Abstract:
An HF filter using resonators of a convex-concave structure is capable of easily inserting a serial or parallel capacitance inside the resonators for the sake of a characteristic improvement of frequency at a stop band desired. In the inventive HF filter, an error compensation is simple and a size smallization is available, by utilizing the resonators of the convex-concave structure. Such HF filter consists of a dielectric block having a multitude of grooves formed, in a length direction, on an upper face thereof; a plurality of resonators formed by covering a lowly constant portion of each groove with conductive material, for resonating signals inputted from the outside; a grounding electrode formed on an outer face of the dielectric block and electrically shorted with the PCB; an input electrode for receiving signals from the outside; an output electrode for outputting signals; and a first nonplating part for preventing the input and output electrodes from being electrically shorted with the grounding electrode and realizing a capacitive coupling among the input and output electrodes and its adjacent resonators, thereby being employed in a smallization of a radio communication system and an improvement of a communicative characteristic.
Abstract:
The present invention relates to dielectric ceramic compositions for microwave applications consisting of BaO, PbO, Nd.sub.2 O.sub.3, CeO.sub.2, La.sub.2 O.sub.3 and TiO.sub.2 or consisting of compositions including these elements and having a composition formula (I). x(Ba.sub.1-.alpha. Pb.sub..alpha.)O-y�Nd.sub.2 O.sub.3(1-.beta.-.gamma.) CeO.sub.2(.beta.) La.sub.2 O.sub.3(.gamma.) !-zTiO.sub.2 (I) wherein mol %, 6.ltoreq.x.ltoreq.20, 10.ltoreq.y.ltoreq.20, 60.ltoreq.z.ltoreq.75, x+y+z=100; and 0
Abstract translation:本发明涉及由BaO,PbO,Nd 2 O 3,CeO 2,La 2 O 3和TiO 2组成的微波应用的电介质陶瓷组合物或由包含这些元素并具有组成式(I)的组合物构成。 x(Ba1-αBbα)Oy [Nd2O3(1-β-γ)CeO2(β)La2O3(γ)] -zTiO2(I)其中mol%,6≤x≤20, y = 20,60
Abstract:
A method for manufacturing a spherical frozen food is provided. One or more plates are provided. The plates, when together, form a spherical mold. An inlet facilitates the injection of a mixture into the mold. The mold is subjected to a low temperature such that the mixture is caused to freeze. A rotating mechanism may cause one or more of the plates to open and/or rotate outwardly such that the frozen material may be removed from the mold with ease. Liquid nitrogen may be used to freeze the material.
Abstract:
An oscillation circuit includes an internal voltage generator and an oscillator. The internal voltage generator receives an external voltage and generates an internal voltage based on the external voltage. The internal voltage varies in linearly with an operational temperature. The oscillator generates a variable oscillation signal based on the internal voltage. A period of the variable oscillation signal varies in linearly with the operational temperature.
Abstract:
A semiconductor memory device includes a refresh control circuit and a memory cell array. The refresh control circuit generates an internal auto refresh control signal based on a chip select signal and an external self refresh control signal. The memory cell array is refreshed in response to the internal auto refresh control signal. Because the semiconductor memory device internally generates the internal auto refresh control signal performing auto refresh operations, the semiconductor memory device may not be required to transmit to external devices for performing the auto refresh operations, and thus pins or pads for transmitting signals may be reduced and operation time may become faster.
Abstract:
A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.
Abstract:
Provided is a broadband microstrip-waveguide transition apparatus operating in a millimeter waveband. The millimeter-wave band broadband microstrip-waveguide transition apparatus includes a slot for transferring an electromagnetic signal propagating along a microstrip line, a main patch positioned between the slot and a waveguide and resonating from the signal transferred from the slot, and a parasitic patch positioned between the main patch and the waveguide and resonating together with the main patch. According to the millimeter-wave band broadband microstrip-waveguide transition apparatus, it is possible to transfer a signal from the microstrip line to the waveguide, and to increase a resonance bandwidth to a broadband level.
Abstract:
A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.
Abstract:
In particular embodiments, a system and method for representing an exploration of resources over a communication network is disclosed. According to the embodiments, if a search query representing a target resource locator is received from a user, resources having links to the target resource locator are searched. Then, a data structure including a hierarchy of nodes and its graphical representation is generated for representing the resources each having a link to the target resource locator. The graphical representation may include a constellation map including a plurality of planets representing the resources each having a link to the target resource locator. Such data structure and graphical representation may be saved in a database for later retrieval. The system and method provides a user-friendly graphical representation of exploring resources linked to a target resource such as a webpage or a blog site managed by the user.
Abstract:
Method for fabricating an LCD having the liquid crystal dropping method applied thereto, including providing a first substrate and a second substrate having seals formed thereon, loading the first and second substrates into a bonding chamber, bonding the first and second substrates, setting the bonded first and second substrates, venting the bonding chamber for applying a pressure to the first and second substrates, and unloading the first and second substrates having the pressure applied thereto.