Abstract:
In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.
Abstract:
A method of manufacturing an article includes simultaneously holding, with a vacuum device, a first object and a second object that are overlapped and abutted against each other. The method also includes simultaneously transporting the first and second objects relative to a machine. Still further, the method includes attaching the first and second objects together with the machine.
Abstract:
A method for forming a porous PTFE layer includes steps of: combining one or at least two unburned porous PTFE films and a support body that can withstand a heating condition in the following process (a rod or plate shaped support body made of mesh or the like is preferable) by using a predetermined means in such a manner that a slip can be prevented in a heating treatment in the following process; and heating the matter resulted from the above process at a temperature of at least 150° C. and less than the melting point of the PTFE film for the range of 5-120 minutes (preferably at a temperature in the range of the melting point of a thermoplastic resin fiber to 320° C. for the range of 10-60 minutes in the case in which the thermoplastic resin fiber or the like is used in the process).
Abstract:
A method forming a porous PTFE layer includes steps of: combining one or at least two unburned porous PTFE films and a support body that can withstand a heating condition in the following process (a rod or plate shaped support body made of mesh or the like is preferable) by using a predetermined means in such a manner that a slip can be prevented in a heating treatment in the following process; and heating the matter resulted from the above process at a temperature of at least 150° C. and less than the melting point of the PTFE film for the range of 5-120 minutes (preferably at a temperature in the range of the melting point of a thermoplastic resin fiber to 320° C. for the range of 10-60 minutes in the case in which the thermoplastic resin fiber or the like is used in the process).
Abstract:
A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.
Abstract:
The invention relates to a method for producing a can body (2) which is characterized in that a film piece (3c) is cut from a film web (3b), said film piece (3c) is wound up on a winding spindle (7) from its front edge to its rear edge and is maintained on the winding spindle (7) so that it somewhat overlaps. The film piece (3c) is transferred from the winding spindle (7) to a concave inner surface (11a) and the film areas of the front edge and the rear edge resting against each other are sealed with each other on the concave inner surface (11a) in the area of overlapping (14). According to the invention, a closed film piece (3d) can be transferred without complication onto a can body (2), thereby conferring on the can body (2) the function of the stable structure and on the film piece (3d) the function of the décor or the inner barrier in such a manner that both functions can be optimized in a substantially independent manner.
Abstract:
An optical disk of the present invention includes a first substrate having a signal area on a principal plane and a central hole, and a second substrate that is transparent and attached to the first substrate. The second substrate is thinner than the first substrate, and has a central hole whose diameter is larger than that of the first substrate. The first substrate and the second substrate are attached to each other with radiation curable resin (adhesive member) disposed therebetween so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof.
Abstract:
Various processes and relevant devices for causing polymer films, which are extensible with the help of the devices disclosed in Patent Application WO No. 98/32668 of Jan. 23, 1998 and in its applications, to adhere to the edges of openings of plastic or PET or even metal containers, by releasing electrostatic charges opposite in sign to those of containers and/or the polymer films to be applied thereto. P.S.nullThe processes derive from a single general inventive concept
Abstract:
An optical disk of the present invention includes a first substrate having a signal area on a principal plane and a central hole, and a second substrate that is transparent and attached to the first substrate. The second substrate is thinner than the first substrate, and has a central hole whose diameter is larger than that of the first substrate. The first substrate and the second substrate are attached to each other with radiation curable resin (adhesive member) disposed therebetween so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof
Abstract:
A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.