Abstract:
A camera that includes negative film and a CCD sensor for simultaneously capturing images chemically and electronically using a beam splitter. A liquid crystal display is used for viewing the captured images immediately after they are captured or for reviewing images stored in a removable memory for deletion or output. An adjustable lens and mirror which can route light from the source directly to the film when a high quality image is to be captured, so that the source light is not split between the film negative and the sensor. The images can be stored at various densities, such as 3.times.5 print or fax resolution, to match the intended output. The memory is organized into stack locations. Each stack location can store one or more images of varying densities allowing the camera to effectively use the memory. The storage status of each stack location is indicated by stack location partition flags. A full memory can also be removed and replaced. The stored images can also be transferred to other forms of media.
Abstract:
A printer and method of generating hard copy comprising only one ejection step from either a thermal printing mechanism using one print head or a thermal printing mechanism using first and second thermal printing heads. The thermal printing mechanism with one printing head operates bilaterally. Alternatively, the thermal printing mechanism simultaneously operates dual thermal printing heads with only one ejection for release of a thermally sensitive hard copy output media.
Abstract:
Thermal printer donor media element (10) with a single track of code including sequential code segments (30). The present donor media element (10) includes sequential color patches (12, 14, 16) which form multiple color groups (18) located along the length of the element (10), and the code segments (30) are arranged in corresponding repetitive groups located adjacent the color groups (18), the sequential code segments including fields of encoded data representative of at least donor media type, and color and location of successive ones of the color patches (12, 14, 16). Apparatus for detecting and reading the encoded data include a single sensor (38) and a processor (44) operable for accurately completing incomplete or incorrectly detected data.
Abstract:
An improved amplifier architecture for providing an output as a function of light sensed by a photodetector element where the amplifier has an input for receiving the current output from the photodetector element and an output for providing an output that is a clamped function of light sensed by the photodetector element. A feedback circuit is connected between the input and the output of the amplifier. A signal clamp connected to the output of the amplifier that clamps the output of the amplifier to a predetermined value. A summing node having first, second, and third inputs, and an output at which a signal that is a function of sensed light is provided. A first current path connected between the input to the amplifier and to a first input of the summing node for passing excess current from the input of the amplifier to the summing node when the output of the amplifier is at its clamped output. Also provided is a second current path connected between the output of the amplifier and a second input to the summing node along with a reference voltage source connected to the third input to the summing node for limiting the current flowing through the second current path.
Abstract:
Improved rise and fall times for the driving pulses used to drive the laser in a laser writer are achieved by incorporating the sources of the READ, WRITE, and BOOST pulses in one ASIC chip and by having the pulses driving only one laser current driver stage which is held on by a READ signal, but which can be turned on harder when a WRITE and/or BOOST signal is applied, thus the delay associated with turning on the laser current driver stage is eliminated permitting higher writing speeds.
Abstract:
The electrode structure for selectively energizing a particular light emitting diode site of a light emitting diode array chip includes a narrow electrode strip connected at one end to the diode site, a test pad wider than the conductor strip electrically connected to the other end thereof, a bonding pad wider than said electrode strip and spaced from the test pad opposite the diode site and a severable connecting strip narrower than either pad electrically connecting those two pads to each other.
Abstract:
Standard array, programmable image forming process. The process includes the steps of providing or forming a standardized array of pixel sites (16) on a surface of a substrate (12), each pixel site (16) including at least one color element (18, 20, 22) or colored sub-pixel at a predetermined location on the substrate (12), and providing or forming an opaque layer (24) over the pixel sites (16) obscuring the color elements (18,20,22) or sub-pixels thereof, the opaque layer (24) being changeable for rendering selected of the color elements (18,20,22) or sub-pixels visible for forming the image. The substrate (12) can include a paper material or a plastics film such as a transparent film, and the pixels sites (16) can be mass produced thereon by a suitable process, such as ink printing process, a thermal printing process, a laser printing process or the like. The opaque layer (24) can be any suitable organic or inorganic material operable for obscuring the pixel sites (16), the opaque layer (24) being capable of selective removal or ablation for rendering the selected color elements (18, 20, 22) visible.
Abstract:
A protective arrangement (20, 30), method and scanner that prevent scratching of a scanning surface (11) of a scanner (15). The protective arrangement can be removably mounted on the scanning surface so as to limit or reduce access area to the scanning surface. Further, the protective arrangement is positioned on the scanning surface in a manner that permits placement of an image to be scanned, such as a document or object, between the scanning surface and the protective arrangement. The protective arrangement can be in the form of bands (20a, 20b) and/or a planar grid structure (30) which can be removably attached to a body of the scanner. The protective arrangement can also define at least one opening that permits manipulation of the image to be scanned to a desired position on the scanning surface, while the image to be scanned is located between the protective arrangement and the scanning surface.
Abstract:
A photodetector that incorporates at least two photosensitive regions (separated by at least one physical gap) of a first semiconductor type with the at least two photosensitive regions being supported on a substrate and acting as first terminals of the photodetector is improved by; adding a second semiconductor type into the physical gap(s) abutting the at least two photosensitive regions. The second semiconductor region(s) form a barrier to the out diffusion between the at least two photosensitive regions of the first semiconductor type. Additionally, the second semiconductor type region acts as a second photodetector terminal. This improved geometry results in faster rise and fall times of the photodetector's output current by decreasing the 3-D spaces within the gap(s) between the at least two photosensitive regions which were not subjected to the presence of an E-field when unimproved photodetectors were biased into operation.
Abstract:
An integrated laser module is formed with a laser having an input for receiving power and an output for emitting light being positioned so as to pass through a thermally conductive lower module body such that laser emitted light passes from the lower module body, and the lower housing acts as a heat sink. An HFI shielding substrate assembly is positioned in the lower module body adjacent to the laser with the laser input passing through the shielding substrate. A laser driver circuit is connected to the input of the laser, and an injection circuit is connected to the input to the laser and EMI shielded from the driver circuit. A top module body is fixed to the lower module body to form an EMI shield package around all of the components.