883603

申请日：1992-05-11

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: G01R1/04 ,  H01L21/48 ,  H01L21/60 ,  H01L23/58 ,  H05K3/06 ,  H05K3/40

CPC classification number: H01L22/32 ,  G01R1/04 ,  H01L21/4853 ,  H01L24/81 ,  H05K3/4007 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/0369 ,  H05K3/064

Abstract: A method of forming a conductive electrode bump on a first side of a dielectric substrate. The electrode bump is located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate. An electrically conductive test pad, located on a second side of the substrate, is in electrical contact with the opposite end of the via. The method includes the steps of (a)forming a layer of conductive material of generally uniform thickness onto the first side of the substrate, the layer being in a routing pattern for routing electrical signals along the first side; and (b)selectively reducing the thickness of the layer in locations defining the routing pattern to a greater extent than in the location of the bump to provide a bump, that extends from the first side at a height greater than the routing pattern.

Abstract translation: 在电介质基板的第一面上形成导电电极凸块的方法。 电极凸块被定位成使得其通过穿过衬底的导电通孔的一端电接触。 位于基板第二侧的导电测试垫与通孔的相对端电接触。 该方法包括以下步骤：（a）在衬底的第一侧上形成大致均匀厚度的导电材料层，所述层位于沿着第一侧布置电信号的布线图案中; 以及（b）在限定所述布线图案的位置中比在所述凸块的位置更大程度地选择性地减小所述层的厚度，以提供凸起，所述凸起在高于所述布线图案的高度处从所述第一侧延伸。

公开(公告)号：US5169056A

公开(公告)日：1992-12-08

申请号：US838979

申请日：1992-02-21

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3025

Abstract: A method and article made by such method are described for connecting electrodes on one face of an integrated circuit semiconductor device with those on a supporting substrate. The method comprises positioning electrodes formed on one face of the device into engagement with electrodes formed on the substrate. A force is applied to press the electrodes together and during application of the force a first adhesive is applied along only a minor portion of two edges of the device. The first adhesive is stiffened to provide a temporary connection of the device and the substrate. A mass of a second adhesive is applied over a face of said device opposite said one face and onto portions of the substrate adjacent the periphery of the device with substantially no adhesive located between the one face of the device and the substrate at a center area of the one face. The second adhesive is hardened to form an adhesive dome that permanently connects the device to the substrate.

Abstract translation: 描述了通过这种方法制造的方法和制品，用于将集成电路半导体器件的一个面上的电极与支撑衬底上的电极连接。 该方法包括将形成在器件的一个面上的电极定位成与形成在衬底上的电极接合。 施加力以将电极按压在一起，并且在施加力期间，仅沿设备的两个边缘的较小部分施加第一粘合剂。 第一粘合剂被硬化以提供装置和基底的临时连接。 将第二粘合剂的质量施加在所述装置的与所述一个面相对的表面上，并且邻近所述装置的周边的衬底的部分上，基本上没有粘合剂位于所述装置的一个面和所述衬底的中心区域之间 一脸。 第二粘合剂被硬化以形成将该装置永久地连接到基底的粘合圆顶。