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    Cargo tightener and strap collector with improved release mechanism
    21.
    发明授权
    Cargo tightener and strap collector with improved release mechanism 有权
    货物紧固器和带收集器具有改进的释放机制

    公开(公告)号：US07861382B1

    公开(公告)日：2011-01-04

    申请号：US11942180

    申请日：2007-11-19

    Applicant: Frank Joseph Madachy ,  John Scott Yoder

    Inventor： Frank Joseph Madachy ,  John Scott Yoder

    IPC: B25B25/00 ,  B66D1/00

    CPC classification number: B60P7/0846 ,  Y10T24/21 ,  Y10T24/2175

    Abstract: A cargo tightener and strap collector is shown having a rotatable shaft provided on the lever portion of the cargo tightener and strap collector. A slot is provided in the shaft so that the free end of a strap may be inserted in the slot and wound on the shaft to secure the strap and prevent its fluttering in the wind or trailing on the ground while in use. The rotatable shaft provided on the lever portion of the cargo tightener and strap collector is made to have a cross-section or shape, at least proximate one end, to mate or interfere with a recess in at least one of the sidewalls on the lever portion when a second rotation means urges the sidewalls together. There is thus provided positive locking of the wound strap.

    Abstract translation: 货物收紧器和带收集器被示出为具有设置在货物收紧器和带收集器的杠杆部分上的可旋转轴。 在轴中设置有槽，使得带的自由端可以插入槽中并缠绕在轴上以固定带，并在使用时防止其在风中飘动或落在地面上。 设置在货物收紧器和带收集器的杠杆部分上的可旋转轴被制成具有至少靠近一端的横截面或形状，以与杠杆部分中的至少一个侧壁中的凹部配合或干涉 当第二旋转装置将侧壁推向一起时。 因此，提供了缠绕带的正锁定。

    ESD protection of an RF PA semiconductor die using a PA controller semiconductor die
    25.
    发明授权
    ESD protection of an RF PA semiconductor die using a PA controller semiconductor die 有权
    使用PA控制器半导体管芯的RF PA半导体管芯的ESD保护

    公开(公告)号：US08842399B2

    公开(公告)日：2014-09-23

    申请号：US13288373

    申请日：2011-11-03

    Applicant: David E. Jones ,  William David Southcombe ,  Chris Levesque ,  Scott Yoder ,  Terry J. Stockert

    Inventor： David E. Jones ,  William David Southcombe ,  Chris Levesque ,  Scott Yoder ,  Terry J. Stockert

    IPC: H02H3/22 ,  H03F1/52 ,  H03F3/24 ,  H03F3/19 ,  H02H9/04

    CPC classification number: H03F1/52 ,  H02H9/046 ,  H03F3/19 ,  H03F3/245

    Abstract: A power amplifier (PA) controller semiconductor die and a first radio frequency (RF) PA semiconductor die are disclosed. The PA controller semiconductor die includes a first electro-static discharge (ESD) protection circuit, which ESD protects and provides a first ESD protected signal. The RF PA semiconductor die receives the first ESD protected signal. In one embodiment of the PA controller semiconductor die, the first ESD protected signal is an envelope power supply signal. The PA controller semiconductor die may be a Silicon complementary metal-oxide-semiconductor (CMOS) semiconductor die and the RF PA semiconductor die may be a Gallium Arsenide semiconductor die.

    Abstract translation: 公开了功率放大器（PA）控制器半导体管芯和第一射频（RF）PA半导体管芯）。 PA控制器半导体管芯包括第一静电放电（ESD）保护电路，其ESD保护并提供第一ESD保护信号。 RF PA半导体管芯接收第一个ESD保护信号。 在PA控制器半导体管芯的一个实施例中，第一ESD保护信号是包络电源信号。 PA控制器半导体管芯可以是硅互补金属氧化物半导体（CMOS）半导体管芯，并且RF PA半导体管芯可以是砷化镓半导体管芯。

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