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公开(公告)号:US11360030B2
公开(公告)日:2022-06-14
申请号:US16782005
申请日:2020-02-04
Applicant: Applied Materials Israel Ltd.
Inventor: Yotam Sofer , Shaul Engler , Boaz Cohen , Saar Shabtay , Amir Bar , Marcelo Gabriel Bacher
Abstract: Disclosed is a system, method and computer readable medium for selecting a coreset of potential defects for estimating expected defects of interest. An example method includes obtaining a plurality of defects of interest (DOIs) and false alarms (FAs) from a review subset selected from a group of potential defects received from an inspection tool. The method further includes generating a representative subset of the group of potential defects. The representative subset includes potential defects selected in accordance with a distribution of the group of potential defects within an attribute space. The method further includes, upon training a classifier using data informative of the attribute values of the DOIs, the potential defects of the representative subset, and respective indications thereof as DOIs or FAs, applying the classifier to at least some of the potential defects to obtain an estimation of a number of expected DOIs in the specimen.
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公开(公告)号:US20210233220A1
公开(公告)日:2021-07-29
申请号:US16752353
申请日:2020-01-24
Applicant: Applied Materials Israel Ltd.
Inventor: Boaz Cohen , Gadi Greenberg , Sivan Lifschitz , Shay Attal , Oded O. Dassa , Ziv Parizat
Abstract: Implementations of the disclosure provide methods for generating an in-die reference for die-to-die defect detection techniques. The inspection methods using in-die reference comprise finding similar blocks of a lithographic mask, the similar blocks are defined by similar CAD information. A comparison distance is selected based on (i) areas of the similar blocks and (ii) spatial relationships between the similar blocks. The similar blocks are aggregated, based on the comparison distance, to provide multiple aggregated areas; and comparable regions of the lithographic mask are defined based on the multiple aggregate blocks. Images of at least some of the comparable regions of the lithographic mask are acquired using an inspection module. The acquired images are compared.
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公开(公告)号:US09904995B2
公开(公告)日:2018-02-27
申请号:US14964527
申请日:2015-12-09
Applicant: Applied Materials Israel Ltd.
Inventor: Leonid Karlinsky , Moshe Rosenweig , Boaz Cohen
CPC classification number: G06T7/001 , G06K9/621 , G06K2209/19 , G06T5/002 , G06T2207/30148
Abstract: An inspection system that may include a processor and a memory module; wherein the memory module is configured to store a first image of an area of an object and a second image of the area of the object; wherein the processor is configured to generate a synthetic image of the area of the object, and to compare the synthetic image to the second image to provide defect detection results.
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公开(公告)号:US11983867B2
公开(公告)日:2024-05-14
申请号:US17730117
申请日:2022-04-26
Applicant: Applied Materials Israel Ltd.
Inventor: Ariel Shkalim , Vladimir Ovechkin , Evgeny Bal , Ronen Madmon , Ori Petel , Alexander Chereshnya , Oren Shmuel Cohen , Boaz Cohen
CPC classification number: G06T7/001 , G03F7/70666 , G06T1/0014 , G01N2021/8854 , G06T2207/10032 , G06T2207/30141 , G06T2207/30148
Abstract: There is provided a mask inspection system and a method of mask inspection. The method comprises: detecting, by the inspection tool, a runtime defect at a defect location on a mask of a semiconductor specimen during runtime scan of the mask, and acquiring, by the inspection tool after runtime and based on the defect location, a plurality sets of aerial images of the runtime defect corresponding to a plurality of focus states throughout a focus process window, each set of aerial images acquired at a respective focus state. The method further comprises for each set of aerial images, calculating a statistic-based EPD value of the runtime defect, thereby giving rise to a plurality of statistic-based EPD values each corresponding to a respective focus state, and determining whether the runtime defect is a true defect based on the plurality of statistic-based EPD values.
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公开(公告)号:US11790515B2
公开(公告)日:2023-10-17
申请号:US17751507
申请日:2022-05-23
Applicant: Applied Materials Israel Ltd.
Inventor: Irad Peleg , Ran Schleyen , Boaz Cohen
IPC: G06T7/00 , G06T7/11 , G06F18/22 , G06F18/214 , G06V10/82 , G06V10/44 , G06V20/69 , G01N21/95 , G06N3/06
CPC classification number: G06T7/0004 , G01N21/9501 , G06F18/214 , G06F18/22 , G06N3/06 , G06T7/0008 , G06T7/11 , G06V10/454 , G06V10/82 , G06V20/69 , G06T2207/10061 , G06T2207/20084 , G06T2207/30148
Abstract: A system for classifying a pattern of interest (POI) on a semiconductor specimen is disclosed. The system comprises a processor and memory circuitry. The memory circuitry is configured to obtain a high-resolution image of the POI, and to generate data usable for classifying the POI in accordance with a defectiveness-related classification. To generate the data, a machine learning model is utilized that has been trained in accordance with training samples. The training samples include a high-resolution training image captured by scanning a respective training pattern on a specimen, the respective training pattern being similar to the POI. The training samples also include a label associated with the image, the label being derivative of low-resolution inspection of the respective training pattern.
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公开(公告)号:US11449711B2
公开(公告)日:2022-09-20
申请号:US16733219
申请日:2020-01-02
Applicant: Applied Materials Israel Ltd.
Inventor: Ran Badanes , Ran Schleyen , Boaz Cohen , Irad Peleg , Denis Suhanov , Ore Shtalrid
Abstract: There is provided a method of defect detection on a specimen and a system thereof. The method includes: obtaining a runtime image representative of at least a portion of the specimen; processing the runtime image using a supervised model to obtain a first output indicative of the estimated presence of first defects on the runtime image; processing the runtime image using an unsupervised model component to obtain a second output indicative of the estimated presence of second defects on the runtime image; and combining the first output and the second output using one or more optimized parameters to obtain a defect detection result of the specimen.
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公开(公告)号:US20220198639A1
公开(公告)日:2022-06-23
申请号:US17694131
申请日:2022-03-14
Applicant: Applied Materials Israel Ltd.
Inventor: Vadim Vereschagin , Roman Kris , Ishai Schwarzband , Boaz Cohen , Evgeny Bal , Ariel Shkalim
Abstract: Input data may be received. The input data may include an image of a pattern and location data that identifies a modified portion of the pattern. A processing device may determine a first parameter of a first dimension within the pattern and a second parameter of a second dimension outside of the pattern. A combined set may be generated based on the first parameter and the second parameter. A defect associated with the modified portion may be classified based on the combined set.
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28.
公开(公告)号:US11321633B2
公开(公告)日:2022-05-03
申请号:US16228676
申请日:2018-12-20
Applicant: Applied Materials Israel Ltd.
Inventor: Assaf Asbag , Boaz Cohen , Shiran Gan-Or
Abstract: There are provided a classifier and method of classifying defects in a semiconductor specimen. The method comprises receiving defects classified into a majority class, each having values for plurality of attributes, some defects belonging to a minority class, and some to the majority; selecting an attribute subset and defining differentiators for attributes wherein a second classifier using the subset and differentiators classifies correctly to minority and majority classes at least part of the defects; generating a training set comprising: defects of the majority and minority classes, and additional defects which the second classifier classifies as minority; training, upon the training set, subset, and differentiators, an engine obtaining a confidence level that a defect belongs to the majority class; applying the engine to second defects classified to the majority class, to obtain a confidence level of classifying each defect to the majority class; and outputting defects having a low confidence level.
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公开(公告)号:US11276160B2
公开(公告)日:2022-03-15
申请号:US16652970
申请日:2018-10-01
Applicant: APPLIED MATERIALS ISRAEL LTD.
Inventor: Vadim Vereschagin , Roman Kris , Ishai Schwarzband , Boaz Cohen , Ariel Shkalim , Evgeny Bal
Abstract: A captured image of a pattern and a reference image of the pattern may be received. A contour of interest of the pattern may be identified. One or more measurements of a dimension of the pattern may be determined for each of the reference image and the captured image with respect to the contour of interest of the pattern. A defect associated with the contour of interest may be classified based on the determined one or more measurements of the dimension of the pattern for each of the reference image and the captured image.
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公开(公告)号:US10605745B2
公开(公告)日:2020-03-31
申请号:US16022566
申请日:2018-06-28
Applicant: Applied Materials Israel Ltd.
Inventor: Yotam Sofer , Boaz Cohen , Saar Shabtay , Eli Buchman
IPC: G01N21/95 , G01N21/956
Abstract: A candidate defect may be identified at a semiconductor wafer. A determination may be made as to whether the candidate defect at the semiconductor wafer corresponds to a systematic defect or a random defect. In response to determining that the candidate defect at the semiconductor wafer corresponds to a systematic detect, the candidate defect at the semiconductor wafer may be provided to a defect review tool for review by the defect review tool.
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