公开(公告)号：US20130000873A1

公开(公告)日：2013-01-03

申请号：US13216269

申请日：2011-08-24

申请人： XIAN-XIU TANG

发明人： XIAN-XIU TANG

IPC分类号： F28D15/00

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20218 ,  H01L2924/00

摘要： An exemplary heat dissipation system includes a built-in heat dissipation module for being positioned in a computer case, a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case. The built-in heat dissipation module includes cooling fluid. The add-on heat dissipation module includes a receiving frame and a heat dissipation device fixed to the receiving frame. The receiving frame engages with the heat dissipation device to receive the cooling fluid. The receiving frame communicates with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.

摘要翻译： 示例性的散热系统包括内置的散热模块，用于定位在计算机外壳中，与内置散热模块连通的液体泵，以及用于定位在计算机外壳外部的附加散热模块 。 内置散热模块包括冷却液。 附加散热模块包括固定到接收框架的接收框架和散热装置。 接收框架与散热装置接合以接收冷却流体。 接收框架与内置的散热模块和液体泵连通，使得冷却液能够在液体泵的控制下在内置的散热模块和接收框架之间循环。

公开(公告)号：US08322405B2

公开(公告)日：2012-12-04

申请号：US12650438

申请日：2009-12-30

申请人： Xian-Xiu Tang ,  Zhen-Xing Ye

发明人： Xian-Xiu Tang ,  Zhen-Xing Ye

IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K7/00

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat conducting board attached to an electronic component mounted on a printed circuit board, a fin unit disposed on the heat conducting board, a fixing module, and a fan secured on the fixing module. The fixing module includes a pivoting post extending through the fin unit, a fan holder spanning over the fin unit and pivotally fixed to the pivoting post, and two fastening members engaging with two opposite ends of the pivoting post and being capable of fixing the fan holder at different positions relative to the fin unit. The fan is fixed to the fan holder of the fixing module and provides airflow towards the fin unit.

摘要翻译： 散热装置包括安装在安装在印刷电路板上的电子部件上的导热板，设置在导热板上的散热片单元，固定模块和固定在固定模块上的风扇。 所述固定模块包括延伸穿过所述翅片单元的枢转​​柱，跨过所述翅片单元并枢转地固定到所述枢转柱的风扇保持架，以及与所述枢转柱的两个相对端接合并且能够固定所述风扇架的两个紧固构件 在相对于翅片单元的不同位置处。 风扇固定在固定模块的风扇架上，并向散热片单元提供气流。

公开(公告)号：US20120145274A1

公开(公告)日：2012-06-14

申请号：US12978530

申请日：2010-12-24

申请人： ZHEN-XING YE ,  XIAN-XIU TANG

发明人： ZHEN-XING YE ,  XIAN-XIU TANG

IPC分类号： F16L9/18

CPC分类号： G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An air duct device includes a first air duct, and a second air duct slidably fitting about the first duct. The first air duct axially defines a first passage and defines a row of latching slots along an extending direction of the first passage. The second air axially defines a second passage. A latching hook is formed on the second air duct to be selectively latched to one of the latching slots.

摘要翻译： 空气管道装置包括第一空气管道和可滑动地装配在第一管道周围的第二风道。 第一风道轴向地限定第一通道并且沿着第一通道的延伸方向限定一排闩锁槽。 第二空气轴向地限定第二通道。 闭锁钩形成在第二空气管道上，以选择性地锁定到一个锁定槽。

公开(公告)号：US20120138263A1

公开(公告)日：2012-06-07

申请号：US12972507

申请日：2010-12-19

申请人： XIAN-XIU TANG ,  ZHEN-XING YE

发明人： XIAN-XIU TANG ,  ZHEN-XING YE

IPC分类号： F28F13/00

CPC分类号： G06F1/20 ,  F04D25/0613 ,  F04D29/601

摘要： A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate.

摘要翻译： 散热装置用于散发由主板的多个存储芯片产生的热量。 散热装置包括两个支架，它们连接到母板上，并且在存储芯片的相对侧，是一个支架和一个风扇。 支撑件包括固定板和从固定板的相对端延伸的两个夹板。 夹板可旋转地安装在支架上，并且位于存储芯片的上方。 风扇夹在夹板之间或安装在固定板上。

公开(公告)号：US20110117832A1

公开(公告)日：2011-05-19

申请号：US12763187

申请日：2010-04-19

申请人： XIAN-XIU TANG ,  ZHEN-XING YE ,  CHIA-SHIN CHOU

发明人： XIAN-XIU TANG ,  ZHEN-XING YE ,  CHIA-SHIN CHOU

IPC分类号： F24F7/007 ,  F16L9/00

CPC分类号： G06F1/20

摘要： An air conducting device includes an air-guiding unit, and a fan. The air-guiding unit includes a fixing member and a conducting member slidably mounted to the fixing member. The fixing member defines a number of slots arranged in a line, and a through passage. The conducting member defines a through hole communicating with the through passage. A locking protrusion protrudes from the conducting member, and the locking protrusion is adjustably engaged in one of the number of slots. The fan is fixed in the through passage of the fixing member, opposite to the conducting member.

摘要翻译： 导气装置包括空气引导单元和风扇。 空气引导单元包括固定构件和可滑动地安装到固定构件的导电构件。 固定构件限定了排列成一行的多个槽和贯通通道。 导电构件限定了与通路连通的通孔。 锁定突起从导电构件突出，并且锁定突起可调节地接合在多个槽中的一个槽中。 风扇固定在与导电件相对的固定件的通道中。

公开(公告)号：US20110100612A1

公开(公告)日：2011-05-05

申请号：US12647385

申请日：2009-12-24

申请人： Xian-Xiu Tang ,  Zhen-Xing Ye

发明人： Xian-Xiu Tang ,  Zhen-Xing Ye

IPC分类号： F28D15/00

CPC分类号： G06F1/20 ,  F28D15/0266 ,  F28D15/0275 ,  G06F2200/201 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a heat-dissipating member, a driving member and a heat-absorbing member connected together to form a heat transfer loop. A coolant is filled in the heat transfer loop. The heat-absorbing member defines therein a receiving chamber. A heat sink and a heat pipe are received in the receiving chamber. The heat pipe thermally connects the heat sink to a heat-absorbing plate of the heat-absorbing member. The heat-absorbing plate is used for contacting with a heat-generating component. The coolant is driven by the driving member to circulate between the heat-absorbing member. Heat generated by the heat-generating component is absorbed by the heat-absorbing plate and transferred to the heat sink via the heat pipe. The heat sink releases the heat to the coolant. The coolant takes the heat from the heat-absorbing member to the heat-dissipating member for dissipating.

摘要翻译： 液体冷却装置包括散热构件，驱动构件和连接在一起以形成传热回路的吸热构件。 冷却液填充在传热回路中。 吸热构件在其中限定有容纳室。 散热器和热管被容纳在接收室中。 热管将散热器与吸热构件的吸热板热连接。 吸热板用于与发热部件接触。 冷却剂由驱动构件驱动，在吸热构件之间循环。 由发热部件产生的热量被吸热板吸收并通过热管传递到散热器。 散热片将热量释放到冷却液中。 冷却剂将热量从吸热构件传递到散热构件以进行散热。

公开(公告)号：US20110094713A1

公开(公告)日：2011-04-28

申请号：US12760560

申请日：2010-04-15

申请人： ZHENG-HENG SUN ,  XIAN-XIU TANG

发明人： ZHENG-HENG SUN ,  XIAN-XIU TANG

IPC分类号： G06F1/20

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a fixing board defining a fixing groove, a heat sink device fixed to the fixing board, a fan housing assembly fixed to the heat sink device, and a heat dissipation pipe. The heat sink device defines a first receiving groove aligning with the fixing groove, and a second receiving groove opposite to the first receiving groove. The fan housing assembly includes a frame defining a slot aligning with the second receiving groove, and a fan received in the frame. The dissipation pipe includes a first pipe portion, a second pipe portion, and an arc-shaped connecting portion connecting the first and second pipe portions. The first pipe portion is accommodated in the fixing groove and the first receiving groove. The second pipe portion is accommodated in the second receiving groove and the slot.

摘要翻译： 散热组件包括限定固定槽的固定板，固定在固定板上的散热装置，固定在散热装置上的风扇壳体组件和散热管。 散热装置限定与固定槽对准的第一容纳槽和与第一容纳槽相对的第二容纳槽。 风扇壳体组件包括限定与第二接收槽对准的狭槽的框架和容纳在框架中的风扇。 散热管包括第一管部分，第二管部分和连接第一和第二管部分的弧形连接部分。 第一管部容纳在固定槽和第一容纳槽中。 第二管部容纳在第二容纳槽和槽中。

公开(公告)号：US20110021132A1

公开(公告)日：2011-01-27

申请号：US12542709

申请日：2009-08-18

申请人： CHIA-SHIN CHOU ,  ZHEN-XING YE ,  XIAN-XIU TANG

发明人： CHIA-SHIN CHOU ,  ZHEN-XING YE ,  XIAN-XIU TANG

IPC分类号： H05K5/00

CPC分类号： G06F1/181 ,  G06F1/20

摘要： A computer enclosure includes a front panel. A fan bracket is provided for mounting a fan on the front panel. The fan bracket includes two parallel supporting beams installed on the front panel and two parallel mounting beams slidably fixed between the two supporting beams. The fan is adjustably mounted on the two mounting beams.

摘要翻译： 电脑机箱包括前面板。 提供风扇支架，用于在前面板上安装风扇。 风扇支架包括安装在前面板上的两个平行的支撑梁和可滑动地固定在两个支撑梁之间的两个平行的安装梁。 风扇可调节地安装在两个安装梁上。

公开(公告)号：US20130163194A1

公开(公告)日：2013-06-27

申请号：US13439867

申请日：2012-04-05

申请人： CHIH-CHUNG SHIH ,  CHIA-WEN LEE ,  CHAO-KE WEI ,  XIAN-XIU TANG

发明人： CHIH-CHUNG SHIH ,  CHIA-WEN LEE ,  CHAO-KE WEI ,  XIAN-XIU TANG

IPC分类号： G06F1/20

CPC分类号： G06F1/20

摘要： A cabinet includes a chassis, a server module, a first cooling module, and a number of second cooling modules. The server module includes servers received in the chassis, and each server includes heat generating components. The first cooling module includes first fans. The second cooling modules are mounted in each server. Each second cooling module includes a second fan and a temperature sensor electrically connected to the second fan. When temperatures measured by the sensors are lower than a predetermined temperature, only the first fans are employed to dissipate heat of the servers; when any of the measured temperatures is higher than the predetermined temperature, the temperature sensor that detected the higher temperature transmits a signal to the corresponding second fan for starting the second fan.

摘要翻译： 机柜包括底盘，服务器模块，第一冷却模块和多个第二冷却模块。 服务器模块包括接收在机箱中的服务器，并且每个服务器包括发热部件。 第一冷却模块包括第一风扇。 第二个冷却模块安装在每个服务器中。 每个第二冷却模块包括电连接到第二风扇的第二风扇和温度传感器。 当由传感器测量的温度低于预定温度时，仅使用第一风扇来散发服务器的热量; 当任何测量温度高于预定温度时，检测到较高温度的温度传感器将信号发送到相应的第二风扇以启动第二风扇。

公开(公告)号：US08422226B2

公开(公告)日：2013-04-16

申请号：US13045574

申请日：2011-03-11

申请人： Zhen-Xing Ye ,  Xian-Xiu Tang

发明人： Zhen-Xing Ye ,  Xian-Xiu Tang

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes a bracket attached to the motherboard and at one side of the memory chips, at least one fan, and at least one connection member attached to the corresponding fan. The fan is adjustably attached to the bracket by the connection member.

摘要翻译： 散热装置用于散发由主板的多个存储芯片产生的热量。 所述散热装置包括附接到所述母板和所述存储器芯片的一侧的支架，至少一个风扇和附接到相应风扇的至少一个连接构件。 风扇通过连接构件可调节地附接到支架。